flip chip 2004

Flip Chip Markets and Infrastructure Developments

Demand for flip chip bumping and wafer level packaging is growing rapidly. Increasing shipments of processors, ASICs, field programmable gate arrays (FPGAs), chip sets, graphics devices, and high-end DSPs are driven by the need for improved performance. Form factor needs are driving greater adoption of flip chip in CSPs. Trends include the use of flip chip for silicon with low-k dielectrics, 300mm wafer bumping, adoption of lead-free bumping, and new underfill materials and methods. New applications are described. This analysis provides an updated forecast of the flip chip wafer bumping market by product application, device type, bump type, die size, number of wafers, and number of die. Included are projections for capacity (merchant and captive) and demand. Capacity is projected by number of wafers and bump type. WLPs are also growing in volume with shipments of integrated passives, power amplifiers, battery management devices, controllers, image sensors, diodes, filters, memory (DRAM, flash, SRAM), and power MOSFETS. Projections for wafer level packages (WLPs) are provided in both units and number of wafers. New applications are discussed.

	Flip Chip and Wafer Level Packaging Trends and Market Forecasts
File size: 142 kb		Published: November 2004

Table of Contents Executive Summary 1 Flip Chip Technology Trends 1.1 New Bumping Technologies 1.1.1 Copper Pillar Bump 1.1.2 ELASTec® Bump 1.2 Issues with Low-k Dielectrics 1.2.1 Introduction of Low-k Dielectrics 1.2.2 Assembly Challenges with Low-k 1.2.3 Future Issues for Fabless Companies 1.3 Lead-Free Bump Trends 1.4 Electromigration Issues 1.5 300mm Wafer Bumping 1.6 Bumping Price Trends 1.7 Bump Pitch Trends 1.8 Flip Chip Substrate Trends 1.9 Underfill Material Trends 2 Flip Chip Market Projections 2.1 Wafer Bump Capacity 2.1.1 Solder Bump Capacity 2.1.2 Gold Bump Capacity 2.2 Flip Chip Demand 2.2.1 Solder Bumping Market Projections 2.2.1.1 FCIP vs. FCOB for Solder Bumping 2.2.2 Gold Bumping Market Projections 2.2.3 Gold Stud Bump 2.3 Flip Chip Application by Device Type 2.3.1 High-Performance Computers 2.3.2 Microprocessors for PC and Games 2.3.3 Digital Signal Processors 2.3.4 ASIC, FPGA, and Switches 2.3.5 Chipsets and Graphics ICs 2.3.6 Wireless 2.3.7 Hard Disk Drives 2.3.8 Consumer Products 2.3.9 Medical 2.3.10 Defense and Aerospace 2.3.11 Memory 2.3.12 Gold Stud Bump Applications 2.3.13 Display Drivers 2.4 Future Applications 2.4.1 RFID Tags 2.4.2 High Brightness LEDs 3 Wafer Level Package Projections 3.1 Wafer Level Package Capacity 3.2 Wafer Level Package Demand 3.2.1 Demand by Device Type 3.3 Wafer Level Packaging Applications 3.3.1 Analog Devices 3.3.2 DRAM Memory 3.3.2.1 Drivers for WLP Adoption 3.3.2.2  Impediments to WLP Adoption 3.3.3 Passive Devices 3.3.4 Power MOSFETs 3.4 Future Applications 4 Wafer Bumping and WLP Service Providers 4.1 Solder Bumping Options 4.2 Wafer Level Packaging Options 4.3 Wafer Bumping and WLP Service Providers 4.3.1 Advanced Semiconductor Engineering, Inc. 4.3.2 Advanced Chip Engineering Technology, Inc. 4.3.3 Advanpack Solutions Pte., Ltd. 4.3.4 Amkor Technology 4.3.5 Aptos Corporation 4.3.6 Casio Micronics Co., Ltd. 4.3.7 Chipbond Technology Corporation 4.3.8 Citizen Watch Co., Ltd. 4.3.9 EM Microelectronics  Marin SA 4.3.10 Fujitsu Microelectronics 4.3.11 FuPo Electronics Corporation 4.3.12 FlipChip International, Inc. 4.3.13 Fujikura, Ltd. 4.3.14 IC Interconnect 4.3.15 MEGIC Corporation 4.3.16 MicroScale Co., Ltd. 4.3.17 NEPES, Ltd. 4.3.18 Pac Tech Packaging Technologies 4.3.19 Polymer Assembly Technology 4.3.20 Samsung Techwin 4.3.21 Semiconductor Manufacturing International Corporation 4.3.22 ShellCase 4.3.23 Siliconware Precision Industries Ltd. 4.3.24 STATSChipPAC 4.3.25 Taiwan Semiconductor Manufacturing Company, Ltd. 4.3.26 Unitive Electronics 5 Contract Assembly Services 5.1 IC Package Assembly Services 5.1.1 Advanced Interconnect Technologies 5.1.2 Advanced Semiconductor Engineering, Inc. 5.1.3 Amkor Technology, Inc. 5.1.4 ASAT, Inc. 5.1.5 Carsem, Inc.5 5.1.6 Casio Micronics Co., Ltd. 5.1.7 Chipbond Corporation 5.1.8 ChipMOS Technologies, Inc. 5.1.9 Corwil Technology Corporation 5.1.10 Fujitsu Microelectronics 5.1.11 Global Advanced Packaging Technology 5.1.12 KSW Microtec 5.1.13 Kyocera 5.1.14 Misuzu Industries Co. 5.1.15 Namtai Electronic and Electrical Products, Ltd. 5.1.16 Orient Semiconductor Engineering, Ltd. 5.1.17 Shinko Electric Industries, Inc. 5.1.18 Siliconware Precision Industries Co., Ltd. 5.1.19 STATSChipPAC 5.1.20 United Test and Assembly Center 5.1.21 Valtronic, SA 5.1.22 White Electronic Designs Corporation 5.2 Board-Level Assembly Services 5.2.1 Belton Group 5.2.2 Binder Elektronik GmbH 5.2.3 Celestica 5.2.4 Endicott Interconnect Technologies, Inc. 5.2.5 Fabrinet Co., Ltd. 5.2.6 Flextronics International 5.2.7 HEI, Inc. 5.2.8 Isis Surface Mounting, Inc. 5.2.9 Jabil Circuit 5.2.10 Nextek, Inc. 5.2.11 Pemstar, Inc. 5.2.12 Promex Industries, Inc. 5.2.13 SAE Magnetics (H.K.), Ltd. 5.2.14 Sanmina-SCI Corporation 5.2.15 Saturn Electronics and Engineering, Inc. 5.2.16 Solectron Technology, Inc. 5.2.17 Texas Prototypes, Inc. Appendix A Solder and Gold Bumping Services C Flip Chip Bonding Equipment D Underfill Dispense Systems E Wafer Bump Inspection Systems F Underfill and ACF Materials G Contract Assembly IC Packaging H Contract Assembly Board Level I Laminate Substrate Suppliers References

List of Figures 1.1. APS pillar bump fabrication process. 1.2. Infineon's ELASTec® bump. 1.3. Low-k wafer shipments. 1.4. IMS process flow. 1.5. 300mm wafer bump capacity. 1.6. K&S bumping cost comparison. 2.1. Merchant and captive solder bump capacity. 2.2. Solder bump capacity by geographic region. 2.3. Gold bump capacity by geographic region. 2.4. Solder bump flip chip market by application. 2.5. FCIP and FCOB projections for solder bumped die. 2.6. NEC's AP package. 2.7. Intel's Northbridge. 2.8. ATI's RADEON™ graphics processor with flip chip. 2.9. Mobile phone with flip chip packages. 2.10. Infineon E-GOLDlite baseband IC for mobile phones. 2.11. F-16 aircraft module with flip chip FPGA and ASICs. 2.12. Renesas Technology's stacked package gold stud bump. 2.13. LCD driver IC. 2.14. COG technology. 3.1. WLP shipments by device type. 3.2. CMOS image sensor. 3.3. TI's nanostar WLP. 3.4. National Semiconductor's micro SMD for microphone. 3.5. Samsung's DDR2 SDRAM. 3.6. FCIP (Flip Chip In Package). 3.7. BOC FBGA with wire bond. 3.8. TwinMOS Twister module. 3.9. Micron's module with WLP. 3.10.  Bourns' products in Sony Ericsson phone. 3.11. International Rectifier's FlipFET WLP. 4.1. WLP shipments by bump fabrication method. 4.2. Amkor's bump technologies. 4.3. Casio's wafer level packaging process flow. 4.4. Process flow for electroless NiAu plating. 4.5. AP Bump process flow. 5.1. ASE's flip chip package and solder bump. 5.2. ASE's flip chip assembly expansion plans. 5.3. Copper pillar. 5.4. Amkor's flip chip package roadmap. List of Tables 1 Demand for Solder Bumped ICs 2 Solder Bump and Electroless NiAu Capacity Projections 3 WLP Capacity and Demand Projections 1.1 Lead-Free Flip Chip Bump Plans 1.2 Commercial Lead-Free Wafer Bumping Services 1.3 ASIC, DSP, and Processor Solder Bump Pitch Trends 1.4 Flip Chip Substrates 2.1 Solder Bump and Electroless NiAu Capacity Projections 2.2 Gold Bump Merchant and Captive Capacity Projections 2.3 Demand for Solder Bumped ICs 2.4 Flip Chip Die Size and Bump Examples 2.5 Demand for Gold Bumped ICs 2.6 Demand for Gold Stud Bumping 2.7 Solder Bump Demand by Device Type (millions of units) 2.8 Medical Device Makers 2.9 TAB and COF Pitch Trends 3.1 WLP Capacity and Demand Projections 3.2 WLP Examples 3.3 Wafer Level Package Demand 4.1 Merchant and captive solder bumping capacity by type. 4.2 Wafer Level Packaging Categories 4.3 Selected Solder and Gold Merchant Wafer Bumping 5.1 Flip Chip Package Assembly Suppliers 5.2 ASE's Flip Chip Offerings 5.3 Flip Chip Board Level Assembly Suppliers 5.4  Endicott Interconnect Technologies' FCOB Assembly Capability