Volume 3-1120

November 2020
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This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials for the first half of 2020. An update on the developments in 3D memory, including high bandwidth memory and hybrid bonding, is included. Package options for HBM plus logic are discussed. The issue includes a special section on thermal issues for mobile and high-performance applications, including integrated photonics.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
        • 1.1.1 Semiconductor Industry Growth
          • 1.1.1.1 TSMC's Outlook
        • 1.1.2 U.S. Macroeconomic Trends
      • 1.2 Trade War Impact
    • ​2 OSAT Financial Analysis
      • 2.1 Definitions
      • 2.2 Market Overview
      • 2.3 OSAT Market Performance
      • 2.4 Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 Research and Development
        • 2.4.3 CAPEX
      • 2.5 OSAT Market Projections
    • 3 Modular Smartphone Designs
    • 4 3D Memory Developments
      • 4.1 HBM Market Projection
      • 4.2 HBM Assembly: Hybrid Bonding Trends
      • 4.3 Samsung 3D Memory
      • 4.4 TSMC 3D Memory
    • 5 Package Options for Logic and HBM
      • 5.1 Silicon Interposers
        • 5.1.1 Samsung
        • 5.1.2 TSMC
      • 5.2 Embedded Bridge and FO Solutions
        • 5.2.1 Amkor
        • 5.2.2 ASE
        • 5.2.3 IBM Research and AI Hardware
        • 5.2.4 Intel
        • 5.2.5 SPIL
        • 5.2.6 Toshiba
        • 5.2.7 TSMC
      • 5.3 Thermal Budgets for HBM
      • 5.4 TDL Interposers and Organic Substrates
        • 5.4.1 IBM Assembly and Test
        • 5.4.2 Samsung
        • 5.4.3 TSMC
    • ​6 Thermal Challenges
      • 6.1 Mobile Products
      • 6.2 Laptop with Foveros 3D IC
      • 6.3 High-Performance Applications
        • 6.3.1 Importance of Thermal Design
        • 6.3.2 Lidded vs Lidless Packages
        • 6.3.3 Thermal Interface Materials
        • 6.3.4 Material Developments
          • 6.3.4.1 Grease, Gels, Tapes, and Pads
          • 6.3.4.2 Solderor Metal TIM
          • 6.3.4.3 Sintered Silver
          • 6.3.4.4 Graphene
        • 6.3.5 Heat Spreaders and Heatsinks
        • 6.3.6 Boards
      • 6.4 Integrated Photonics
    • 7 Substrate Shortages
      • 7.1 Substrate Production Facility Accidents
        • 7.1.1 Price Increases and Longer Leadtimes
      • 7.2 Available Capacity
      • 7.3 Substrate Qualification Process
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 2.1 Market share of top 20 OSATs in 2020.
    • 3.1 Modularization for Snapdragon 865 5G reference platform.
    • 4.1 Immersion-in-Memory-Computing.
    • 6.1 Cooling environment and thermal crosstalk for 2.5D.
    • 6.2 Alloyed meta-material heatsink thermal resistance.
    • 6.3 3D microfludic heatsink with microscale inlet/outlet nozzles.
    • 6.4 Paste and Cu slug for thermal dissipation.
    • 6.5 Increasing power for I/Os in datacenter applications.
    • 6.6 Power consumption for networking applications.
    • 7.1 Apple iPad substrate.
  • Tables…
    • 2.1 Revenue for Top 20 Publicly Traded OSATs
    • 2.2 Assembly and Test Revenue in 1H 2020
    • 2.3 Gross Margin for Top 10 OSATs
    • 2.4 1H 2020 R&D Investment
    • 2.5 1H 2020 CAPEX Investment
    • 2.6 2020 Revenue Projections
    • 3.1 Main Board Packages for Niche Phone-S
    • 4.1 HBM Market Projections
    • 4.2 BW Density and Power: HBM vs. LT-SoIC (8-high)
    • 5.1 Silicon Interposers for HBM + Logic
    • 5.2 FO Solutions for HBM + Logic
    • 5.3 Embedded Bridge Solutions for HBM + Logic
    • 5.4 IBM’s Embedded Bridge
    • 5.5 Samsung’s Silicon-less RDL Test Vehicle
    • 6.1 Average Power and Energy Usage for Mobile Processors
    • 6.2 Examples of Thermal Materials in Smartphones
    • 6.3 Rogers HeatSORB® Phase-Change Material Characteristics
    • 6.4 Power Dissipation Trends for High-Performance Devices
    • 6.5 Lid Attach Process for New TIMs
    • 6.6 New TIM Reliability Test Result
    • 6.7 Innovative Thermal Solutions
    • 6.8 Power Consumption for Different Optical Modules
    • 6.9 Unimicron’s Embedded Heat Slug 
    • 6.10 Simulation Comparison for PCB with Embedded Cu Slug
    • 7.1 IC Package Substrate Supplier Status
    • 7.2 Qualification Test
Stacks Image 25201
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  • Published November 2020
  • 56 pages
  • 11 figures / 26 tables
  • 57 PowerPoint slides
  • $8,750 corporate license (4 issues)
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