Volume 1-0317

March 2017
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The Advanced Packaging Update (1-0317) features special coverage of outsourced assembly and test (OSAT) financials. A detailed financial analysis of the industry is provided, including a discussion of merger and acquisition activities and the impact on the industry. An update on the latest developments in large area fan-out wafer level package (FO-WLP) panel production is included. A section on trends in packaging and assembly for memory covers new developments. The latest trends in high-performance computing are presented with a forecast for silicon interposers and a discussion of alternatives moving into production.
  • Contents…
    • 1 Industry and Economic Trends
      • ​1.1 Economic Trends
      • 1.2 Semiconductor Sector
    • ​2 OSAT Financial Analysis
      • 2.1 Assembly and Test Revenue
      • 2.2 OSAT CAPEX
    • 3 Panel FO-WLP Developments
      • 3.1 Nepes
      • 3.2 Powertech Technology
      • 3.3 Samsung and Samsung Electro-Mechanics
      • 3.4 Unimicron
    • 4 Memory Packaging Trends
      • 4.1 Mobile Devices
        • 4.1.1 PoP Memory Package Trends
        • 4.1.2 Memory Stacks
        • 4.1.3 Memory and Logic Stacks
      • 4.2 Graphics Memory
      • 4.3 DRAM with TSVs
      • 4.4 Flash
        • 4.4.1 Packages for SSDs
          • 4.4.1.1 Toshiba's Flash with TSVs
          • 4.4.1.2 3DXPoint™
        • 4.4.2 Die Thickness Trends
      • 4.5 Memory TSV Projections
    • 5 High-Performance Computing
      • 5.1 Silicon Interposers
        • 5.1.1 Advantages and Challenges
        • 5.1.2 Product Examples with Silicon Interposers
          • 5.1.2.1 Xilinx
          • 5.1.2.2 AMD
          • 5.1.2.3 Nvidia
          • 5.1.2.4 Broadcom
        • 5.1.3 Silicon Interposer Providers
      • 5.2 Alternatives to Silicon Interposer with TSV
        • 5.2.1 Intel's EMIB
        • 5.2.2 Organic Interposer Supplier Developments
        • 5.2.3 Unimicron's Glass Interposer Developments
        • 5.2.4 FO-WLP
      • 5.3 Silicon Interposer Market Forecast
    • BGA and CSP Bibliography
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts
    • 4.1 HMC with TSVs
    • 4.2 Samsung 64GB RDIMM for Enterprise Servers
    • 4.3 XPoint™ in server memory and storage hierarchy
    • 5.1 Xilinx 16nm UltraScale+ HBM
    • 5.2 Split interposer design
    • 5.3 Reticle layout for interposer split into two fields
    • 5.4 Wafer with 50mm x 50mm silicon interposers
    • 5.5 FO-WLP for data center application
  • Tables…
    • 2.1 Top 20 OSAT Assembly and Test Revenues
    • 2.2 Subcontractor CAPEX Trend
    • 3.1 FO-WLP Panel Production Plans
    • 3.2 Fan-out Package Reliability
    • 3.3 Unimicron Next Generation Substrate Platform
    • 4.1 High Bandwidth DRAM Options
    • 4.2 Samsung's HBM3
    • 4.3 Forecast for Stacked DRAM with TSVs
    • 5.1 Interposer Adoption Timeline and Obstacles
    • 5.2 Silicon Interposer Suppliers
    • 5.3 Foundry Interposer Offerings
    • 5.4 Interposer Design Rule Comparison
    • 5.5 Organic Interposer vs. Silicon Interposer
    • 5.6 Glass Substrate Development Roadmap
    • 5.7 Market Projections for Silicon Interposer with TSVs
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  • Published March 2017
  • 42 pages
  • 9 figures / 15 tables
  • 41 PowerPoint slides
  • $4,995 annual subscription (4 issues)
    $2,500 single issue
    $8,500 corporate license
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