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TechSearch
International, Inc.

4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759

Tel: 512.372.8887
Fax: 512.372.8889

 

Welcome

TechSearch International, Inc. was founded in 1987 as a technology licensing and consulting company specializing in the electronics industry.

With our extensive network of industry contacts, frequent visits to semiconductor packaging and assembly facilities, and attendance at most conferences, we stay up-to-date on the latest industry innovations.


Next Publication
2008 Flip Chip and Wafer Level Packaging
Market and Technology Trends

Preliminary Brochure / Order Form

 

Current Favorite Reports

Through Silicon Via Technology:
The Ultimate Market for 3D Interconnect
Embedded Active Components and Integrated Passives:
Technologies and Markets
India:
The Next Step for Packaging Assembly and Mfg.
3-D Integration at the Wafer Level
System-in-Package:
The New Wave in 3D Packaging

Flip Chip and WLP:

Embedded Components Workshop Proceedings
Contact us for information on how to purchase

 What We Do

We provide strategic market analysis, competitive analysis, technology trends, and evaluation of product strategies in the field of semiconductor packaging and assembly. Our areas of specialty are:

Semiconductor packages:
  • Ball grid arrays (BGAs)
  • Chip scale packages (CSPs)
  • SiP and stacked packages
  • Flip chip and WLPs

Specialized packaging:

  • 3D through silicon via
  • Embedded components
  • Micromechanical systems (MEMS)
  • Optoelectronics
  • RFID tags and inlays
Materials:
  • Substrates
  • Flex circuits
  • Underfills

Processing:

  • Assembly equipment
  • Assembly services
  • Lead-free processes




BGA CSP reports
Published quarterly


Global Semiconductor Packaging Materials Outlook

Order now
Produced by SEMI® and TechSearch International Inc.

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Copyright 2003-2007 • TechSearch International, Inc. All rights reserved.