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 Optoelectronic Manufacturing Infrastructure in China
The major thrust in optoelectronics manufacturing today is cost reduction. Companies are turning to China for low-cost, scaleable manufacturing solutions. This analysis provides an overview of the optoelectronic manufacturing landscape in China, focusing on packaging and assembly of components and modules. The analysis also includes a review of activity in Thailand where companies involved with the production of magnetic disk drives are targeting Optical Manufacturing Services (OMS). Material for this work was collected in China from on-site interviews with more than two dozen manufacturers, universities and research centers, and government related organizations, and from major trade shows and conferences. Over 100 figures provide a glimpse of manufacturing sites, products, and equipment and automation in use.
Optoelectronic manufacturing infrastructure is defined as component and system manufacturers, contract manufacturing service providers, and manufacturing equipment suppliers. Component and system manufacturers include both foreign (outside China) and domestic companies that have manufacturing operations in China. Contract manufacturers include Electronic Manufacturing Service (EMS) providers, disk drive manufacturers, and a new breed of pure-play companies called OMS providers. Manufacturing equipment suppliers are both foreign and domestic companies that provide machines and services used by the optoelectronic manufacturers in China.
Demand for optoelectronic manufacturing capacity is being driven by consumer products such as CDs, DVDs, laser printers and scanners, displays for mobile phones and personal digital assistants, digital cameras, camcorders, LCD TVs, and automotive traffic signals; and by fiber optic communication products such as such as lasers, transceivers, modulators, detectors, WDM, isolators, couplers, splitters, circulators, photonic switches, and waveguides. A discussion on the assembly of the active and passive components used in these devices is included. Active components include edge emitting lasers (EELs), vertical cavity surface emitting lasers (VCSELs), high brightness LEDs, and photodiode detectors (PIN diodes). Assembly processes include active and passive alignment of optical elements, epoxy bonding, fiber align and attach, die bonding, and wire bonding. Test and measurement is also discussed.
- Executive Summary
- Overview of end-market applications for consumer and communication optoelectronic components.
- Overview of China’s demographics, business climate, and emerging centers for optoelectronic manufacturing.
- Segmentation of the optoelectronic manufacturing marketplace in China and review of key players (captive, contract manufacturing service providers, system manufacturers, active and passive component suppliers, network operators, manufacturing equipment and automation).
- A series of information capsules summarizing findings from on-site interviews with companies, universities and research centers, and government organizations in China.
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Optoelectronic Manufacturing Infrastructure in China |
| File size: 88.1 kb |
Published: May 2002. |
| Table of Contents |
| 1 |
Consumer and Communication Optoelectronic Applications |
| 1.1 |
Consumer Optoelectronic Component Products |
| 1.1.1 |
CD and DVD Systems, Laser Printers, Scanners |
| 1.1.2 |
Displays and Traffic Signals |
| 1.1.3 |
Cameras, Facsimile Machines, and Scanners |
| 1.2 |
Communication Optoelectronic Component Products |
| 1.2.1 |
Passive Components for Fiber Optic Networks |
| 1.2.2 |
Active Components for Fiber Optic Networks |
| 1.2.3 |
Fiber Optic Cable TV and Modems |
| 2 |
China Demographics, Business Environment, and Emerging Centers for Optoelectronic Manufacturing
(Pearl River Delta, Shanghai, Beijing, Wuhan, Chengdu/Chongqing, and Other Regions) |
| 3 |
China’s Optoelectronic Industry and Key Players |
| 3.1 |
Market Segmentation |
| 3.2 |
Component and Module Manufacturing in China |
| 3.2.1 |
Active Component Manufacturing |
| 3.2.2 |
Passive Components |
| 3.2.3 |
Manufacturing Equipment and Automation |
| 4 |
On-Site Interviews |
| 4.1 |
Companies |
| 4.1.1 |
Accelink Technologies Co., Ltd |
| 4.1.2 |
Advanced Photonics Company Ltd. |
| 4.1.3 |
ASM Pacific Technology Ltd. |
| 4.1.4 |
Associated Opto-Electronics (Chongqing) Corp. |
| 4.1.5 |
Browave (Zhong-Shan) Corporation |
| 4.1.6 |
Compass Technology Company Ltd. |
| 4.1.7 |
Fabrinet Co., Ltd. |
| 4.1.8 |
Flextronics International (Zhuhai) |
| 4.1.9 |
Horton International China |
| 4.1.10 |
Hopecom Optic Communications Co., Ltd |
| 4.1.11 |
Multek (Multilayer Technology, Inc.) |
| 4.1.12 |
New Focus Pacific |
| 4.1.13 |
O-Net Communications Limited |
| 4.1.14 |
Oplink Communications Inc. |
| 4.1.15 |
Parlex (Shanghai) Circuit Co., Ltd. |
| 4.1.16 |
Pemstar (Thailand) Ltd. |
| 4.1.17 |
Photonic Manufacturing Service Ltd. |
| 4.1.18 |
SAE Magnetics (H.K.) Ltd. |
| 4.1.19 |
Sanwa Technologies Limited |
| 4.1.20 |
Semiconductor Manufacturing International Corp. |
| 4.1.21 |
Shanghai New Industries Optoelectronics Tech. Co. |
| 4.1.22 |
Shenzhen Hi-Optel Technology Co., Ltd. |
| 4.1.23 |
Shenzhen Photon Technology Co., Ltd. |
| 4.1.24 |
Wuhan NEC Fiber Optic Communications Industry |
| 4.1.25 |
Wuhan Optosolutions Inc. |
| 4.1.26 |
Wuhan Telecommunication Devices Co. |
| 4.1.27 |
Wuhan Tikom Fiber-optic & Communication Co. |
| 4.1.28 |
UMC Electronics Hong Kong Ltd. |
| 4.2 |
Universities and Research Centers |
| 4.2.1 |
City University of Hong Kong |
| 4.2.2 |
Chongqing Optoelectronics Research Institute |
| 4.2.3 |
Hong Kong University of Science and Technology |
| 4.2.4 |
Tsinghua University |
| 4.2.5 |
Wuhan Research Institute of Posts & Telecommunications / FiberHome Technologies |
| 4.3 |
Government-related Organizations |
| 4.3.1 |
Hong Kong Productivity Council |
| 4.3.2 |
Science and Technology Bureau of Shanghai Pudong New Area |
| 4.3.3 |
Shanghai Pudong Productivity Center (SPCC) |
| 4.3.4 |
East Lake High Technology Development Zone of the Wuhan Municipal Government (ELHTD) |
|
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| List of Figures |
| 1.1. |
Worldwide component revenue by application for year 2000. |
| 1.2. |
Laser diode packaging configurations. |
| 1.3. |
Laser diode packaging configurations. |
| 1.4. |
Chip-type LEDs. |
| 1.5. |
Megapixel color CCD. |
| 1.6. |
Linear sensor CCD. |
| 1.7. |
Optical components market inventory. |
| 1.8. |
SONET/SDH equipment drives demand for optical components. |
| 1.9. |
DWDM system. |
| 1.10. |
CATV fiberoptic network. |
| 2.1. |
Map of Asia. |
| 2.2. |
Emerging fiber optic manufacturing centers in China. |
| 3.1. |
Optoelectronic component manufacturing process. |
| 3.2. |
Market share of Chinese optoelectronic manufacturers (2000). |
| 3.3. |
TO can packaging for transmitter assembly. |
| 3.4. |
Butterfly packaging for optoelectronic module. |
| 3.5. |
Optoelectronic assembly at WTD, Wuhan, PRC. |
| 3.6. |
Disk drive head stack assembly, Fabrinet (Seagate), Thailand. |
| 3.7. |
Fused fiber isolator. |
| 4.1. |
Laser diode and detector assembly. |
| 4.2. |
ASM fully automatic gold wire ball bonder |
| 4.3. |
AOE laser welding machine for TO can packaging. |
| 4.4. |
AOE production workers in new factory. |
| 4.5. |
Browave manufacturing floor. |
| 4.6. |
Browave factory worker with fusion splicing machine. |
| 4.7. |
Browave products. |
| 4.8. |
Fabrinet’s Bangkok facility. |
| 4.9. |
Fabrinet products. |
| 4.10. |
Fabrinet’s manufacturing line. |
| 4.11. |
Flextronics Doumen industrial park. |
| 4.12. |
Multek Zhuhai north campus. |
| 4.13. |
Multek Zhuhai south campus. |
| 4.14. |
Multek Zhuhai production and inspection facilities. |
| 4.15. |
New Focus Shenzhen 76,000 square meter manufacturing facility. |
| 4.16. |
O-Net products. |
| 4.17. |
O-Net 8 channel V-groove chip. |
| 4.18. |
Parlex Shanghai facility. |
| 4.19. |
Parlex automotive flex circuit. |
| 4.20. |
Parlex chip scale packaging. |
| 4.21. |
Parlex smartcard contact on flex. |
| 4.22. |
Pemstar (Thailand) Bangkok facility. |
| 4.23. |
Photonics Manufacturing Service’s Newport autoalign machine. |
| 4.24. |
SMIC Shanghai facility July 2001. |
| 4.25. |
SMIC FAB 1 equipment. |
| 4.26. |
SMIC FAB 3 mask shop (November 2001). |
| 4.27. |
SNI 200GHz DWDM filters. |
| 4.28. |
Photon Technology manufacturing floor. |
| 4.29. |
Photon Technology products. |
| 4.30. |
Wuhan NEC factory. |
| 4.31. |
Wuhan NEC SMT line. |
| 4.32. |
Wuhan NEC SMS 600V add-drop multiplexer. |
| 4.33. |
WTD’s East Lake facility. |
| 4.34. |
WTD’s Guangdong facility. |
| 4.35. |
WTD assembly line. |
| 4.36. |
WTD assembly and inspection line. |
| 4.37. |
WTD DWDM receiver and transmitter modules. |
| 4.38. |
Wuhan Tikom products. |
| 4.39. |
Class 1,000 clean room. |
| 4.40. |
FiberHome 32 x 10Gb/s DWDM system. |
| 4.41. |
FiberHome optical fiber CATV receiver. |
| 4.42. |
Accelink collimators. |
| 4.43. |
WTD 1310/1550 nm laser and LED modules. |
| 4.44. |
HKPC chip on flex (COF) assembly equipment. |
| 4.45. |
Pudong New Area. |
| List of Tables |
| 2.1. |
Guiding Principals for the Tenth Five-Year Plan for National Economic and Social Development (2001-2005) |
| 2.2. |
China’s Economic Performance |
| 2.3. |
Economic Performance in SEZs |
| 3.1. |
China’s Optoelectronic Landscape |
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