TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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We publish a series of multi-client reports in the semicondutor packaging field.
The table of contents for each report may be viewed on our web site or you may download a pdf file.
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Upcoming reports
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2008 Flip Chip and Wafer Level Packaging
Market and Technology Trends
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Published Reports (listed chronologically)
- Through Silicon Via Technology: The Ultimate Market for 3D Interconnect - 2008
- Vol.4, 2007: Advanced Packaging Update: Market and technology trends
- Vol.3, 2007: Advanced Packaging Update: Market and technology trends
- India: The Next Stop for Package Assembly and Manufacturing
- Embedded Active Components and Integrated Passives: Technologies & Markets
- Vol.2, 2007: Advanced Packaging Update: Market and technology trends
- Vol.1, 2007: Advanced Packaging Update: Market and technology trends
- Vol.4, 2006: Advanced Packaging Update: Market and technology trends
- Vol.3, 2006: Advanced Packaging Update: Market and technology trends
- Flip Chip and WLP: 2006 Market: Update and Technology Developments - 2006
- Vol.2, 2006: Advanced Packaging Update: Market and technology trends
- Vol.1, 2006: Advanced Packaging Update: Market and technology trends
- 3D Integration at the Wafer Level
- Q4, 2005: Advanced Packaging Update: Market and technology trends
- Q3, 2005: Advanced Packaging Update: Market and technology trends
- Low-Cost RFID IC Packaging and Assembly Workshop: Munich, Germany
- System-in-Package: The New Wave in 3D Packaging
- Q2, 2005: Advanced Packaging Update: Market and technology trends
- Q1, 2005: Advanced Packaging Update: Market and technology trends
- Low-Cost RFID IC Packaging and Assembly: Highway to a 5-cent RFID Tag
- Q4, 2004: Advanced Packaging Update: Market and technology trends
- Flip Chip and Wafer Level Packaging Trends and Market Forecasts - 2004
- Q3, 2004: Advanced Packaging Update: Market and technology trends
- Q2, 2004: BGA/CSP Development Update Service
- MEMS Markets: Challenges for Packaging and Assembly
- Q1, 2004: BGA/CSP Development Update Service
- Q4, 2003: BGA/CSP Development Update Service
- Q3, 2003: BGA/CSP Development Update Service
- Q2, 2003: BGA/CSP Development Update Service
- Q1, 2003: BGA/CSP Development Update Service
- Flip Chip and Wafer Level Packaging Market Analysis
- Q4, 2002: BGA/CSP Development Update Service
- Q3, 2002: BGA/CSP Development Update Service
- Q2, 2002: BGA/CSP Development Update Service
- Q1, 2002: BGA/CSP Development Update Service
- Optoelectronic Manufacturing Infrastructure in China
- Third Optoelectronics Packaging Workshop
- Q4, 2001: BGA/CSP Development Update Service
- Q3, 2001: BGA/CSP Development Update Service
- Second Optoelectronics Packaging Workshop
- Q2, 2001: BGA/CSP Development Update Service
- Flip Chip Markets and Infrastructure Developments
- Q1, 2001: BGA/CSP Development Update Service
- First Optoelectronics Packaging Workshop
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Subscription service.
Issued monthly.
Electronic format.
- lead-free materials
- applications
- reliability data
- lead-free bumping
- Japanese articles
- journal articles
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