This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. A special section examines the adoption of SiC and GaN, packaging trends, and OSAT activities. The market forecast for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) is provided in units. Package examples and demand drivers are provided. An update on the build-up substrate market is provided. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Estimates of the market for each package type are based on input from captive and from merchant assembly operations. An update on substrate supply and demand is provided.