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The Lead-Free Movement:  Environmentally Friendly Electronics Manufacturing

With proposed and existing legislation to eliminate lead in the electronics industry, many industry participants are asking a number of questions: Is lead elimination possible? What alternatives meet reliability requirements of today’s products? Meanwhile, Japanese companies such as Hitachi, NEC, Sony, and Toshiba have roadmaps with a lead reduction goal of 50 percent in some electronic products by the year 2000. Matsushita is successfully marketing lead-free consumer products. Driven primarily by the Nordic countries, the European Community has issued a draft directive with the goal of preventing and promoting the recycling and recovery of electronic waste that also calls for a lead phase-out in Europe by January 1, 2004. The European telecommunications industry is developing lead-free alternatives for some products. Meanwhile, the threat of legislation in the United States has
subsided. Is legislation driving the lead-free movement, or is the environmental push market driven? If market driven, what are the consequences for companies that do not have products that measure up to lead-free standards in the industry? This concise study addresses these issues with a careful analysis of governmental policies worldwide. The report covers global developments and activities in the lead-free movement and includes the latest details on lead-free electronic products. The following questions are answered:

  • What are the alternatives to lead based interconnect methods?
  • What are the reliability concerns of lead-free connections?
  • What products are now shipping use lead-free connections in each geographic region—North America, Japan, Asia/Pacific, and Europe?
  • What is the impact of the lead-free movement on emerging packages such as flip chip and ball grid array packages?
  • Who are the key suppliers of lead-free alternative materials?

This report provides detailed analysis of the drivers for the lead-free movement. It addresses the issues of lead-free electronics from a marketing strategy versus a legislative mandate.

The Lead-Free Movement:  Environmentally Friendly Electronics Manufacturing
File size: ? kb Published: January 2000.

Table of Contents
1 Introduction
1.1 Lead-Free Electronic Products on the Horizon
1.2 Lead in Electronics Manufacturing: Past, Present, and Future
2 Motivations to Seek Lead-Free Alternatives
2.1 Public Policy: Politics and Legislation
2.1.1 United States
2.1.2 Japan
2.1.3 Europe
2.2 Using Emotions to Gain Market Share
2.2.1 The Impact of Present, Proposed, and Pending Global Legislation
2.2.2 Proactive Corporate Initiatives
2.2.3 The Green Marketing Bandwagon
3 Lead Replacement Developments and Research Activities
3.1 Lead-Free Alternatives
3.1.1 Replacement Metals
3.1.2 Conductive Adhesives
3.1.3 Advantages and Disadvantages of Alternate Approaches
3.2 Worldwide Initiatives
3.2.1 Lead-Free Research at Universities and Technical Institutes
3.2.2 Lead-Free Research by Organizations and Industry Consortia
3.3 Corporate Response to the Lead-Free Issue
3.3.1 Boeing
3.3.2 Canon
3.3.3 Cookson Electronics
3.3.4 Ericsson
3.3.5 Fujitsu Limited
3.3.6 Hewlett-Packard
3.3.7 Hitachi
3.3.8 IBM
3.3.9 Matsushita
3.3.10 Motorola
3.3.11 NEC
3.3.12 Philips
3.3.13 Sharp
3.3.14 Sony
3.3.15  TDK
4 Lead-Free Material Developments
4.1 AIM Products
4.2 Alpha Metals Inc.
4.3 Ames Laboratory/Sandia National Laboratory
4.3.1 Multicore Solders Inc.
4.3.2 Nihon Superior
4.4 AMTECH Inc.
4.5 Delphi Delco Electronics Systems
4.6 Dynacraft Industries
4.7 Harima Chemicals
4.8 Indium Corporation
4.9 Kester Solder
4.10 Kyushu Matsushita Electric Co., Ltd.
4.11 Lucent Technologies Inc.
4.12 Nippon Micrometal Corporation
4.13 Senju Metal Industry Co., Ltd.
4.14 Showa Denko K. K.
4.15 Sony Corporation
4.16 Tamura
4.17 Taracorp
4.18 Texas Instruments Inc.
4.19 Toshiba Corporation
5 Activities at Contract Manufacturers
5.1 Celestica International Inc.
5.2 Flextronics International Ltd.
5.3 Jabil Circuit Inc.
5.4 Solectron Corporation
6 Lead-Free Product Examples
6.1 North America
6.1.1 Lucent Technologies
6.1.2 Nortel Networks Corporation
6.1.3 Visteon (Ford Motor Company)
6.1.4 Motorola Handheld Communications
6.2 Japan
6.2.1 Hitachi
6.2.2 Fujitsu Limited
6.2.3 Matsushita (Panasonic)
6.2.4 NEC
6.2.5 Sony
6.2.6 Toshiba
6.2.7 Toyota
6.3 Europe
6.3.1 Alcatel
6.3.2 Bosch
6.3.3 Ericsson
6.3.4 Marconi Communications
6.3.5 Nokia
6.3.6 Siemens
7 Beyond the Debate: The Future for Environmentally Friendly Manufacturing
7.1 The Ten-Year Path to Lead-Free
7.2 Issues Remain
7.3 Environmentally Friendly Manufacturing Trends
7.4 Future Products
  Appendix : Lead-Free Solder Alternatives
  Directory:
List of Figures
2.1 Japanese home electronics scrap over the last 10 years.
2.2. Canon’s Bubble Jet recycling process.
2.3. Toshiba's television dismantling process.
2.4. Corporate eco-labels.
2.5. AMTECH’s lead-free solder add.
3.1. Sony Chemicals’ anisotropic conductive film.
3.2. Casio’s MCM for AM/FM radio.
3.3. SBB applications.
3.4. PFC’s RF-ID tag.
3.5. Die mounted on tag.
3.6. PFC’s polymer bump.
3.7. Canon’s Environmentally Friendly Product Design System.
4.1. Alpha Metals' immersion silver finish.
4.2. Nihon Superior’s lead-free solder products.
4.3. Lucent’s SnTech solder material.
4.4. Showa Denko's lead-free solder process.
4.5. Sony's lead-free and conventional solders.
4.6. Texas Instrument's lead-free component finish.
6.1. Lucent Technologies’ power device.
6.2. Nortel Network’s Meridian 9316 office desktop telephone.
6.3. Hitachi’s Flora220CX lead-free notebook PC.
6.4. Fujitsu’s lead-free MCM assembly.
6.5. Fujitsu’s lead-free system board assembly.
6.6. Matsushita minidisk player and board.
6.7. Panasonic lead-free phone and board.
6.8. Panasonic FA controller and board.
6.9. NEC Scooper D56 pager.
6.10. NEC N207S Hyper mobile telephone.
6.11.  Toshiba lead-free phone boards.
7.1. Lead-free replacement time line.

List of Tables
1.1. Lead Consumption by Product
2.1. JIEP Lead-Free Solder Road Map
2.2. Japanese Corporate Lead Reduction and Elimination Initiatives
3.1. Leading Candidates For Lead-Free Soldering
3.2. Lead-Free Alloy Groups
3.3. Candidate Board Finishes
3.4. Commercial Lead-Free Wafer Bumping Research and Development Activities
3.5. Advantages and Disadvantages of Common Lead Alternatives
3.6. Solder Costs and Material Density
3.7. Selected University Lead-Free Research Efforts
3.8.  Hitachi's Solder Selection Materials and Applications
3.9. Tin/Lead Solder Alternative Evaluated by Motorola
4.1. KME’s Communication Equipment Lead-free Mounting Line
4.2. Tamura’s Lead-Free Solder Materials


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