Technology Licensing Services

Our technology licensing activities are focused in the area of semiconductor packaging and assembly. Assistance is provided in technology valuation, background on industry licensing fee structures, and location of specific technologies.

Examples of technologies introduced for licensing include:

  • NTT’s copper polyimide thin film substrate technology from Japan to the United States
  • Matsushita’s TBTAB technology
  • Aptos gold bumping technology from the United States to Taiwan
  • Tessera’s µBGA technology from the United States to Korea
  • Flip chip assembly and solder bumping technology
  • 3D Plus stacking technology
  • Beltronics inspection technology from the United States to Japan
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States
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