Volume 3-1023

October 2023
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This third volume of the Advanced Packaging Update includes an analysis of the economy and OSAT financials. Developments in co-packaged optics are discussed. An updated analysis of panel fan-out is presented, including new players. A special section examines MicroLEDs, discussing applications and players. A status report on PFAS elimination is provided.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Growth Slows
        • 1.1.1 China's Economy
        • 1.1.3 U.S. Macroeconomic Trends
      • 1.2 Smartphone and PC Growth
        • 1.2.1 PC Shipments Decline
        • 1.2.2 Smartphone Shipments Decline
          • 1.2.2.1 Apple's Smartphone Growth
          • 1.2.2.2 Huawei's Mate 60 Pro
    • 2 OSAT Financial Analysis
      • 2.1 Market Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Huatian
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 Chipbond
        • 2.3.10 ChipMOS
      • 2.4 Financial Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D
        • 2.4.3 CAPEX
      • 2.5 Outlook
    • 3 CPO Developments
      • 3.1 Ayar Labs
      • 3.2 Broadcom
      • 3.3 Cisco
      • 3.4 Infinera
      • 3.5 Intel
      • 3.6 Marvell
      • 3.7 OpenLight Photonics
      • 3.8 SCINTIL Photonics
      • 3.9 TSMC
      • 3.10 OSATs
        • 3.10.1 Amkor Technology
        • 3.10.2 ASE
        • 3.10.3 IBM Bromont
        • 3.10.4 SPIL
      • 3.11 Research Organizations
        • 3.11.1 AIM Photonics
        • 3.11.2 CEA-Leti
        • 3.11.3 Fraunhofer IZM
        • 3.11.4 IME
        • 3.11.5 NTT
        • 3.11.6 Tyndall National Institute
    • ​4 MicroLEDs
      • 4.1 MicroLED Developments
        • 4.1.1 Applied Materials
        • 4.1.2 Avicena
        • 4.1.3 Infineon and Nichia
        • 4.1.4 Innovation Semiconductor
        • 4.1.5 Jade Bird Display
        • 4.1.6 Micledi
        • 4.1.7 Mojo Vision
        • 4.1.8 PlayNitride
        • 4.1.9 Porotech
        • 4.1.10 Scrona
        • 4.1.11 Terecircuits
        • 4.1.12 Uniqarta
    • ​5 Panel Fan-Out
      • 5.1 Advantages for Panel FO
      • 5.2 Challenges for Panel FO
      • 5.3 Overcoming Challenges for Panel FO
      • 5.4 Panel Production Lines
        • 5.4.1 Amkor Technology
        • 5.4.2 AOI Electronics
        • 5.4.3 ASE Group
        • 5.4.4 China Wafer Level CSP
        • 5.4.5 ECHINT
        • 5.4.6 Innolux
        • 5.4.7 nepes
        • 5.4.8 PEP Innovation
        • 5.4.9 Powertech Technology
        • 5.4.10 Samsung
        • 5.4.11 Unimicron
      • 5.5 FO Panel Demand and Capacity
    • 6 PFAS Elimination
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 ASIC and SCIP CoW assembly.
    • 3.2 Broadcom's detachable optical connector.
    • 3.3 Silicon photonics optical interposer with edge coupler platform.
    • 3.4 Edge laser vs. embedded laser structure.
    • 3.5 CEA-Leti’s Optical Network on Chip system.
    • 3.6 FOWLP for EIC and PIC packaging.
    • 4.1 MicroLED application spaces and technologies.
    • 4.2 Co-packaged optics with microLEDs.
    • 4.3 Nichia’s μPLS fully integrated microLED light engine.
    • 4.4 Monolithic vertical architecture.
    • 5.1 Amkor panel process.
  • Tables…
    • 1.1 Huawei’s Packages by Supplier Location
    • 2.1 Top 20 OSATs Quarterly Revenue
    • 2.2 1H 2022 v. 1H 2023 Top 20 OSAT Revenue
    • 2.3 Historical Gross Margins for Top 10 OSATs
    • 2.4 R&D Spending for Top 10 OSATs
    • 2.5 CAPEX Spending for Top 10 OSATs
    • 4.1 Comparison of Different Display Technologies
    • 4.2 MicroLED Association Members
    • 5.1 FO-WLP Panel Activities
    • 5.2 Annual Panel Demand Forecast
    • 5.3 Annual Panel Capacity
    • 6.1 SIA White Papers on PFAS
    • 6.2 Government Organizations Working on PFAS Issues
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  • Published October 2023
  • 62 pages
  • 12 figures / 13 tables
  • 69 PowerPoint slides
  • $8,750 corporate license (4 issues)
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