Technology Licensing

TechSearch International technology licensing activities are focused in the area of semiconductor packaging and assembly. Assistance is provided in technology valuation, background on industry licensing fee structures, and location of specific technologies. Examples of technologies introduced for licensing include:

• NTT’s thin film substrate technology
• Gold wafer bumping process technology
• Lead-free bumping process technology
• Wafer level packaging and testing
• BGA and CSP fabrication
• Motorola’s flip chip PBGA assembly process
• New materials for semiconductor packaging and assembly
• Copper clad laminate fabrication technology