Volume 4-0120

January 2020
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This issue of the Advanced Packaging Update features special coverage of large area panel fan-out wafer level packaging (FO-WLP) developments. It also discusses options for high-performance packaging, including silicon interposers, fan-out on substrate, and other alternatives. A special section examines developments in electro-magnetic interference (EMI) shielding. Huawei’s new 5G smartphone is examined and domestic China content is listed. Outsourced semiconductor assembly and test (OSAT) financials through the third quarter are analyzed.
  • Contents…
    • 1 Industry and Economic Trends
      • ​1.1 Macroeconomic Trends
      • 1.2 Trade Tensions Continue
        • 1.2.1 U.S. and China Conflict
        • 1.2.2 Huawei’s Smartphones
          • 1.2.2.1 Packages in Mate 30 5G
          • 1.2.2.2 Comparison with Mate 20X 5G
        • 1.2.3 Japan and South Korea Conflict
      • 1.3 Semiconductor Sector
    • ​2 OSAT Financial Analysis
      • 2.1 Definitions
      • 2.2 OSAT Market Performance
      • 2.3 Outlook
    • 3 Fan-Out Panel Developments
      • 3.1 Panel Drivers
      • 3.2 Panel Applications
        • 3.2.1 Application Processor and PMIC
        • 3.2.2 Image Sensor
        • 3.2.3 Memory
        • 3.2.4 Antenna-in-Package for 5G
      • ​​3.3 Challenges for Panel Production
      • 3.4 Company Activities
        • 3.4.1 Amkor Technology
        • 3.4.2 ASE Group
        • 3.4.3 China Wafer Level CSP
        • 3.4.4 Nepes
        • 3.4.5 PowerTech Technology
        • 3.4.6 Samsung
        • 3.4.7 Unimicron
      • 3.5 Research Consortia
        • 3.5.1 ASM Pacific’s FOP-WLP Consortium
        • 3.5.2 Fraunhofer IZM
        • 3.5.3 IME A*STAR
        • 3.5.4 iNEMI
        • 3.5.5 JOINT Consortium
        • 3.5.6 NCAP
      • 3.6 FO Panel Capacity and Market Forecast
    • 4 High-Performance Package Trends
      • 4.1 Package Trade-offs
        • 4.1.1 Amkor Technology
        • 4.1.2 ASE
        • 4.1.3 TSMC’s High-Density Options
        • 4.1.4 TSMC’s Organic RDL Interposer
        • 4.1.5 High-Density FO and Si Interposer Forecast
    • ​5 EMI Shielding
      • 5.1 EMI Shielding in Smartphones
    • 2019 BGA and CSP Bibliography
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 2.1 Cumulative quarterly revenue for top 20 OSATs.
    • 3.1 Mold-first FOPLP process flows.
    • 3.2 Samsung's smartwatch module.
    • 3.3 FO-WLP for image sensor.
    • 4.1 Polyimide stress contours of the RDL below logic and HBM gap.
    • 4.2 Normalized polyimide stress on RDLs.
  • Tables…
    • 1.1 Mate 30 5G Package Types
    • 1.2 Mate 30 5G Package Examples
    • 1.3 Mate 20X 5G and Mate 30 5G Comparison
    • 3.1 Panel Economics Depends on Package Size
    • 3.2 Samsung Galaxy Watch Module Measurements
    • 3.3 FO-WLP Panel Activities
    • 3.4 RDL Interposer Panel Activities
    • 3.5 PTI's Panel Fan-Out WLP Options
    • 3.6 FO-WLP Panel Consortia
    • 3.7 Forecast for Low-Density Panel Demand
    • 3.8 Estimated Annual Low-Density Panel Capacity
    • 4.1 High-Density Package Performance Metrics
    • 4.2 3D SoIC for Logic + Memory Integration
    • 4.3 Market Projections for Si Interposer and HPC HD FO
    • 5.1 Packages in iPhone 11 Pro Max with Conformal Shielding
Stacks Image 25201
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  • Published January 2020
  • 42 pages
  • 7 figures / 15 tables
  • 44 PowerPoint slides
  • $8,750 corporate license (4 issues)
    $2,500 single issue
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