This issue of the Advanced Packaging Update features special coverage of large area panel fan-out wafer level packaging (FO-WLP) developments. It also discusses options for high-performance packaging, including silicon interposers, fan-out on substrate, and other alternatives. A special section examines developments in electro-magnetic interference (EMI) shielding. Huawei’s new 5G smartphone is examined and domestic China content is listed. Outsourced semiconductor assembly and test (OSAT) financials through the third quarter are analyzed.