Volume 3-1118

November 2018
order form
This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials. The latest developments in large-area panel fan-out wafer level package (FO-WLP) trends are presented. An analysis of large area panel FO demand is provided. The growing applications for wearable electronics, including smart watches and AR/VR, are discussed along with details of the packages used. Developments in 5G and trends in board-level material are discussed
  • Contents…
    • 1 Industry and Economic Trends
      • ​1.1 Economic Trends
      • 1.2 Semiconductor Sector
    • ​2 OSAT Financial Analysis
      • ​2.1 OSAT Market Overview
      • 2.2 OSAT Metrics
      • 2.3 Outlook
    • 3 Panel FO-WLP Developments
      • 3.1 Applications for Large Area Panels
        • 3.1.1 Today's Applications
        • 3.1.2 Future Proposed Applications
          • 3.1.2.1 Application Processors
          • 3.1.2.2 Memory
          • 3.1.2.3 RF for 5G
          • 3.1.2.4 System-in-Package and Other Applications
        • 3.1.3 How Many Panels Does the Industry Need?
          • 3.1.3.1 Potential Panel Demand: A Case Study
          • 3.1.3.2 Conservative Panel Demand Forecast
          • 3.1.3.3 Panel Capacity
      • ​3.2 Large Area FO Panel Suppliers
        • 3.2.1 ASE and Deca Technologies
        • 3.2.2 Nepes
        • 3.2.3 Powertech Technology
        • 3.2.4 Samsung Electro-Mechanics
        • 3.2.5 Unimicron
      • 3.3 Consortia Activities
        • 3.3.1 FOPLP Large Panel Consortium
        • 3.3.2 Fraunhofer IZM
        • 3.3.3 iNEMI
        • 3.3.4 Institute of Microelectronics
        • 3.3.5 JOINT
        • 3.3.6 National Center for Advanced Packaging
    • ​4 Wearable Electronics
      • 4.1 Smartwatches
        • 4.1.1 Samsung Watch
        • 4.1.2 Apple Watch
      • 4.2 AR/VR Systems
        • 4.2.1 HTC Vive Pro
      • 4.3 Earwear
      • 4.4 E-Textiles
    • 5 5G Developments
      • 5.1 PCB and Substrate Materials for 5G
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Bottom PoP in FOPLP with AP and PMIC.
    • 3.2 Electrical performance test results for i-PoP and FO-PoP.
    • 3.3 ASIC in panel FO with wire bond memory stack.
    • 3.4 5G RF package with FO panel process.
    • 3.5 Uni-SiP key process steps.
    • 5.1 Comparison of loss performance of surface treatments.
  • Tables…
    • 2.1 Top 20 OSAT Revenues
    • 3.1 Thermal Performance Test Results for i-PoP and FOPLP-PoP
    • 3.2 Monthly Panel Demand Forecast
    • 3.3 Estimated Monthly Panel Capacity
    • 3.4 FO-WLP Panel Production Status
    • 3.5 PTI's Panel Fan-Out WLP Options
    • 3.6 Fraunhofer IZM Research Targets
    • 4.1 Packages in the Samsung Galaxy Watch
    • 4.2 IC Packages in Apple Watch 4 and Samsung Galaxy Watch
    • 4.3 Several New AR/VR Headsets for 2018
    • 4.4 AR/VR Headset Market Forecast
    • 4.5 WLPs in the HTC Vive Pro Headset
    • 4.6 Additional Packages in the HTC Vive Pro Headset
    • 4.7 Comparison of IC Packages in Vive and Vive Pro Headsets
    • 4.8 Comparison of Components on Each of 32 IR Sensor FPCs
    • 5.1 Comparison of PCB Material Factors by 5G Frequency Domain
    • 5.2 Examples of Materials for 5G Applications
    • 5.3 Doosan Cu Foil Roadmap
    • 5.4 Selected Build-Up Film Materials
    • 5.5 Selected Materials Dielectric Constant and Loss Tangent
Stacks Image 25201
brochure
  • Published November 2018
  • 45 pages
  • 7 figures / 20 tables
  • 46 PowerPoint slides
  • $5,100 annual subscription (4 issues)
    $2,500 single issue
    $8,750 corporate license
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States
Navigate
Copyright © 2015–2024 TechSearch International, Inc. • techsearchinc.com • all rights reserved