TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 4-009
Volume 4 of the Advanced Packaging Update features special coverage of the market with a forecast for units of BGAs and CSPs by package construction. The BGA market is divided into plastic, tape, and ceramic structures. The CSP market is divided into laminate, flex circuit, and leadframe substrates. Unit growth projections are also provided for stacked die CSP and package-on-package (PoP) shipments. Shipments of package-in-package (PiP) are also included. The market for each package type is based on input from both captive and merchant assembly operations. Key applications and drivers for unit volume growth are highlighted. An economic analysis examines macroeconomic trends and the impact on the semiconductor packaging and assembly industry. A special section is devoted to an examination of alternatives to through silicon via (TSV). The section includes Proximity Computing, developed by Sun Microsystems (now owned by Oracle), stacking technology from Vertical Circuits and 3D Plus, and the deep silicon via technology developed by Jazz Semiconductor (now TowerJazz).
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Advanced Packaging Update: Market and Technology Trends
Vol. 4-009 |
| File size: 48.3kb |
Published: April 2010. |
| Table of Contents |
| 1 |
Industry and Economic Trends |
| 1.1 |
Economic Trends |
| 1.2 |
Semiconductor Recovery |
| 2 |
BGA Applications and Market Growth |
| 2.1 |
Personal Computers |
| 2.2 |
Game Machines |
| 2.3 |
Network Systems, Telecom, and Servers |
| 2.4 |
BGA Market Projections |
| 3 |
CSP Applications and Market Growth |
| 3.1 |
Mobile Phones |
| 3.2 |
Portable Games and Digital Cameras |
| 3.3 |
Leadframe CSPs |
| 3.4 |
Laminate and Flex Circuit CSPs |
| 3.5 |
Stacked Die CSPs |
| 3.5.1 |
Amkor Technology, Inc. |
| 3.5.2 |
Freescale Semiconductor |
| 3.5.3 |
Fujitsu Integrated Microtechnology, Ltd. |
| 3.5.4 |
Powertech Technology, Inc. |
| 3.5.5 |
Renesas Electronics Corporation |
| 3.5.6 |
SanDisk Corporation |
| 3.5.7 |
Siliconware Precision Industries Co., Ltd. |
| 3.5.8 |
Sony Electronics, Inc. |
| 3.5.9 |
STATS ChipPAC, Ltd. |
| 3.6 |
CSP Market Projections |
| 4 |
Alternatives to TSV |
| 4.1 |
Proximity Communication |
| 4.1.1 |
Advantages and Challenges |
| 4.1.2 |
Demonstration Prototypes |
| 4.1.3 |
Package Assembly |
| 4.1.3.1 |
Alignment |
| 4.1.3.2 |
ClawConnect |
| 4.1.3.3 |
Cooling |
| 4.1.4 |
Optical Integration |
| 4.1.5 |
Conclusion |
| 4.2 |
TowerJazz |
| 4.3 |
3D Plus |
| 4.4 |
Vertical Circuits, Inc. |
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2009 BGA and CSP Bibliography |
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References |
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| List of Figures |
| 1.1. |
Subcontractor share of CSP market in 2009. |
| 2.1. |
Apple's WiFi iPad. |
| 2.2. |
AUS EeePC. |
| 2.3. |
Flip chip as a percentage of PBGA shipments. |
| 2.4. |
Subcontractor growth in PBGA shipments. |
| 3.1. |
Two-die top PoP memory stack with 0.45mm nominal thickness. |
| 3.2. |
Fujitsu's technology roadmap. |
| 3.3. |
Fujitsu CoC. |
| 3.4. |
Sony's CoC. |
| 3.5. |
PoP market projections (millions of units). |
| 3.6. |
Subcontract assembly growth in CSPs. |
| 4.1. |
Solid model of PxC demonstration vehicle. |
| 4.2. |
Etched inverse pyramid hole for PxC alignment. |
| 4.3. |
ClawConnect contacts for removable chip connection. |
| 4.4. |
CMOS chips prepared for alignment in optical/PxC module. |
| 4.5. |
CMOS chips in BGA package secured by a spring clip. |
| 4.6. |
SBC18 SiGe PA with DSV. |
| 4.7. |
WDoD process flow. |
| 4.8. |
Volume comparison of WDoD and PoP. |
| 4.9. |
Vertical Circuits' VIP die stack. |
| 4.10. |
Vertical Circuits' sixteen-chip terraced stack. |
| List of Tables |
| 2.1. |
BGA Market Projections (millions of units) |
| 3.1. |
CSPs in Smartphones |
| 3.2. |
Examples of CSPs on Apple s iPhone 3G S Main Board |
| 3.3. |
Die Stacks and Device Types in Production at Amkor |
| 3.4. |
Die Stacks and Device Types in Production at Freescale |
| 3.5. |
Die Stacks and Device Types in Production at PTI |
| 3.6. |
Advantages of Various Package Configurations |
| 3.7. |
Die Stacks and Device Types in Production at STATS ChipPAC |
| 3.8. |
CSP Market Projections (millions of units) |
| 3.9. |
Subcontractor CSP Shipments (millions of units) |
| 4.1. |
Package Dimensions and Materials for PxC Demonstration Vehicle |
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