TechSearch
International, Inc.
•
4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
•
Tel: 512.372.8887
Fax: 512.372.8889
|
|
Optoelectronics Packaging Workshops
|
|
These workshops gathered individuals in the photonics/optoelectronics industry and related segments of the semiconductor and communications industries to facilitate dialogue about cost reduction in optoelectronics packaging and assembly. It was an opportunity for material, equipment, and contract assembly service suppliers to network with the companies designing and packaging optoelectronics components, modules, and systems.
|
|
Workshop Presentations
3rd Optoelectronics Packaging Workshop
Feb. 26-27, 2002
|
- Optoelectronics Packaging Trends in Japan
Hideyuki Takahara, NTT
- Manufacturing in China
Joseph Lee, New Focus Pacific
- New Low-Cost Interconnects for Optoelectronics
Steve Anderson, Silicon Bandwidth
- Volume Photonics Manufacturing: But What Volume?
Lee Ng, Agilent
- Platform Technologies for Next Generation Packaging
John Fisher, Haleos
- From Lab to Automation: Optoelectronic Assembly Lessons
Alexei Miecznikowski, Celestica
- Optoelectronics Assembly and Test Outsourcing - One Perspective
Curtis Jack, Agere Systems
|
- Optoelectronics Industry Update
Donald Lu, J.P. Morgan Securities
- Challenges for Optoelectronics Packaging Designs
Jean-Louis Nicque, Alcatel
- Integration of Active Optoelectronic Components
Torsten Wipiejewski, Agility Communications
- One Step Up: Optical/Electrical Integration Above the Component Level
Amy Dugan, iPhotonics
- Introduction of APiA: A New Consortium
Ellery Buchanan, Ultratech Stepper
- Material Properties in Optoelectronics Packaging and Assembly
John J. Stankus, Nortel Networks
- Standards Activities
Jack Fisher, IPC/NEMI
|
2nd Optoelectronics Packaging Workshop
Aug. 21-22, 2001
|
- The Pick and Shovel of the Photonics Gold Rush
Dr. Donald Lu, J.P. Morgan Securities
- Materials in Optoelectronics
Dr. Christoph Erben, Lucent Technologies - Bell Labs
- VCSEL Packaging
Hem Takiar, Novalux
- Fiber Optic Transceivers Packaging
Matt Schwiebert, Agilent Technologies
- Photonic and Optoelectronic System Integration
Dr. Henning Schroeder, Fraunhofer IZM
- Optoelectronic Packages for Integrated Sealing of Optical Fibers
Ben Velsher, Kyocera America
- Optoelectronics
John Pittman, Agere Systems
- Optoelectronics Packaging and Assembly in China
Dr. Timothy J. Urekew, TechSearch International
|
- Japanese Optoelectronics Packaging Roadmaps
Doug Feicht, TechSearch International
- Mass Production Technology for Low Cost Telecom Optical Components
Dr. M. Nishiguchi, Sumitomo Electric Industries
- Optical Component to Optical Module Integration
Charles Ward, Flextronics International
- Automation for Fiber Optic Component Manufacturing
Randy Heyler, Newport Corporation
- Contract Assembly Issues
Dr. Edward Palen, Teledyne OptoElectronics
- Manufacturing Issues in Photonics
Mark Schwartz, Fabrinet
- Latest PCB Technologies Coming from the Far East for North American and European OEMs
Happy Holden, Westwood Associates (NanYa PCB Corp.)
|
1st Optoelectronics Packaging Workshop
Feb. 22, 2001
|
- Emergence of Packaging and Physical Design in the Bandwidth Era
John Stafford, Motorola
- Material Issues in Optoelectronics Packaging and Assembly
Dr. John Stankus, Nortel Networks
- Materials Issues for Optical Components
Jerry Steinberg, JDS Uniphase Corporation
- Equipment Developments and Issues for Assembly
Bruce Hueners, Palomar Technologies
- Japanese Developments and Roadmaps in Optoelectronics Packaging
Doug Feicht, TechSearch International Inc.
- Contract Assembly of Optoelectronics Products
Richard Otte, Promex Industries
- Optronics Packaging and Assembly: An EMS Prospective
Dr. Peter Arrowsmith, Celestica
|
|
|
|
|
