Welcome to TechSearch International, Inc.

	home

	reports

	advanced packaging

	Vol. 1, 2009

	single client

	technology licensing

	about us

	industry links

TechSearch
International, Inc.
•
4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
•
Tel: 512.372.8887
Fax: 512.372.8889

ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 1, 2009

Volume 1 of the Advanced Packaging Update for 2009 features an update on industry and economic trends for the semiconductor packaging and assembly industry focusing on packaging trends that are driving growth. An analysis of the 300mm wafer level packaging capacity shortage is provided. A special section is devoted to recent developments in embedded components. An in-depth MEMS packaging update is also included, with special focus on microphones, micro-mirror projectors, RF MEMS, and future medical MEMS. New package developments and trends are also discussed, including increasing concerns about alpha particle emissions in packaging materials and the impact on reliability in high-performance applications.

	Advanced Packaging Update: Market and Technology Trends Vol. 1, 2009
File size: 56.0 kb		Published: June 2009.

Table of Contents
1	Industry and Economic Trends
1.1	Economic Trends
1.2	Japan's Economy
1.3	Semiconductor Packaging and Assembly
1.3.1	Increased Demand for WLPs Outstrips Capacity
2	Embedded Components Update
2.1	Formed Passive Components
2.1.1	3M C-Ply
2.1.2	DuPont
2.1.2.1	Interra™ PI-R
2.1.2.2	Pyralux® APR
2.1.2.3	Interra™ HK-04
2.1.2.4	Interra™ 310-320
2.1.3	Oak-Mitsui
2.1.4	DKN Research and NY Industries
2.2	Embedded Discrete Components
2.2.1	Imbera Electronics
2.2.2	Oki Printed Circuits
2.2.3	Schweizer Electronic AG
2.2.4	Shinko Electric
2.2.5	Shocking Technologies
2.2.6	Würth Elektronik
3	MEMS Packaging Update
3.1	MEMS Market Overview
3.2	MEMS Packaging and Challenges
3.2.1	Environmental Requirements
3.2.1.1	Accelerometer Reliability under HAST
3.2.2	Cap Bonding
3.2.2.1	SUSS MicroTec's Review of Wafer Bonding
3.2.2.2	EVG's Low Temperature Wafer Bonding Evaluation
3.2.3	MEMS Package Assemblers
3.2.3.1	Advanced Semiconductor Engineering, Inc. (ASE)
3.2.3.2	Amkor Technology, Inc.
3.2.3.3	ASAT, Inc.
3.2.3.4	Carsem, Inc.
3.2.3.5	Kyocera America, Inc.
3.2.3.6	Misuzu Industries Co.
3.2.3.7	Tong Hsing Electronic Industries, Ltd.
3.2.3.8	Tronics Microsystems SA
3.3	Packaging for Selected Applications
3.3.1	MEMS Microphones
3.3.1.1	Knowles Electronics
3.3.1.2	Akustica
3.3.1.3	Infineon/Hosiden
3.3.1.4	Analog Devices
3.3.1.5	Pulse Engineering, Inc.
3.3.1.6	Wolfson Microelectronics
3.3.1.7	Yamaha Corporation
3.3.2	Micro-Mirror Projectors
3.3.2.1	Lemoptix
3.3.2.2	Microvision, Inc.
3.3.2.3	Miradia, Inc.
3.3.2.4	Texas Instruments' DLP Chip
3.3.3	RF MEMS
3.3.3.1	Omron Electronic Components LLC
3.3.3.2	RadantMEMS, Inc.
3.3.3.3	Raytheon Company
3.3.3.4	WiSpry, Inc.
3.3.3.5	XCOM Wireless, Inc.
3.3.4	Future Applications: Medical MEMS
3.3.4.1	CardioMEMS, Inc.
3.3.4.2	Proteus Biomedical, Inc.
4	New Package Developments
4.1	Soft Error Rates for Packaging Materials

	Appendix: MEMS Assembly Vendors
	References

List of Figures
1.1.	Monthly U.S. housing starts.
1.2.	WLP capacity for 300mm wafers.
2.1.	Removal of SMT caps on high speed digital board.
2.2.	TCR power density versus resistor area.
2.3.	HK-04 maximizes signal routing efficiency.
2.4.	Advanced screen printed conductors and passive components.
2.5.	Third generation IMB manufacturing process.
2.6.	Cross-section of embedded component module board.
2.7.	Schweizer iBoard interposer.
2.8.	Cross-sectional view of embedded component with iBoard.
2.9.	High magnification image of embedded component.
2.10.	Process flow for MCeP.
2.11.	PoP versus MCeP.
2.12.	ESD protection with X-Static™.
2.13.	Lasercavity with embedded die.
3.1.	MEMS device market by revenue and units (2006 to 2013).
3.2.	Freescale's MEMS accelerometer on a QFN leadframe.
3.3.	MEMS packages assembled by Amkor.
3.4.	MEMS package types and applications.
3.5.	MEMS package considerations.
3.6.	Amkor MEMS packaging solutions.
3.7.	SiSonic MEMS microphones.
3.8.	Akustica's single-chip digital microphone and package.
3.9.	Akustica's single-chip analog microphone and package.
3.10.	Infineon's original SMM310 analog microphone.
3.11.	ADI's digital MEMS microphone.
3.12.	Package drawing for Analog Devices' analog MEMS microphone.
3.13.	Pulse Engineering's MEMS microphone CSP.
3.14.	Wolfson's True Mic.
3.15.	Lemoptix's scanning micro-mirror.
3.16.	Microvision's single-mirror MEMS projector.
3.17.	Microvision's integrated photonics module.
3.18.	Microvision's SHOW WX handheld projector.
3.19.	Pocket projector from Optoma showing DMD projector module.
3.20.	Open projector module with DMD package at top right.
3.21.	Package for TI's DMD.
3.22.	Samsung W7900 Show projector phone.
3.23.	Bonding process for Omron's RF MEMS switch.
3.24.	Omron's RF MEMS switch.
3.25.	Radant's RF MEMS switch.
3.26.	Radant's capped RF MEMS switch.
3.27.	Raytheon's RF switch with glass lid.
3.28.	XCOM's hermetic package for RF MEMS.
3.29.	Proteus Biomedical's ingestible event marker.
3.30.	Electronics protected by Proteus Biomedical's ChipSkin™.
4.1.	Distance of soft error from eutectic bump center.
4.2.	Superimposed map of soft errors.
4.3.	Distance of soft error from high-Pb bump center.

List of Tables
2.1.	Properties of 1- and 2-mil AP Material
2.2.	Representative Pyralux® APR Product Offerings
2.3	Properties of New Capacitor Material
3.1	MEMS Packaging Tradeoffs
3.2.	Common Metal Diffusion Methods
3.3.	Selected Manufacturers of MEMS Microphones
3.4.	Comparison of RF MEMS Switches and Other Switch Technologies