Volume 3-1124

November 2024
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This third volume of the Advanced Packaging Update includes an analysis of the economy and OSAT financials. Progress in hybrid bonding for a variety of applications is discussed. An updated analysis of panel fan-out is presented, including new players. Mobile RF front-end package trends are highlighted.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Growth Slows
        • 1.1.1 China's Economy
        • 1.1.2 U.S. Macroeconomic Trends
      • 1.2 Smartphone and PC Growth
        • 1.2.1 PC Shipments
        • 1.2.2 Smartphone Shipments
        • 1.2.3 AI Growth Continues to Drive Revenue
    • 2 OSAT Financial Analysis
      • 2.1 Market Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 UTAC
        • 2.3.7 Huatian
        • 2.3.8 KYEC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 Financial Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D
        • 2.4.3 CAPEX
      • 2.5 Outlook
    • 3 Hybrid Bonding Progress
      • 3.1 Applications
        • 3.1.1 Image Sensors
        • 3.1.2 NAND Flash
        • 3.1.3 Gaming, Computing, and AI
        • 3.1.4 Co-packaged Optics
        • 3.1.5 High Bandwidth Memory
      • 3.2 Pitch Scaling with Hybrid Bonding
      • 3.3 Hybrid Bonding Challenges
        • 3.3.1 Design and EDA Tools
          • 3.3.1.1 Thermal Design and Tradeoffs
          • 3.3.1.2 Timing Closure
        • 3.3.2 Manufacturing and Process Control
          • 3.3.2.1 CMP
          • 3.3.2.2 Thermal Process Sensitivity
          • 3.3.2.3 Metrology Needs
    • 4 Panel Processing
      • 4.1 Panel Applications
        • 4.1.1 Standard Density
        • 4.1.2 High-Density Panel
      • 4.2 Key Panel RDL Challenges
      • 4.3 Overcoming Panel Challenges
      • 4.4 Panel Production Lines
        • 4.4.1 ACCESS Semiconductor
        • 4.4.2 Amkor Technology
        • 4.4.3 AOI Electronics
        • 4.4.4 ASE
        • 4.4.5 China Wafer Level CSP
        • 4.4.6 CR Micro
        • 4.4.7 Deca
        • 4.4.8 Dai Nippon Printing
        • 4.4.9 ECHINT
        • 4.4.10 Innolux
        • 4.4.11 nepes
        • 4.4.12 PEP Innovation
        • 4.4.13 Phoenix Pioneer technology
        • 4.4.14 Powertech Technology
        • 4.4.15 Samsung
        • 4.4.16 Shinko Electric
        • 4.4.17 Silicon Box
        • 4.4.18 SiPlus
        • 4.4.19 Unimicron
      • 4.5 Panel Demand and Capacity
    • 5 Mobile RF FEM
      • 5.1 RF Front-End Designs
      • 5.2 RF Front-End Packages
      • 5.3 Future RF Front-End Designs
      • 5.4 Material Developments and Suppliers
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 4.1 Pillar-Suspended Bridge architecture.
    • 4.2 C2iM panel process flow.
    • 5.1 Structure of smartphone RF front-end.
    • 5.2 Double-sided FEM with conformal and compartmental shielding.
  • Tables…
    • 2.1 Top 20 OSATs Quarterly Revenue
    • 2.2 1H 2023 v. 1H 2024 Top 20 OSAT Revenue
    • 2.3 Year-to-Year Gross Margins for Top 10 OSATs
    • 2.4 R&D Spending for Top 10 OSATs
    • 2.5 CAPEX Spending for Top 10 OSATs
    • 3.1 W2W versus D2W
    • 4.1 Annual High-Density Panel Demand Forecast
    • 4.2 Annual High-Density HPC RDL Wafer Forecast
    • 4.3 Panel Activities
    • 4.4 PTI’s Panel Fan-Out WLP Options
    • 4.5 Annual Standard Density Panel Demand Forecast
    • 4.6 Annual Standard Density Panel Capacity
    • 5.1 RF Front-End Module and Component Counts
    • 5.2 4G and 5G Frequency Bands
    • 5.3 RF FEMs with EMI Shielding Comparisons
    • 5.4 Selected Material Suppliers

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  • Published November 2024
  • 61 pages
  • 5 figures / 16 tables
  • 77 PowerPoint slides
  • $8,750 corporate license (4 issues)
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