Volume 4-0119

January 2019
order form
This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials through the third quarter. The report presents options for high-performance packaging, including silicon interposers, fan-out on substrate, and other alternatives. Future 3D alternatives, including 3D stacking with TSVs and fusion bonding, are discussed. Developments in antenna-in-package are covered. Developments and applications in 3D-printed electronics are also presented
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Macroeconomic Trends
      • 1.2 Semiconductor Sector
    • ​2 OSAT Financial Analysis
      • ​2.1 OSAT Market Overview
    • 3 High-Performance Packaging
      • 3.1 High-Performance Packaging Options
        • 3.1.1 Silicon Interposers
        • 3.1.2 Challenges with Silicon Interposers
        • 3.1.3 Fan-Out on Substrate
        • 3.1.4 Organic Packages
          • 3.1.4.1 AMD's EPYC
          • 3.1.4.2 Intel's EMIB
        • 3.1.5 Supply and Demand Analysis
        • 3.1.6 What's Next? New 3D Architectures
          • 3.1.6.1 Intel Foveros Technology
          • 3.1.6.2 CEA Leti
          • 3.1.6.3 DARPA's CHIPS Program
          • 3.1.6.4 GLOBALFOUNDRIES
          • 3.1.6.5 TSMC 3DFO
          • 3.1.6.6 Direct or Fusion Bonding
    • 4 RF FEM Trends
    • 5 5G Drives New Package Solutions
      • 5.1 Antenna-in-Package
        • 5.1.1 Amkor Technology
        • 5.1.2 ASE
        • 5.1.3 MediaTek
        • 5.1.4 Powertech Technology
        • 5.1.5 Qualcomm
        • 5.1.6 SPIL
        • 5.1.7 TSMC
    • 6 3D Printed Electronics
      • 6.1 Centers for 3D Printed Electronics
      • 6.2 Printed Electronic Circuit Applications
      • 6.3 3D Printing and Additive Manufacturing
        • 6.3.1 Printed Antennas
        • 6.3.2 Cooling
      • 6.4 Materials and Methods
        • 6.4.1 Inkjet Printing
      • 6.5 Equipment Suppliers
        • 6.5.1 BotFactory
        • 6.5.2 Fuji Machine Manufacturing
        • 6.5.3 Hewlett-Packard
        • 6.5.4 Meyer Burger
        • 6.5.5 Nano Dimension
        • 6.5.6 Next Dynamics
        • 6.5.7 Optomec
        • 6.5.8 Orbotech
        • 6.5.9 SCREEN Holdings
        • 6.5.10 Toray Engineering
        • 6.5.11 Voxel8
    • 2018 BGA and CSP Bibliography
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Google’s TPU v3.
    • 3.2 EPYC multi-die package.
    • 3.3 Foveros technology with 3D face-to-face stacking.
    • 3.4 Intel first hybrid x86 architecture in Foveros.
    • 3.5 3D test vehicle with conformal lid technology.
    • 5.1 Cross-section of mmWave transceiver on FC-CSP.
    • 5.2 AiP stack-up.
  • Tables…
    • 2.1 Top 20 OSAT Revenues
    • 3.1 Key Metrics for High-Performance Packaging
    • 3.2 Silicon Interposer with TSVs vs. Alternatives
    • 3.3 Passive Si Interposers with TSVs in Production
    • 3.4 Package Comparison
    • 3.5 Market Projections for Si Interposers and Fan-Out on Substrate
    • 3.6 3DFO versus Conventional 3DIC
    • 4.1 Comparison of RF FEMs in iPhone X and iPhone XS/XS Max
    • 6.1 Equipment Suppliers
Stacks Image 25201
brochure
  • Published January 2019
  • 41 pages
  • 8 figures / 9 tables
  • 48 PowerPoint slides
  • $5,100 annual subscription (4 issues)
    $2,500 single issue
    $8,750 corporate license
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States