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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 3, 2008
Volume 3 of the Advanced Packaging Update for 2008 features an economic outlook for 2009 including an assembly and packaging equipment forecast. A special section is devoted to packaging for solid state drives. Examples of products are provided with photos. New through silicon via (TSV) developments are also described. Research results are provided for ASET (the Japanese government consortium), NEC, and Honda. Photos and manufacturing process flow details are provided for Toshiba’s image sensor with TSV found in a Nokia mobile phone. Another special section is devoted to packaging for high-brightness light emitting diodes (LEDs).
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Advanced Packaging Update: Market and Technology Trends
Vol. 3, 2008 |
| File size: 50.4 kb |
Published: December 2008. |
| Table of Contents |
| 1 |
Economic Outlook |
| 2 |
Packaging for Solid State Drives |
| 2.1 |
Pros and Cons of SSD Technology |
| 2.2 |
SSD Price |
| 2.3 |
SSD Markets |
| 2.4 |
SSD Packaging |
| 2.5 |
Hybrid Hard Drive |
| 2.6 |
Corporate Overview |
| 2.6.1 |
Amkor Technology |
| 2.6.2 |
Fujitsu |
| 2.6.3 |
Intel Corporation |
| 2.6.4 |
Micron |
| 2.6.5 |
Samsung Electronics Co., Ltd. |
| 2.6.6 |
SanDisk Corporation |
| 2.6.7 |
Seagate Technology, LLC |
| 2.6.8 |
STATS ChipPAC, Ltd. |
| 2.6.9 |
STEC, Inc. |
| 2.6.10 |
Toshiba |
| 3 |
New TSV Developments |
| 3.1 |
ASET Announces Research Results |
| 3.2 |
Toshiba's Image Sensor with TSV Technology |
| 3.3 |
Honda Research Institute's Wafer-to-Wafer Stacking TSV |
| 3.4 |
NEC's Silicon Interposer with TSVs |
| 4 |
Packaging High-Brightness LEDs |
| 4.1 |
Markets for LEDs |
| 4.2 |
LED Packaging |
| 4.2.1 |
Thermal Considerations |
| 4.2.2 |
Optical Considerations |
| 4.2.3 |
LED Packaging Materials |
| 4.2.4 |
Flip Chip for LEDs |
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| List of Figures |
| 1.1. |
Semiconductor packaging and test subcontractor sales. |
| 1.2. |
Semiconductor packaging and test subcontractor CAPEX. |
| 1.3. |
Copper price trends. |
| 1.4. |
Gold price trends. |
| List of Tables |
| 1.1. |
Assembly and packaging equipment forecast (billions of dollars). |
| 2.1. |
Examples of a) hard disk drive and b) solid state drive. |
| 2.2. |
ONFi's proposed 100-lead BGA standard. |
| 2.3. |
Staircase stack from Hynix Semiconductor. |
| 2.4. |
Intel's X25 and X18 SSDs. |
| 2.5. |
Intel's X25 drive. |
| 2.6. |
SanDisk's SSD 5000 product family. |
| 2.7. |
SanDisk's embedded pSSD module. |
| 2.8. |
STEC's SSD product roadmap. |
| 2.9. |
Toshiba's SSD. |
| 3.1. |
Toshiba's CSCM with TSV. |
| 3.2. |
CSCM manufacturing process flow. |
| 3.3. |
Multi-layer stacking process. |
| 3.4. |
TSV structure mounted on PCB. |
| 4.1. |
LED package mounted on aluminum core board. |
| 4.2. |
Flip chip mounted high-power LED package. |
| 4.3. |
High-power LED package. |
| 4.4. |
LEDs with COB. |
| 4.5. |
T-Clad metal core substrate. |
| 4.6. |
Initial LED packaging approach. |
| 4.7. |
Flip chip LED. |
| 4.8. |
TFFC LED assembly with sapphire removed. |
| 4.9. |
LuxeonŽ K2 with a TFFC LED. |
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