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International, Inc.

4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759

Tel: 512.372.8887
Fax: 512.372.8889



TechSearch International, Inc. was founded in 1987 as a technology licensing and consulting company specializing in the electronics industry.

With our extensive network of industry contacts, frequent visits to semiconductor packaging and assembly facilities, and attendance at most conferences, we stay up-to-date on the latest industry innovations.

Coming Soon 
2015 Flip Chip and WLP:
Emerging Trends and Market Forecasts

System in Package

 What We Do

We provide strategic market analysis, competitive analysis, technology trends, and evaluation of product strategies in the field of semiconductor packaging and assembly. Our areas of specialty are:

Semiconductor packages:
  • Ball grid arrays (BGAs)
  • Chip scale packages (CSPs)
  • SiP and stacked packages
  • Flip chip and WLPs

Specialized packaging:

  • 3D through silicon via
  • Embedded components
  • Micromechanical systems (MEMS)
  • Optoelectronics
  • RFID tags and inlays
  • Substrates
  • Flex circuits
  • Underfills


  • Assembly equipment
  • Assembly services
  • Lead-free processes

BGA CSP reports
Published quarterly

2013/2014 Global Semiconductor Packaging Materials Outlook

Produced by SEMI® and TechSearch International Inc.

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