TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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Total Process Solution Study Group
Marketed by TechSearch International, Inc. |
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NTT DoCoMo 900i Series, July 2004
The PowerPoint presentation contains trends in four of NTT's DoCoMo FOMA 900i series phones (Fujitsu, NEC, Panasonic, and Sharp). Included are details and cross sections of the mobile phone boards and the packages used in these products, camera modules, flex circuit, motherboards with feature sizes. (100 slides with color photos, Price: $1,000).
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| IC Packages for NTT DoCoMo 900i Series |
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IC packages by type (size, pin count, lead pitch) |
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Use of underfill for packages |
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Main components in phones |
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Memory card modules |
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Components of LCD boards |
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Passive OLED module |
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Main board for analog/digital |
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Components and ICs on main boards |
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Camera module and LCD board |
| Motherboards for NTT DoCoMo 900i Series |
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Main board (line, space, and vias) |
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Board construction |
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Cross section photos |
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Flexible printed circuit board (COF, hinge) |
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Camera Modules for NTT DoCoMo 900i Series
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Inside and outside camera modules |
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Module maker |
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Effective and recording pixels |
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Package types (pin counts, size, thickness) |
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Substrate types |
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Number and type of passives |
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Phone Models |
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Fujitsu |
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NEC |
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Panasonic (Matsushita) |
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Sharp |
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