TechSearch president and founder, Jan Vardaman, is an author for 3D InCites. She contributes to the website's popular blogs, including From Different Dimensions.
No longer can the industry count on monolithic integration to achieve the economic gains of the previous era.
A summary of Dr. Douglas Yu's (TSMC) keynote presentation at the IMAPS Device Packaging Conference 2020.
Adoption of 3D ICs allowed the elimination of the "Memory Wall" using a new memory architecture and through silicon via (TSV) technology.