Teardowns by TechSearch International
Thorough analysis of advanced packaging technologies in leading electronic products
- Reports priced individually. Contact us to order or get more information.
TechSearch International recently began performing teardowns of leading-edge and prominent system products, including smartphones from Samsung, Apple, Xiaomi, and Huawei, smartwatches such as the Apple Watch and Samsung Galaxy Watch, and various consumer electronics like smart speakers, wireless earbuds, wireless network routers, video doorbells, etc.
Teardowns from TechSearch International focus on the advanced semiconductor packaging aspects of the systems.
Teardowns from TechSearch International focus on the advanced semiconductor packaging aspects of the systems.
- All Chip Packages Covered: We analyze each advanced semiconductor package in the system as well as in accessories included with the product. Advanced packages include WLPs, FO-WLPs, laminate CSPs like FBGAs and FLGAs, leadframe CSPs like QFNs and SONs/DFNs, ceramic CSPs, and bare die technologies such as flip-chip-on-flex and chip-on-board.
- All Devices Inside Modules/SiPs Covered: We also decapsulate the multi-die modules and system-in-package devices to examine all flip chip, wire bond, and pre-packaged devices contained within them.
- Comprehensive Package and Die Details Include:– Supplier, part number, and marking
– Package type and class
– Package dimensions
– Contact type, count, and pitch
– Shielding and underfill
– Die supplier and device type
– Die count, size, and placement
– Die bond count and pitch
– Flip chip, wire bond, material type - Superb Imaging and X-rays with High-Resolution: We take high-quality photographs and provide them in high-resolution format. In partnership with Comet Yxlon (yxlon.comet.tech), we are able to produce excellent high-resolution x-ray images of packages using Comet Yxlon's tools.
- Package and Die Data Categorized and Summarized: We compile data to provide breakdowns of package and die counts by package type, package class, and supplier geographic location. Total package and die surface areas are determined.
Recent teardowns:
Other recent teardowns
- Samsung Galaxy A53 5G
- Xiaomi Redmi K50 Pro
- Samsung Galaxy Buds2
- Apple iPad Pro 11-inch (3rd gen)
- Nokia 6300 4G
- Eero Wi-Fi 6 mesh router
- Amazon Echo Dot (4th gen)
- Fitbit Versa 3
- Google Nest Mesh Wi-Fi router
- Samsara Dual-Facing AI Dash Cam
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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- +1.512.372.8887
- +1.512.372.8889
- 4801 Spicewood Springs Rd, Ste 150
Austin, TX 78759
United States
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