New Packages and Materials for Power Devices


Power devices are experiencing strong growth driven by demand in a variety of areas. Applications include energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, datacenters, industrial automation, smart cities and buildings, home appliances, and transportation. While many companies continue to expand production of silicon-based power devices, there is also demand for devices based on new wide band gap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN). Driven by the need for increased power density and system efficiency, these WBG materials are being adopted in many applications. The ramp of WBG devices will push operating temperatures to 200 ̊C and beyond, and require new materials and assembly processes. Market projections for leadframe (including Cu clip) and embedded die packages are provided. Critical needs for packaging and assembly are identified. New developments in die attach materials are described, with a focus on Pb-free options.

A set of PowerPoint slides is included with the detailed analysis.

  • Contents…
    • 1 Power Device Trends
      • 1.1 ​Wide band gap devices
        • 1.1.1 SiC power devices
        • 1.1.2 What's slowing SiC adoption?
        • 1.1.3 Gallium nitride power devices
        • 1.1.4 GaN power device issues
      • 1.2 Packaging developments and drivers
    • 2 Power Device Applications
      • 2.1 Automotive
        • 2.1.1 Inverter trends
        • 2.1.2 MOSFET trends
        • 2.1.3 Advanced packaging developments
      • 2.2 EV charging stations
      • 2.3 Transportation systems
      • 2.4 Computing and telecom
        • 2.4.1 Computing and telecommunications
        • 2.4.2 Datacenters
        • 2.4.3 Gaming systems and cryptocurrency
      • 2.5 Home appliances
      • 2.6 Industrial
      • 2.7 Energy generation and storage
    • 3 Package Developments
      • 3.1 Leadframe packages
        • 3.1.1 Leadframe package market forecast
        • 3.1.2 Traditional power modules
        • 3.1.3 Heterogeneous integration
        • 3.1.4 Company developments
          • ABB Semiconductors, EPC, Exagan, Fuji Electric, Infineon, Littelfuse, Mitsubishi Electric, NXP, ON Semiconductor, Renesas, ROHM, SEMIKRON, STMicroelectronics, TI, Toshiba, Wolfspeed/Cree
      • 3.2 Embedded die packages
        • ACCESS, ASE, AT&S, EmPower, GE, Infineon, NCAP, Schweizer Electronic, TI
      • 3.3 Thermal challenges and solutions
        • 3.3.1 Wafer cooling
        • 3.3.2 Double-sided cooling
      • 3.4 Thinning
      • 3.5 Singulation
        • 3.5.1 Mechanical blade
        • 3.5.2 Mechanical scribe and break
        • 3.5.3 Dicing before grinding
        • 3.5.4 Laser scribe and break
        • 3.5.5 Stealth dicing
        • 3.5.6 Full cut laser singulation
        • 3.5.7 Plasma dicing
        • 3.5.8 Singulation for power devices
      • 3.6 Assembly methods
        • 3.6.1 Wire bonding
        • 3.6.2 Cu clip
          • 3.6.2.1 Cu clip package applications
          • 3.6.2.2 Multi-die Cu clip packages
          • 3.6.2.3 Cu clip users and suppliers
          • 3.6.2.4 Cu clip market growth
    • ​4 Die Attach Material Developments
      • 4.1 Range of materials
        • 4.1.1 Transient liquid phase sintering
        • 4.1.2 Silver sintering pastes
          • 4.1.2.1 Hybrid Ag sintering pastes
          • 4.1.2.2 Nano-Ag sintering pastes
        • 4.1.3 Copper sintering pastes
      • 4.2 Performance considerations
        • 4.2.1 Die cracking
        • 4.2.2 Thermal conductivity and performance
      • 4.3 Advanced die attach materials
        • Alpha Advanced Materials, Bando Chemical, Dowa Electronics Materials, EMD Performance Materials, Engineered Materials Systems, Henkel Electronic Materials, Heraeus Electronics, Hitachi Chemical, Indium, Kyocera, Kuprion, Mitsui Mining & Smelting, Namics, Napra, Nihon Handa, Nihon Superior, Sekisui Chemical, Senju Metal Industry, Tanaka Denshi Kogyo
    • 5 Reliability Requirements
      • ​5.1 Packaging materials
    • Appendix (Power Device Assembly OSATs)
  • Figures…
    • Performance of Si vs. WBG semiconductors.
    • Powertrain components in an electric vehicle.
    • HybridPACK™ Drive IGBT module for inverter.
    • HEV/EV inverter trends.
    • All-SiC module vs. conventional Si-IGBT module.
    • Infineon's SiC power module.
    • GaN leadframe package.
    • a-EASI™ QFN (a) and a-EASI™ BGA (b) styles.
    • Transmission control unit with embedded die.
    • SiC module for PV application.
    • POL test module structure.
    • Infineon DrBlade with embedded die.
    • Exploded view of p2 Pack.
    • TI's MicroSIP.
    • Exploded view of p2 Pack.
    • FET package with Cu clip.
    • Thermal conductivity and thermal resistance.
    • Sekisui’s P-Fin comparison to DBC.
  • Tables (partial list)…
    • Growth Areas for Power Packages
    • Examples of Power Packages
    • Roadmap for Power Modules and Motor Control
    • Leadframe Power Package Growth Projections
    • Power and Frequency Ranges
    • Advantages of WBG for Powertrain
    • Electrical Properties of Si and WBG Materials
    • Advantages of WBG for Powertrain
    • Silicon vs. SiC
    • SiC Power Device Producers
    • SiC Adoption Examples
    • Silicon versus SiC 30kW Inverter BOM
    • GaN Power Device Producers
    • Infineon CoolGaN™ Applications
    • Powertrain High-Power Device Examples
    • Powertrain Device and Module Requirements
    • Powertrain Inverters and DC/DC Converters
    • Powertrain Packaging Technology
    • Power MOSFETs for Consumer Products
    • Selected Power Device Suppliers and Packages
    • Leadframe Characteristics and Trends
    • Leadframe Power Packages
    • Leadframe Packages for Wide Band Gap
    • Market for Embedded Die Power Packages
    • Reliability Tests for a-EASI™ P2 QFN Style
    • Reliability Tests for a-EASI™ P2 BGA Style
    • EmPower Demonstrators
    • Component List for Test Module
    • Increasing Output Power of a Powertrain Inverter
    • Double-Sided and Single-Sided Cooling
    • Singulation Trends for Power Devices
    • Equivalent Number of Wires to Ribbon Conversion
    • Examples of IDMs Offering Cu Clip Packages
    • OSATs with Cu Clip Attach Assembly Services
    • Market Growth for Cu Clip for Power Devices
    • Die Attach Paste Suppliers and Composition
    • Properties of Pb-free Solder Die Attach
Stacks Image 26136
  • Published November 2018
  • 110 pages
  • 18 figures / 46 tables
  • 106 PowerPoint slides
  • $5,100 single user
    $8,750 corporate license
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