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FLIP CHIP AND WAFER LEVEL PACKAGING MARKET ANALYSIS

Despite a global recession in the electronics industry, with dramatic declines in the semiconductor industry, demand for flip chip bumping is growing. While some companies have delayed capacity expansion plans, others have entered the market with new bumping lines. The drivers for flip chip continue to be performance and pad limited designs, as well as form factor needs. In keeping with the environmentally friendly marketing movement, many merchant bumping operations have introduced lead-free alloys. This analysis provides an updated forecast of the flip chip wafer bumping market by product application, device type, number of wafers, and number of die. Included are projections for capacity (merchant and captive) and demand. Capacity is projected by number of wafers and bump type. The trend toward 300mm wafer bumping is also discussed. An increasing number of devices, from diodes to DRAMs, are shipping as wafer level packages (WLPs). WLPs are also growing in volume for a variety of low lead count (less than 100 I/O) applications. A discussion of the driving forces for WLP adoption by device type is included. Projections for wafer level packages (WLPs) are provided in both units and number of wafers.

	Flip Chip and Wafer Level Packaging Market Analysis
File size: 150.6 kb		Published: January 2003.

Table of Contents
	ExecutiveSummary
1	Flip Chip Technology Trends
1.1	Lead-Free Bump Trends
1.2	Bumping Price Trends
1.3	Expansion to 300mm Wafers
1.4	Bump Pitch Trends
1.5	Flip Chip Substrate Trends
1.6	Underfill Material Trends
2	Flip Chip Market Projections
2.1	Wafer Bump Capacity
2.1.1	Solder Bump Capacity
2.1.2	Gold Bump Capacity
2.2	Flip Chip Demand
2.2.1	Solder Bumping Market Projections
2.2.1.1	FCIP vs. FCOB for Solder Bumping
2.2.2	Gold Bumping Market Projections
2.3	Flip Chip Application by Device Type
	Microprocessors, DSPs, high performance logic, chipsets and graphics chips, devices for consumer products, wireless devices, memory, display drivers
2.4	Future Applications
3	Wafer Level Package Projections
3.1	Wafer Level Package Capacity
3.2	Wafer Level Package Demand
3.2.1	Demand by Device Type
3.3	Wafer Level Packaging Applications
	Analog devices, memory, integrated passive devices, diodes, MOSFETs
3.4	Future Applications
4	Wafer Bumping and WLP Service Providers
4.1	Solder Bumping Options
4.2	Wafer Level Packaging Options
4.3	Wafer Bumping and WLP Service Providers
	Advanced Semiconductor Engineering (ASE), Advanced Chip Engineering Technology, Advanpack Solutions, AMCT, Amkor Technology, Aptos, Casio Micronics, Ccube Digital, Chipbond Technology, Citizen Watch, Ellipsiz (MicroFab Technology), EM Microelectronics — Marin, Fujitsu Tohoku Electronics, FuPo Electronics, IC Interconnect, K&S Flip Chip Division, MEGIC, MicroScale, Pac Tech Packaging Technologies, Polymer Flip Chip, Samsung Techwin, ShellCase, Siliconware Precision Industries (SPIL), ST Assembly Test Services (STATS), Taiwan Semiconductor Manufacturing Company (TSMC), Unitive
5	Contract Assembly Services
5.1	IC Package Assembly Services
5.2	Board-Level Assembly Services
Appendix
A	Solder and Gold Bumping Services
B	Wafer Level Packages
C	Flip Chip Bonding Equipment
D	Underfill Dispense Systems
E	Wafer Bump Inspection Systems
F	Underfill Materials
G	Contract Assembly IC Packaging
H	Contract Assembly (Board Level)
I	Substrate Suppliers

List of Figures
1.	Merchant and captive solder bump capacity.
2.	WLP capacity and demand.
1.1.	Fujitsu’s lead-free solder bump on organic substrate.
1.2.	Price projections for 300mm wafer bumping.
1.3.	Supply and demand for 300mm wafers.
1.4.	ASIC solder bump pitch trends.
2.1.	Merchant and captive solder bump capacity.
2.2.	Merchant gold bump capacity.
2.3.	Solder bump flip chip market by application.
2.4.	Impact of die yield on number of wafers for FPGAs.
2.5.	FCIP and FCOB projections for solder bumped die.
2.6.	Demand for gold bumped wafers.
2.7.	Gold SBB demand projection.
2.8.	NEC’s iPX7800 server with flip chip devices.
2.9.	Intel’s flip chip CPU for X-Box game machine.
2.10.	PowerPC for military applications.
2.11.	Atmel’s ASIC in a flip chip PBGA.
2.12.	PMC-Sierra’s flip chip products.
2.13.	Altera’s flip chip PBGA.
2.14.	Xilinx VIRTEX-II.
2.15.	Intel’s Northbridge chip from the i850 chipset.
2.16.	Citizen Watch flip chip device in watch module.
2.17.	Stacked package for mobile phone.
2.18.	Casio’s multichip module.
2.19.	Carsem's FCOL.
2.20.	Mitsubishi Electric stacked package with flip chip.
2.21.	Sony’s camcorder.
2.22.	LCD Driver IC assembly method comparison.
3.1.	WLP capacity and demand.
3.2.	WLP shipments by device type.
3.3.	Casio’s G-Shock watch with WLP.
3.4.	ShellOp for Sanyo’s CCD.
3.5.	National Semiconductor’s micro SMD products.
3.6.	Casio’s wrist watch/camera.
3.7.	Micron’s 256Mbit SDRAM.
3.8.	AVX IPD.
3.9.	Handspring PDA with IPDs.
3.10.	Littelfuse diode arrays.
3.11.	Fairchild’s MOSFETs.
4.1.	Merchant and captive solder bumping capacity by type.

4.2.	APS pillar bump.
4.3.	APS pillar bump fabrication process.
4.4.	Casio’s wafer level packaging process flow.
4.5.	Ccube Digital’s wafer bumping process.
4.6.	Chipbond’s bumping roadmap.
4.7.	Chipbond’s wafer level package process.
4.8.	Chipbond’s chipBGA™.
4.9.	Fujitsu’s electroplating process.
4.10.	Process flow for electroless nickel / gold plating.
4.11.	AP Bump process flow.
4.12.	Fujitsu's SuperCSP package.
4.13.	SuperCSP process flow.
4.14.	IC Interconnect electroless nickel process.
4.15.	K&S FCD wafer bumping process.
4.16.	FCD Ultra CSP™ process.
4.17.	FCD Polymer Collar™ WLP process.
4.18.	ShellBGA process flow.
4.19.	Unitive's repassivation and eutectic SnPb bumping process.
5.1.	Amkor’s flip chip products.
5.2.	SPIL’s flip chip packaging roadmap.
5.3.	Solectron’s GPS module with flip chip.

List of Tables
1.	Demand for Solder Bumped ICs
2.	Wafer Level Package Demand
1.1.	Selected Merchant Lead-Free Wafer Bumping
1.2.	Selected Flip Chip Substrate Suppliers
2.1.	Solder Bump and Electroless Ni/Au Capacity Projections
2.2.	Demand for Solder Bumped ICs
2.3.	Die Sizes for Solder Bumped Flip Chip Devices
2.4.	Demand for Gold Bumped ICs
2.5.	Solder Bump Demand by Device Type
2.6.	Power PC Products
3.1.	Wafer Level Package Demand
4.1.	Wafer Level Packaging Categories
4.2.	Solder and Gold Merchant Wafer Bumping
4.3.	Electroless Nickel Merchant Wafer Bumping
4.4.	Fujitsu's Bumping Roadmap
5.1.	Flip Chip Package Assembly Suppliers
5.2.	ASE’s Flip Chip Offerings
5.3.	Design Rule for TCP/COF
5.4.	COF Technology Roadmap
5.5.	OSE’s Eutectic Solder and Gold Stud Bump
5.6.	Flip Chip Board Level Assembly Suppliers