TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 1, 2008
Volume 1 of the Advanced Packaging Update for 2008 features an economic outlook with a discussion of the impact of higher energy prices. Also featured are package trends and roadmaps for products driving the growth in advanced packaging. Unit volume projections for advanced package growth are included. Package trends for notebook computers, mobile phones, and digital cameras are provided with details of the package types, I/O counts, minimum pitch, and package dimensions. Special sections are devoted to flash memory packaging trends and packaging for power devices. Also included are new developments in 3D packaging, including stacked die packaging, package-on-package (PoP), and through silicon via (TSV) technology.
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Advanced Packaging Update: Market and Technology Trends
Vol. 1, 2008 |
| File size: 63.4 kb |
Published: May 2008. |
| Table of Contents |
| 1 |
Economic Outlook |
| 2 |
Drivers for Advanced Packaging Growth |
| 2.1 |
Notebook Computers |
| 2.2 |
Mobile Phones and Digital Cameras |
| 2.3 |
Digital AV Products |
| 3 |
3D Package Developments |
| 3.1 |
PoP |
| 3.1.1 |
Amkor's Through Mold Via Technology |
| 3.1.2 |
STATS ChipPAC's Fan-In PoP |
| 3.1.3 |
Material Developments for Package Stacking |
| 3.2 |
3D TSV |
| 3.2.1 |
TSMC's Announcement |
| 4 |
Flash Memory Packaging Trends |
| 4.1 |
Flash Memory Applications and Suppliers |
| 4.1.1 |
Hana Micron |
| 4.1.2 |
PowerTech Technology, Inc. |
| 4.2 |
Flash Memory Packages |
| 5 |
Power Devices |
| 5.1 |
Packaging for Power Discrete Devices and Power ICs |
| 5.2 |
Power Module Packaging |
| 5.3 |
Future Growth |
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| List of Figures |
| 2.1. |
Advanced package growth as a percentage of total IC market. |
| 3.1. |
PoP size reduction benefits with TMV™. |
| 3.2. |
Fully molded PoP base package with TMV™ technology. |
| 3.3. |
TMV™ warpage measurements. |
| 3.4. |
Fan-In PoP. |
| 3.5. |
Drop test data for PoP devices. |
| 4.1. |
Hana Micron's flash package roadmap. |
| 4.2. |
PTI's flash package roadmap. |
| 4.3. |
Toshiba's 2GB miniSD. |
| 4.4. |
Flash memory packaging trends by package type. |
| 5.1. |
Package options for automotive power devices. |
| 5.2. |
Characteristics of molding compounds for power devices. |
| 5.3. |
Cross-section of an IGBT/diode module. |
| 5.4. |
IGBT/diode power module. |
| 5.5. |
Infineon's HybridPACK™1 IGBT/diode power module. |
| 5.6. |
Infineon's HybridPACK™2 IGBT/diode power module. |
| 5.7. |
SEMIPACK1 power module. |
| 5.8. |
Base plate comparison. |
| 5.9. |
SKiiP power module. |
| 5.10. |
SKiN module cross-section. |
| 5.11. |
Semikron Electronik SKiN concept. |
| List of Tables |
| 2.1. |
Package Trends for Notebook Computers |
| 2.2. |
Semiconductor Packaging Requirements for Notebooks |
| 2.3 |
Package Trends for Mobile Phones and DVCs |
| 2.4 |
Package Trend for DSCs |
| 2.5 |
Package Trends for Memory and HDD in DSCs |
| 4.1 |
Flash Memory Makers |
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