TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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Low-Cost RFID IC Packaging and Assembly Workshop:
Hosted by Fraunhofer-IZM and TechSearch International, Inc. |
November 14, 2005
Munich, Germany
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Workshop information
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A4 format
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Letter format
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Registration
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 ~81kb
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~81kb
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Speaker Instructions
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~80kb |
~80kb |
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Agenda
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~59kb |
~55kb |
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Map
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~132kb |
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TechSearch International, Inc. and the Fraunhoffer IZM will focus on the technical and economic issues of building RFID inlets and tags. Join us in Munich, Germany on November 14 for a discussion on lowering manufacturing cost with tag and inlay assembly experts.
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| 8:30-9:00 |
Registration and coffee |
| 9:00 - 9:30 |
Keynote and Introduction
Dr. Karlheinz Bock, Deputy Director, Munich Branch Fraunhofer-IZM |
| 9:30 - 10:00 |
Addressing the RFID Market Needs
Guenther Aflenzer, Manager Packaging and Systems Integration Group, Philips Semiconductors
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| 10:00 - 10:30 |
RFID Tag Activity at Infineon
Werner Koele, Technical Marketing, Memories and RFID
Infineon |
| 10:30 - 11:00 |
Fluidic Self Assembly
Glenn Gengel, Vice President of Manufacturing
Alien Technology Corp.
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| 11:00 - 11:30 |
SCP Technology: A Revolutionary Process Enabling the Low Cost High Quality Manufcaturing of RFID Tags
Holger Ulland, Head of Product Management RFID Solutions
Arccure Technologies
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| 11:30 - 12:00 |
RFID Chip and Tag Assembly Challenges
Dr. Frank Kriebel, Vice President of Research & Development
KSW Microtec
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| 12:00-1:00 |
Lunch |
| 1:00 - 1:30 |
Challenges of Low Cost Chip Assembly for RFID Inlay Production
Dr. Hugo Pristauz, Director Advanced Technology & RFID Business Dev.
Datacon Technology
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| 1:30 - 2:00 |
Technology Update: Different Options for High Volume Smart Label Production
Thomas Betz, Director of Business Development
Mühlbauer AG
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| 2:00 - 2:30 |
The Challenge of Manufacturing Smart Labels
Martin R. Bohn, Division Manager RFID
Bielomatik
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| 2:30 - 3:00 |
RFID Materials Issues |
| 3:15 - 3:45 |
Low Cost Bumping for RFID Chips
Dr. Elke Zakel, Manager
Pac Tech GmbH |
| 3:45 - 4:15 |
RFID Activities in Asia
Tetsuya Onishi, Managing Director
Grand Joint Technology Ltd. (Hong Kong)
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| 4:15 - 4:45 |
Significant steps towards printed low-cost RFID
Wolfgang Mildner, Managing Director
PolyIC
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| 4:45 - 5:45 |
Panel Discussion: Key Challenges to Low Cost RFID Inlay and Tag Assembly
Moderator - Dr. Frank J. Bachner, Senior Analyst
TechSearch International Inc.
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| 5:45 |
RECEPTION |
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