Volume 1-0525

May 2025
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This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. The market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) is provided in units. Package examples and demand drivers are provided. An update on the capacity and demand for build-up substrates is provided. The impact of demand for large-body, high-density substrates and the potential for future shortages is discussed. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Estimates of the market for each package type are based on input from both captive and merchant assembly operations.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Industry
        • 1.2.1 Impact of Tariffs and Trade Friction
        • 1.2.2 End-Product Growth
        • 1.2.3 Government Funding for Semiconductors
          • 1.2.3.1 U.S. Government Funding
          • 1.2.3.2 Global Funding Activities
    • ​​2 OSAT Financial Analysis
      • 2.1 Market Overview
      • ​2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Technology Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Tianshui Huatian Technology
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 TSMC Growth Trends
      • 2.6 Outlook
    • 3 BGA Applications and Markets
      • 3.1 Major Applications for BGA Packages
        • 3.1.1 Personal Computers
        • 3.1.2 GPUs and Gaming CPUs
        • 3.1.3 Telecommunications
        • 3.1.4 Satellites
        • 3.1.5 Automotive
        • 3.1.6 Server CPUs
        • 3.1.7 AI Training and Inferencing
          • 3.1.7.1 Silicon Interposers
          • 3.1.7.2 Intel's EMIB
          • 3.1.7.3 RDL Interposers
          • 3.1.7.4 Wafer Scale Integration
          • 3.1.7.5 Network Switch and Co-Packaged Optics
      • ​3.2 Advanced Packaging Challenges
        • 3.2.1 Routing HBM4
        • 3.2.2 Power Delivery
        • 3.2.3 New Thermal Materials
      • 3.3 BGA Market Projections
      • 3.4 Build-up Substrate Supply and Demand
        • 3.4.1 Demand Drivers for Build-up Substrates
        • 3.4.2 Build-up Capacity Adjustments
        • 3.4.3 Supply and Demand Analysis
        • 3.4.4 Substrate Industry Revenue Declines
    • ​4 CSP Applications and Markets
      • 4.1 Smartphones
        • 4.1.1 Apple iPhone 16 Pro Max
        • 4.1.2 Apple iPhone 16e
        • 4.1.3 Samsung Galaxy S25 Ultra
        • 4.1.4 Samsung Galaxy A35 5G and Galaxy A15 5G
        • 4.1.5 Xiaomi 14
        • 4.1.6 Motorola Moto G 5G
      • 4.2 Tablets and Laptops
      • ​4.3 Wearables
        • 4.3.1 Galaxy Watch6 (Wi-Fi + LTE)
        • 4.3.2 Honor Watch 4 with LTE
        • 4.3.3 Apple AirPods 4
      • 4.4 Game Consoles
      • 4.5 Consumer Satellite
      • 4.6 Package Trends
        • 4.6.1 WLPs
          • 4.6.1.1 Fan-in WLPs
          • 4.6.1.2 Fan-out WLPs
          • 4.6.1.3 Molded WLPs
          • 4.6.1.4 WLPs with Non-Standard Ball Pitch
        • 4.6.2 QFNs
        • 4.6.3 Laminate CSPs
          • 4.6.3.1 FBGAs
          • 4.6.3.2 FLGAs
          • 4.6.3.3 Double-Sided FBGAs
        • 4.6.4 Stacked Die CSPs
        • 4.6.5 PoP Developments
      • 4.7 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Broadcom 3.5D XDSiP™.
    • 3.2 TSMC SoW-X™.
    • 4.1 Apple's A17 in TSMC's InFO PoP.
  • Tables…
    • 1.1 End-Product Growth
    • 2.1 Top 20 Publicly Traded OSATs Quarterly Revenue
    • 2.2 Revenue of Top 20 Publicly Traded OSATs
    • 2.3 Gross Margin for Top 10 OSATs
    • 2.4 R&D Spending for Top 10 OSATs
    • 2.5 CAPEX for Top 10 OSATs
    • 2.6 TSMC Revenue and CAPEX
    • 3.1 Laptop and Desktop CPU Packages
    • 3.2 GPU and Gaming Processor Packages
    • 3.3 Server CPU Packages
    • 3.4 AI Packages
    • 3.5 H100 vs. H20 Comparison
    • 3.6 PBGA/LGA Market Projections
    • 3.7 Build-up Substrate Supply and Demand
    • 4.1 CSPs in Apple iPhone 16 Pro Max
    • 4.2 iPhone 15 Pro Max and iPhone 16 Pro Max CSP Comparison
    • 4.3 Select CSPs in iPhone 16 Pro Max
    • 4.4 CSP on Main Boards of iPhone 16 Pro and 16e
    • 4.5 Modem, Transceiver, and Baseband PMIC Chips Comparison
    • 4.6 CSPs in Samsung Galaxy S25 Ultra
    • 4.7 Galaxy S24 Ultra and S25 Ultra CSP Comparison
    • 4.8 Select CSP in Galaxy S25 Ultra
    • 4.9 CSP in Samsung Galaxy A35 5G
    • 4.10 CSP in Samsung Galaxy A15 5G
    • 4.11 Galaxy A15, A35, and S24 Ultra CSP Comparison
    • 4.12 CSPs in Xiaomi 14
    • 4.13 Xiaomi 14 and 12 CSP Comparison
    • 4.14 Select CSPs in Xiaomi 14
    • 4.15 CSPs in 2024 Motorola Moto G 5G
    • 4.16 Select CSPs in Motorola Moto 5G
    • 4.17 CSPs in Samsung Galaxy Watch6
    • 4.18 Galaxy Watch6 and Galaxy Watch5 Comparison
    • 4.19 Select CSPs in Galaxy Watch6
    • 4.20 CSPs in Honor Watch 4
    • 4.21 Select CSPs in Honor Watch 4
    • 4.22 CSPs in Apple AirPods 4
    • 4.23 Select CSPs in Apple AirPods 4
    • 4.24 CSPs in Sony PlayStation 5 Slim
    • 4.25 CSPs in SpaceX Starlink Mini
    • 4.26 Select CSPs in SpaceX Starlink Mini
    • 4.27 WLPs in Production
    • 4.28 FO-WLP Examples
    • 4.29 Molded FO-WLPs with Edge Protection
    • 4.30 WLPs with Non-Standard Ball Pitch
    • 4.31 QFN Examples 
    • 4.32 SON/DFN Examples
    • 4.33 FBGA Examples
    • 4.34 FLGA Examples
    • 4.35 Double-Sided FBGA Examples
    • 4.36 Stacked Die CSP Examples
    • 4.37 PoP Examples
    • 4.38 CSP Market Projections
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  • Published May 2025
  • 97 pages
  • 4 figures / 52 tables
  • 79 PowerPoint slides
  • $8,750 corporate license (4 issues)
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