Advanced Packaging Update:
Market and Technology Trends

The Advanced Packaging Update features special coverage of market and technology developments for BGAs. CSPs, stacked die CSPs, flip chip, and wafer level packages. Each issue includes new applications, developments in materials and assembly equipment, and new package constructions.

Topics covered include:

• Stacked die CSP trends
• Packaging trends for portable products such as mobile phones including color photos and details of components
• Assembly issues for silicon with low-k dielectrics
• DRAM packaging trends
• Reliability test methods and test results
• New materials including substrates, solder balls, and encapsulants
• Substrate capacity
• Developments in lead-free packaging
• New wafer level packages

Each year, the fourth quarter report provides the annual five-year market forecast based on data reported from semiconductor makers and contract assembly houses. The forecast is broken out by package type. Included are forecast for PBGAs, TBGAs, CBGAs/CCGAs, laminate CSPs, tape/flex CSPs, leadframe CSPs, and wafer level packages. The second quarter report provides an annual update of assembly price trends and flip chip substrate suppliers.

These reports can be purchased in print or pdf file format and may be purchased as individual issues ($950) or as a yearly subscription ($3200).