Volume 4-0715

July 2015
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The fourth volume of the Advanced Packaging Update features special coverage of the BGA and CSP markets with a five-year forecast by package construction. The CSP market is divided into laminate, flex circuit, and leadframe (QFN) substrates. Market forecasts for stacked die CSPs and package-on-package (PoP) are also provided. Estimates of the market for each package type are based on input from captive as well as merchant assembly operations. Key applications and drivers for unit volume growth are highlighted. A special section is devoted to the latest developments in singulation for thin die.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Sector
    • 2 BGA Applications and Market Growth
      • 2.1 Personal Computers
      • 2.2 Set-Top Boxes, HDTVs, and Game Consoles
      • 2.3 Network Systems, Telecom, and Servers
      • 2.4 Automotive
      • 2.5 BGA Market Projections
    • 3 CSP Applications and Market Growth
      • 3.1 Mobile Phones
      • 3.2 Tablets
      • 3.3 Wearable Electronics
      • 3.4 Leadframe CSPs
        • 3.4.1 Molded Interconnect Substrates
        • 3.4.2 Routable QFNs
      • 3.5 Laminate CSPs
      • 3.6 Stacked Die CSPs
        • Amkor, Hana Micron, PTI, Samsung, SK Hynix, STATS ChipPAC, Toshiba, SanDisk, Intel, Micron
      • 3.7 PoP Developments
        • 3.7.1 TMV PoP and Flip Chip Trends
        • 3.7.2 NVIDIA’s Bare Die PoP
        • 3.7.3 Invensas BVA
        • 3.7.4 FO-WLP PoP
          • NANIUM, PTI, Samsung, SPIL, STATS ChipPAC, TSMC
        • 3.7.5 Embedded Die PoP
      • 3.8 CSP Market Projections
    • 4 Thin Die Challenges
      • 4.1 Thin Wafers with TSVs
      • 4.2 Plasma Dicing Equipment Developments
        • Disco, Panasonic, Plasma-Therm,
          SPTS/Orbotech
      • 4.3 Flash Memory
    • 2014 BGA and CSP Bibliography
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts
    • 2.1 Flip chip as a percentage of PBGA shipments
    • 2.2 Subcontractor share of PBGA shipments
    • 3.1 Apple’s iPad Air 2
    • 3.2 Apple Watch S1 SiP module
    • 3.3 Stacked die CSP in Apple Watch
    • 3.4 QPL’s HDL package
    • 3.5 UTAC’s GQFN package structure
    • 3.6 Samsung’s 3D stacked memory with TSVs
    • 3.7 Samsung MCP with stack
    • 3.8 5mKGSD package for SK Hynix HBM
    • 3.9 SanDisk’s 16-die stack for 128GB iSSD
    • 3.10 Toshiba’s PCI Express 256GB SSD
    • 3.11 Toshiba face-to-face—stacked chip SoC (SCS)
    • 3.12 BVA package
    • 3.13 PoP market projections (millions of units)
    • 4.1 Plasma dicing stress reduction at corners
  • Tables…
    • 2.1 FBGA Reliability for Engine Control
    • 2.2 PBGA Market Projections (millions of units)
    • 3.1 Smartphone Packages
    • 3.2 CSPs in Samsung’s Galaxy S6 EDGE
    • 3.3 Packages for Apple iPad Air 2
    • 3.4 Recent QFN-Packaged ICs and Modules
    • 3.5 Recent ICs Packaged in FBGAs
    • 3.6 Laminate LGA-Packaged ICs and Modules
    • 3.7 Stacked Die at Selected Companies
    • 3.8 Amkor’s Die Stacks and Device Types
    • 3.9 PTI’s Die Stacks and Device Types
    • 3.10 Stacked Die Packages from Samsung
    • 3.11 Stacked Die Packages from SK Hynix
    • 3.12 STATS ChipPAC’s Die Stacks and Device Types
    • 3.13 Stacked-Die Memory Packages from Toshiba
    • 3.14 PoP Evolution: TMV®
    • 3.15 TMV, BVA and 3D IC w/TSV Technologies
    • 3.16 Interconnect Performance Comparison
    • 3.17 Embedded-Die PoP Developments
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  • Published July 2015
  • 63 pages
  • 17 figures / 22 tables
  • 50 PowerPoint slides
  • $4,200 annual subscription (4 issues)
    $1,500 single issue
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