Volume 1-0523

May 2023
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This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. A special section examines the adoption of SiC and GaN, packaging trends, and OSAT activities. The market forecast for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) is provided in units. Package examples and demand drivers are provided. An update on the build-up substrate market is provided. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Estimates of the market for each package type are based on input from captive and from merchant assembly operations. An update on substrate supply and demand is provided.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Industry
      • 1.3 Global Semiconductor Industry Support
        • 1.3.1 Europe
        • 1.3.2 Japan
          • 1.3.2.1 Rapidus
          • 1.3.2.2 Chiplet Consortium
    • ​​2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Technology Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Powertech Technology
        • 2.3.5 Tongfu Microelectronics
        • 2.3.6 Tianshui Huatian Technology
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 Outlook
    • 3 SiC and GaN Packaging
      • 3.1 SiC Power Devices
        • 3.1.1 SiC Applications
        • 3.1.2 SiC Production
        • 3.1.3 SiC Packages
      • 3.2 Gallium Nitride Power Devices
        • 3.2.1 Fast Charging
        • 3.2.2 Charging for Automotive
        • 3.2.3 5G
        • 3.2.4 Uninterruptible Power Supplies
        • 3.2.5 GaN Wafer Production
      • 3.3 GaN and SiC Packaging
        • 3.3.1 Embedded Die
        • 3.3.2 OSATs
        • 3.3.3 Challenges with WBG
          • 3.3.3.1 Singulation
          • 3.3.3.2 Die Attach
    • ​​4 BGA Applications and Markets
      • 4.1 Major Applications for BGA Packages
        • 4.1.1 Personal Computers
        • 4.1.2 Servers and AI
        • 4.1.3 GPUs and Gaming CPUs
        • 4.1.4 5G Infrastructure
        • 4.1.5 Satellites
        • 4.1.6 Automotive
      • 4.2 BGA Market Projections
      • 4.3 FC-BGA Supply and Demand
    • 5 CSP Applications and Markets
      • 5.1 Smartphones
        • 5.1.1 Apple iPhone 14 Pro
        • 5.1.2 Samsung Galaxy S22 Ultra
        • 5.1.3 Samsung A53 5G
        • 5.1.4 Google Pixel 7 Pro
        • 5.1.5 Xiaomi 12
      • 5.2 Tablets and Laptops
        • 5.2.1 Oppo Pad Air
        • 5.2.2 Lenovo Yoga Tab 11 with Precision Pen 2
      • 5.3 Wearables
        • 5.3.1 Galaxy Watch5 (Wi-Fi + LTE)
        • 5.3.2 Xiaomi Mi Band 7
        • 5.3.3 Honor Earbuds 3 Pro
      • 5.4 Automotive
      • 5.5 Package Trends
        • 5.5.1 WLPs
          • 5.5.1.1 Fan-in WLPs
          • 5.5.1.2 Fan-out WLPs
          • 5.5.1.3 Molded WLPs
        • 5.5.2 QFNs
          • 5.5.2.1 Cu Clip QFN
        • 5.5.3 Molded Interconnect Substrates
        • 5.5.4 Laminate CSPs
          • 5.5.4.1 FBGAs
          • 5.5.4.2 FLGAs
          • 5.5.4.3 Double-Sided FBGAs
        • 5.5.5 Stacked Die CSPs
        • 5.5.6 PoP Developments
      • 5.6 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 1.2 Die-to-die interconnect with 20μm-thick bridge.
    • 1.3 Pillar-Suspended Bridge.
    • 3.1 Shinko Electric POL.
    • 5.1 Apple application processor in TSMC’s InFO.
    • 5.2 Google Pixel application processor in Samsung’s PLP.
  • Tables…
    • 1.1 End Product Growth
    • 2.1 Revenue of Top 20 Publicly Traded OSATs
    • 2.2 Impact of Local Currency to USD Conversion
    • 2.3 Gross Margin for Top 10 OSATs
    • 2.4 Annual Gross Margin for Top 10 OSATs
    • 2.5 R&D Spending for Top 10 OSATs
    • 2.6 CAPEX for Top 10 OSATs
    • 2.7 Top Four OSAT CAPEX Trends
    • 2.8 TSMC Revenue and CAPEX
    • 2.9 New Ranking for Top 20 Publicly Traded OSATs
    • 3.1 Silicon vs. SiC
    • 3.2 SiC Power Device Fabs and Device Makers
    • 3.3 GaN Transistor Package Examples
    • 3.4 Select GaN Power Device Producers
    • 3.5 Leadframe Packages for WBG
    • 3.6 Infineon CoolGaN™ Package Options
    • 3.7 OSAT Package Offerings for GaN and SiC
    • 4.1 Laptop and Desktop CPU Packages
    • 4.2 Server CPU Packages
    • 4.3 AI Package Examples
    • 4.4 TSMC Roadmap CoWoS Options
    • 4.5 GPU and Gaming Processor Packages
    • 4.6 PBGA/LGA Market Projections
    • 4.7 FC-BGA Substrate Supply and Demand
    • 5.1 Apple iPhone 14 Pro CSPs
    • 5.2 CSP Comparison Between iPhone 13 Pro and iPhone 14 Pro
    • 5.3 Select CSPs in iPhone 14 Pro
    • 5.4 Samsung Galaxy S22 Ultra CSPs
    • 5.5 Galaxy S21 Ultra and S22 Ultra CSP Comparison
    • 5.6 Samsung Galaxy A53 5G CSPs
    • 5.7 Select CSPs in Galaxy A53 5G
    • 5.8 Google Pixel 7 Pro CSPs
    • 5.9 Select CSPs in Google Pixel 7 Pro
    • 5.10 Xiaomi 12 CSPs
    • 5.11 CSP Comparison Between Xiaomi 11 and Xiaomi 12
    • 5.12 Select CSPs in Xiaomi 12
    • 5.13 Select CSPs in Oppo Pad Air
    • 5.14 Select CSPs in Lenovo Yoga Tab 11
    • 5.15 Galaxy Watch5 (Wi-Fi + LTE) CSPs
    • 5.16 Select CSPs in Galaxy Watch5 (Wi-Fi + LTE)
    • 5.17 Select CSPs in Xiaomi Mi Band 7
    • 5.18 Select CSPs in Honor Earbuds 3 Pro
    • 5.19 WLPs in Production
    • 5.20 FO-WLP Examples
    • 5.21 Molded FO-WLPs with Edge Protection
    • 5.22 QFN Examples
    • 5.23 SON/DFN Examples
    • 5.24 Cu Clip QFN/SON/DFN Examples
    • 5.25 QFN Cu Clip Projections
    • 5.26 MIS Package Examples
    • 5.27 Market Growth for MIS Packages
    • 5.28 FBGA Examples
    • 5.29 FLGA Examples
    • 5.30 Double-Sided FBGA Examples
    • 5.31 Stacked Die CSP Examples
    • 5.32 PoP Examples
    • 5.33 CSP Market Projections
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  • Published May 2023
  • 100 pages
  • 6 figures / 57 tables
  • 85 PowerPoint slides
  • $8,750 corporate license (4 issues)
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