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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 4-010
This issue of the Advanced Packaging Update features special coverage of the market with a forecast for units of BGAs and CSPs by package construction. The BGA market is divided into plastic, tape, and ceramic structures. The CSP market is divided into laminate, flex circuit, and leadframe substrates. Unit growth projections for shipments of stacked die CSP, package-on-package (PoP), and package-in-package (PiP) are provided. Estimates of the market for each package type are based on input from both captive and merchant assembly operations. Key applications and drivers for unit volume growth are highlighted. An analysis of the impact of the tragic events in Japan on the electronics industry infrastructure is also included. A special section provides insights into automotive packaging.
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Advanced Packaging Update: Market and Technology Trends
Vol. 4-010 |
| File size: 340kb |
Published: April 2011. |
| Table of Contents |
| 1 |
Industry and Economic Trends |
| 1.1 |
Events in Japan and the Supply Chain |
| 1.2 |
Economic Trends |
| 1.3 |
Semiconductor Recovery |
| 2 |
BGA Applications and Market Growth |
| 2.1 |
Personal Computers |
| 2.2 |
Game Machines |
| 2.3 |
Network Systems, Telecom, and Servers |
| 2.4 |
BGA Market Projections |
| 3 |
CSP Applications and Market Growth |
| 3.1 |
Mobile Phones |
| 3.2 |
Tablets |
| 3.3 |
Portable Games, Digital Cameras, iPods |
| 3.4 |
Leadframe CSPs |
| 3.5 |
Laminate and Flex Circuit CSPs |
| 3.6 |
Stacked Die CSPs |
| 3.6.1 |
Amkor Technology, Inc. |
| 3.6.2 |
Fujitsu, Ltd. |
| 3.6.3 |
Hynix Semiconductor, Inc. |
| 3.6.4 |
Micron Technology, Inc |
| 3.6.5 |
NXP Semiconductors N.V. |
| 3.6.6 |
Powertech Technology, Inc. |
| 3.6.7 |
Samsung Electronics, Co., Ltd. |
| 3.6.8 |
STATS ChipPAC, Ltd. |
| 3.6.9 |
ST-Ericsson |
| 3.6.10 |
Toshiba Semiconductor Company |
| 3.7 |
CSP Market Projections |
| 4 |
Developments in Automotive Packaging |
| 4.1 |
Automotive Packages |
| 4.2 |
Automotive Package Reliability |
| 4.3 |
Update on Japan |
| 4.4 |
Company Activities |
| 4.4.1 |
Advanced Semiconductor Engineering, Inc. (ASE) |
| 4.4.2 |
Amkor Technology, Inc. |
| 4.4.3 |
Denso Corporation |
| 4.4.4 |
Hitachi, Ltd. |
| 4.4.5 |
NXP Semiconductors N.V. |
| 4.4.6 |
ON Semiconductor |
| 4.4.7 |
Renesas Electronics Corporation |
| 4.4.8 |
Robert Bosch GmbH |
| 4.4.9 |
Texas Instruments, Inc. |
|
2010 BGA and CSP Bibliography |
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References |
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| List of Figures |
| 1.1. |
Monthly U.S. housing starts. |
| 1.2. |
Subcontractor share of CSP market in 2010. |
| 2.1. |
Flip chip as a percentage of PBGA shipments (2010). |
| 2.2. |
Subcontractor growth in PBGA shipments. |
| 3.1. |
Samsung Galaxy main board. |
| 3.2. |
Main devices on Apple's iPod Touch4 board. |
| 3.3. |
LFBGA leadframe CSP. |
| 3.4. |
Design trends of Toshiba's stacked die in BGAs. |
| 3.5. |
Toshiba's memory packaging roadmap. |
| 3.6. |
PoP market projections (millions of units). |
| 3.7. |
Subcontract assembly growth in CSPs. |
| 4.1. |
Automotive uses for electronics. |
| 4.2. |
Packages for automotive devices. |
| 4.3. |
AEC Q100 qualification test flow. |
| 4.4. |
Denso accelerometer package. |
| 4.5. |
IGBT power module for automotive applications. |
| 4.6. |
Improved cooling for automotive power module. |
| 4.7. |
Water-cooling assembly for automotive power module. |
| 4.8. |
Package trends for Renesas' automotive power devices. |
| 4.9. |
LFPAK and "wireless" assembly for automotive power devices. |
| 4.10. |
Package trends for automotive mixed signal devices. |
| 4.11. |
HQFN Pro-Quad for improved automotive reliability. |
| 4.12. |
WLP for ECU. |
| List of Tables |
| 2.1. |
BGA Market Projections (millions of units) |
| 3.1. |
CSPs in Smartphones |
| 3.2. |
Examples of CSPs on Apple s iPhone4 Main Board |
| 3.3. |
CSPs in Tablets |
| 3.4. |
Die Stacks and Device Types in Production at Amkor |
| 3.5. |
Mobile Memory Packages at Hynix |
| 3.6. |
Die Stacks and Device Types in Production at Micron |
| 3.7. |
Die Stacks and Device Types in Production at NXP |
| 3.8. |
Die Stacks and Device Types in Production at PTI |
| 3.9. |
Stacked-Die Package Thicknesses in Production at Samsung |
| 3.10. |
Die Stacks and Device Types in Production at STATS ChipPAC |
| 3.11. |
Die Stacks and Device Types in Production at ST-Ericsson |
| 3.12. |
Toshiba Semiconductor Divisions and Packaging Strategies |
| 3.13. |
CSP Market Projections (millions of units) |
| 3.14. |
Subcontractor CSP Shipments (millions of units) |
| 4.1. |
Automotive Semiconductor Solutions Combine Sense, Compute, and Actuate |
| 4.2. |
Package Requirements for Automotive Applications |
| 4.3. |
Summary of AEC Q100 Reliability Tests |
| 4.4. |
Automotive Packages in Production at Amkor |
| 4.5. |
Denso's Automotive Applications and Devices |
| 4.6. |
Automotive Packages in Production at ON Semiconductor |
| 4.7. |
Reliability Test Results for WLP ECU |
| 4.8. |
Automotive Packages in Production at Robert Bosch |
| 4.9. |
TI Automotive Packages by Device Type |
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