Volume 3-1122

November 2022
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This second volume of the Advanced Packaging Update includes an analysis of OSAT financials, new high-performance package introductions, and trends in co- packaged optics. An updated analysis of the substrate capacity shortage is presented, along with an assessment of the financial health of the industry. TechSearch International’s annual survey on substrate design rules is presented, with special coverage of suppliers of laminate flip chip BGA and CSP substrates worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Growth Slows
        • 1.1.1 U.S. Macroeconomic Trends
        • 1.1.2 Russia-Ukraine War
        • 1.1.3 Covid Lockdowns
        • 1.1.4 U.S. Macroeconomic Trends
      • 1.2 Semiconductor Situation Reversal
      • 1.3 U.S. Export Controls
      • 1.4 Semiconductor Fab Expansion
      • 1.5 Smartphone Market Decline Continues
    • 2 OSAT Financial Analysis
      • 2.1 Market Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Powertech Technology
        • 2.3.5 Tongfu Microelectronics
        • 2.3.6 Huatian
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 Financial Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D
        • 2.4.3 CapEx
      • 2.5 Outlook
    • 3 Substrate Supply Analysis
      • 3.1 FC-BGA Supply and Demand
      • 3.2 North American Substrate Suppliers
        • 3.2.1 Absolics
        • 3.2.2 R&D Altanova
    • ​4 Thermal Challenges
      • 4.1 Mobile Products
      • 4.2 Laptops and Desktops
      • 4.3 Solid State Drives
      • ​4.4 High-Performance Computing
        • 4.4.1 Data Centers Energy Consumption and Cooling
        • 4.4.2 Thermal Challenges and Solutions
      • 4.5 Telecommunications and IoT
      • 4.6 Burn-In and Test
      • 4.7 Boards
      • 4.8 Quality and Reliability
      • 4.9 Thermal Design
      • 4.10 Thermal Interface Material Developments
        • 4.10.1 Grease, Gels, Tapes, Sheets, and Pads
        • 4.10.2 Solder or Metal TIM
        • 4.10.3 Graphite Sheet
        • 4.10.4 Gap Fillers
        • 4.10.5 Heat Spreaders, Heatsinks, and Heat Pipes
        • 4.10.6 Heat Transfer Fluids
    • ​5 Electric Vehicle Charging
      • 5.1 EV Market and Charging
      • 5.2 Charging Network Providers
        • 5.2.1 Allegro
        • 5.2.2 Blink
        • 5.2.3 Charge Point
        • 5.2.4 EVGo
        • 5.2.5 EV Safe Charge
        • 5.2.6 Electrify America
        • 5.2.7 EV Connect
        • 5.2.8 Greenlots
        • 5.2.9 Pod Point
        • 5.2.10 Shell Recharge
        • 5.2.11 ShemaConnect
        • 5.2.12 Star Charge
        • 5.2.13 State Grid
        • 5.2.14 TELD New Energy
        • 5.2.15 Volta
        • 5.2.16 Yunkai
      • 5.3 Charging Equipment Suppliers
        • 5.3.1 ABB
        • 5.3.2 BorgWarner
        • 5.3.3 Bosch
        • 5.3.4 BTC Power
        • 5.3.5 Chargemaster
        • 5.3.6 ChargePoint
        • 5.3.7 DBT Charging
        • 5.3.8 Eaton
        • 5.3.9 Efacec
        • 5.3.10 EV Box
        • 5.3.11 FLO
        • 5.3.12 Freewire Technologies
        • 5.3.13 Leviton Manufacturing
        • 5.3.14 SK Signet
        • 5.3.15 State Grid
        • 5.3.16 Star Charge
        • 5.3.17 Tesla
        • 5.3.18 Tritrium
        • 5.3.19 Webasto Charging Systems
      • 5.4 EV Charger Standards
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Glass substrate for heterogeneous integration.
    • 4.1 Birentech BR100 with tower-type passive cooler.
    • 4.2 Different boiler designs on thermal test vehicle (TTV) packages.
    • 4.3 Array of pillars and walls attached to an active die.
    • 4.4 Single pillar attached to two active dies.
    • 4.5 Design concept of ICE package prototype.
    • 4.6 Top view of fan-less AIoT smart edge gateway.
    • 4.7 Edge server outdoor architecture.
  • Tables…
    • 1.1 Market Projections for AI Accelerators
    • 1.2 HBM Market Projections
    • 1.3 HBM3 vs. HBM2E DRAM Comparison
    • 2.1 Top 20 OSATs Quarterly Revenue
    • 2.2 1H 2021 v. 1H 2022 Top 20 OSAT Revenue
    • 2.3 Historical Gross Margins for Top 10 OSATs
    • 3.1 FC-BGA Substrate Supply and Demand
    • 3.2 HPC High Layer Count Build-up Substrate Demand
    • 3.3 R&D Altanova Build-up Substrate Design Rules
    • 4.1 Power Dissipation Trends for High-Performance Devices
    • 4.2 Comparison of the Carbon Footprint of Two Data Centers
    • 4.3 Thermal Simulation Conditions for Maximum Junction Temperature Analysis
    • 4.4 Difference of Theta JA with TIM Coverage
    • 4.5 Thermal Interface Material Manufacturers
    • 4.6 Amkor’s TIM Study Test Vehicle
    • 4.7 Properties of Indium Alloy TIMs
    • 4.8 Common Substance with Compatibility Risk
    • 4.9 Environmental, Occupational Safety, and Thermodynamic Properties
    • 5.1 Charging Network Companies
    • 5.2 Charging Equipment Suppliers
    • 5.3 IEC Standards Associated with EV and EV Charging
    • 5.4 Connector Types and Typical Charging Times
    • 5.5 Network Charging Communication Protocols
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  • Published November 2022
  • 72 pages
  • 9 figures / 23 tables
  • 53 PowerPoint slides
  • $8,750 corporate license (4 issues)
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