Reports priced individually. Contact us to order or get more information.
Total Process Solution Study Group (TPSS) was started in mid-2003 by engineers in Japan involved in the assembly and Jisso technology for advanced portable equipment such as cellular phones and digital still cameras. Today, TPSS provides technology and detailed teardowns of smartphones, tablets, wearables, game consoles, drones, and more. The analysis is provided electronically as a PowerPoint presentation. The reports are marketed by TechSearch International, Inc.
The reports typically contain details such as:
Photographs of circuit boards and components
Component information such as vendor, type of package, size, lead count, pitch
X-ray images of packages
Detailed analysis of displays and camera modules
Printed circuit board (PCB) construction information
Contact us to discuss the content of these reports or to see a sample.
Recent teardowns:
April-June 2022
Apple iPhone 13 Pro, >67 packages (PoP, FBGAs, FLGAs, CLGAs, SiPs, DFNs, WLPs, FO-WLPs), includes camera module details, $280 (50 slides).
Samsung Galaxy S22 Ultra, SM-908U, >50 packages (PoP, FBGAs, FLGAs, CLGAs, FO-WLPs, WLPs,) including details of vapor chamber, graphite sheets, display, sub-boards, camera module, FPC, and AiP details, $400 (98 slides).
HP USI active stylus pen Model: 8NN78AA-AAA, 6 packages (LGA, DFNs, QFN, WLP), $180 (12 slides).
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.