Volume 1-0426

April 2026
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This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. The market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) is provided in units. Package examples and demand drivers are provided. Packages used in data centers are highlighted. An update on the capacity and demand for build-up substrates is provided. The impact of demand for and shortages of large-body, high-density substrates is discussed. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Estimates of the market for each package type are based on input from both captive and merchant assembly operations.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Middle East Conflict
      • 1.3 Semiconductor Industry
        • 1.3.1 Data Centers Drive Growth
        • 1.3.2 End-Product Growth
    • 2 OSAT Financial Analysis
      • 2.1 Market Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Technology Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Tianshui Huatian Technology
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 Hana Micron
        • 2.3.10 ChipMOS
      • 2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 TSMC Growth Trends
      • 2.6 Outlook
    • 3 BGA Applications and Markets
      • 3.1 BGA Package Applications
        • 3.1.1 AI Training and Inferencing
          • 3.1.1.1 Shift from Silicon to RDL Interposers
          • 3.1.1.2 Wafer Scale Integration
          • 3.1.1.3 Intel’s EMIB
        • 3.1.2 Server CPUs and XPUs
        • 3.1.3 High-end Network Switch
        • 3.1.4 Personal Computers
        • 3.1.5 GPUs and Gaming CPUs
        • 3.1.6 Telecommunications
        • 3.1.7 Satellites
        • 3.1.8 Humanoid Robots
        • 3.1.9 Aerospace and Defense
        • 3.1.10 Automotive
      • 3.2 BGA Market Projections
      • 3.3 Build-up Substrate Supply and Demand
        • 3.3.1 Demand Drivers for Build-up Substrates
        • 3.3.2 Build-up Capacity Adjustments
        • 3.3.3 Supply and Demand Analysis
        • 3.3.4 Core Material Shortages and Alternatives
          • 3.3.4.1 Glass and Alternatives
    • 4 CSP Applications and Markets
      • 4.1 Smartphones
        • 4.1.1 Apple iPhone 17 Pro Max
        • 4.1.2 Apple iPhone Air
        • 4.1.3 Google Pixel 10 Pro
        • 4.1.4 Samsung Galaxy S26 Ultra
      • 4.2 Tablets and Laptops
      • 4.3 Wearables
        • 4.3.1 Galaxy Watch7 (Wi-Fi + LTE)
        • 4.3.2 Apple Watch Series 10 (GPS + Cellular)
        • 4.3.3 Smart Wireless Earbuds
        • 4.3.4 Meta Quest 3S VR Headset
      • 4.4 Consumer Tracking Devices
        • 4.4.1 Apple AirTag
      • 4.5 Game Console
        • 4.5.1 Nintendo Switch 2
      • 4.6 Consumer Drones
        • 4.6.1 DJI Neo
      • 4.7 Automotive
      • 4.8 Package Trends
        • 4.8.1 WLPs
          • 4.8.1.1 Fan-in WLPs
          • 4.8.1.2 Fan-out WLPs
          • 4.8.1.3 Molded WLPs
          • 4.8.1.4 WLPs with Non-Standard Ball Pitch
        • 4.8.2 QFNs
          • 4.8.2.1 Cu Clip QFN
        • 4.8.3 Molded Interconnect Substrates
        • 4.8.4 Laminate CSPs
          • 4.8.4.1 FBGAs
          • 4.8.4.2 Double-Sided FBGAs
          • 4.8.4.3 FLGAs
        • 4.8.5 Stacked Die CSPs
        • 4.8.6 PoP Trends
      • 4.9 CSP Market Projections
    • References
  • Figures…
    • 4.1 Vertical wire bond for 16-high NAND Flash.
    • 4.2 Samsung Heat Block Patch.
  • Tables…
    • 1.1 Nvidia GB200 NVL72 Rack Major Packages
    • 1.2 End-Product Growth
    • 2.1 Quarterly Revenue of Top 20 Publicly Traded OSATs
    • 2.2 Annual Revenue of Top 20 Publicly Traded OSATs
    • 2.3 Gross Margin for Top 10 OSATs
    • 2.4 R&D Spending for Top 10 OSATs
    • 2.5 CAPEX for Top 10 OSATs
    • 2.6 TSMC Revenue and CAPEX
    • 3.1 AI Packages
    • 3.2 Server CPU Packages
    • 3.3 XPU Packages
    • 3.4 Network Switch Packages
    • 3.5 Laptop and Desktop CPU Packages
    • 3.6 GPU Gaming and Game Console Processor Packages
    • 3.7 PBGA/LGA Market Projections
    • 3.8 Build-up Substrate Supply and Demand
    • 4.1 CSPs in Apple iPhone 17 Pro Max
    • 4.2 iPhone 16 Pro Max and iPhone Pro Max CSP Comparison
    • 4.3 Select CSPs in iPhone 17 Pro Max
    • 4.4 CSPs in iPhone Air and iPhone 17 Pro Max
    • 4.5 Modem, Transceiver, and Baseband PMIC Chips Comparison
    • 4.6 CSPs in Google Pixel 10 Pro
    • 4.7 Pixel 8 Pro and Pixel 10 Pro CSP Comparison
    • 4.8 Select CSPs in Google Pixel 10 Pro
    • 4.9 CSPs in Samsung Galaxy S26 Ultra
    • 4.10 Galaxy S25 Ultra and S26 Ultra CSP Comparison
    • 4.11 CSPs in Samsung Galaxy Watch7
    • 4.12 Galaxy Watch6 and Galaxy Watch7 CSP Comparison
    • 4.13 Select CSPs in Samsung Galaxy Watch7
    • 4.14 CSPs in Apple Watch Series 10
    • 4.15 Apple Watch 8 and Apple Watch 10 CSP Comparison
    • 4.16 Select CSPs in Apple Watch Series 10
    • 4.17 Select CSPs in Meta Quest 3S
    • 4.18 CSPs in Apple AirTag
    • 4.19 Select CSPs in Apple AirTag
    • 4.20 CSPs in Nintendo Switch 2
    • 4.21 Select CSPs in Nintendo Switch 2
    • 4.22 CSPs in DJI Neo
    • 4.39 CSP Market Projections
    • 4.23 Select CSPs in DJI Neo
    • 4.24 WLPs in Production
    • 4.25 FO-WLPs in Production
    • 4.26 Molded FO-WLPs with Edge Protection
    • 4.27 WLPs with Non-Standard Ball Pitch
    • 4.28 QFN Examples
    • 4.29 SON and DFN Examples
    • 4.30 Cu Clip QFN/SON/DFN Examples
    • 4.31 QFN Cu Clip Projections
    • 4.32 MIS Package Examples
    • 4.33 MIS Package Market Forecast
    • 4.34 FBGA Examples
    • 4.35 Double-Sided FBGAs
    • 4.36 FLGA Examples
    • 4.37 Stacked Die CSPs
    • 4.38 PoP Examples

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  • Published April 2026
  • 93 pages
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  • 82 PowerPoint slides
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