TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 4, 2007
Volume 4 of the Advanced Packaging Update for 2007 features special coverage of the market with a forecast for units of BGAs and CSPs by package construction. The BGA market is divided into plastic, tape, and ceramic structures. The CSP market is divided into laminate, flex circuit, and leadframe substrates. Unit growth projections are also provided for stacked die CSP and package-on-package (PoP) shipments. A market growth analysis based on input from both captive and merchant assembly operations is provided. Key applications and drivers for unit volume and revenue growth are highlighted. New package developments include embedded ESD protection from Shocking Technologies and SCI-Sanmina Corporation.
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Advanced Packaging Update: Market and Technology Trends
Vol. 4, 2007 |
| File size: 54.9 kb |
Published: March 2008. |
| Table of Contents |
| 1 |
Industry and Economic Trends |
| 1.1 |
Economic Trends |
| 1.2 |
Semiconductor Packaging and Assembly |
| 1.3 |
Semiconductor Packaging Material Prices |
| 2 |
BGA Applications and Market Growth |
| 2.1 |
Personal Computers |
| 2.2 |
Game Machines |
| 2.3 |
Workstation/Servers, Network Systems, and Telecommunications |
| 2.4 |
BGA Market Projections |
| 3 |
CSP Applications and Market Growth |
| 3.1 |
Mobile Phones |
| 3.2 |
Leadframe CSPs |
| 3.3 |
Laminate and Flex Circuit CSPs |
| 3.4 |
Wafer Level Packages |
| 3.5 |
Stacked Die and Package-on-Package |
| 3.5.1 |
Stacked Die CSPs |
| 3.5.2 |
Package-on-Package |
| 3.5.3 |
Corporate Overview |
| 3.5.3.1 |
Amkor Technology |
| 3.5.3.2 |
ASAT, Inc. |
| 3.5.3.3 |
ASE, Inc. |
| 3.5.3.4 |
Fujitsu Microelectronics |
| 3.5.3.5 |
NEC |
| 3.5.3.6 |
NXP Semiconductors |
| 3.5.3.7 |
Renesas Technology Corporation |
| 3.5.3.8 |
Siliconware Precision Industries Co., Ltd. |
| 3.5.3.9 |
STATS ChipPAC Ltd. |
| 3.5.3.10 |
STMicroelectronics |
| 3.5.3.11 |
UTAC |
| 3.5.3.12 |
Other Stacking Options |
| 3.5.3.12.1 |
Irvine Sensors |
| 3.5.3.12.2 |
3D Plus |
| 3.5.3.12.3 |
Vertical Circuits, Inc. |
| 3.6 |
CSP Market Projections |
| 4 |
New Package Developments |
| 4.1 |
Shocking Technologies and Sanmina-SCI |
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2007 BGA and CSP Bibliography |
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References |
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| List of Figures |
| 1.1. |
Semiconductor packaging and test subcontractor sales. |
| 1.2. |
Semiconductor packaging and test subcontractor CAPEX. |
| 1.3. |
Copper price trends. |
| 1.4. |
Gold price trends. |
| 2.1. |
Graphics card. |
| 2.2. |
Apple's MacBook Air. |
| 2.3. |
Dell PowerEdge server board. |
| 2.4. |
BGAs and CSPs in Nintendo's Wii. |
| 2.5. |
Flip chip as a percentage of PBGA shipments. |
| 2.6. |
Subcontractor growth in PBGA shipments. |
| 3.1. |
Apple's iPhone boards with CSPs. |
| 3.2. |
P905i main board. |
| 3.3. |
Nokia N77. |
| 3.4. |
Amkor's FusionQuad!". |
| 3.5. |
Chip-on-chip technology. |
| 3.6. |
SiP with flip chip and wire bond interconnect. |
| 3.7. |
System-in-stack technology. |
| 3.8. |
Typical tier. |
| 3.9. |
WDoD. |
| 3.10. |
PoP market projections (millions of units). |
| 3.11. |
Subcontract assembly growth in CSPs. |
| 4.1. |
ESD protection with X-Static!" |
| 4.2. |
SuperBC!"schematic structure. |
| List of Tables |
| 1.1 |
Semiconductor Packaging Materials Market |
| 2.1 |
BGA Market Projections (millions of units) |
| 3.1. |
CSPs in Nokia's N77 Mobile Phone |
| 3.2. |
Stacked Die Thickness at Selected Companies |
| 3.3. |
Trade-offs of Stacked Die, PoP and System on Chip |
| 3.4. |
Trends in Number of Stacked Die at Amkor |
| 3.5. |
Trends in Devices and Applications at Amkor |
| 3.6. |
Reliability Tests for Stacked Die Packages at Amkor |
| 3.7. |
Stacked Die Packages at ASAT |
| 3.8. |
Trends in Number of Stacked Die at ASE |
| 3.9. |
Trends in Devices and Applications at ASE |
| 3.10. |
Trends in Number of Stacked Die at STATS ChipPAC |
| 3.11. |
Trends in Devices and Applications at STATS ChipPAC |
| 3.12. |
Reliability Tests for FBGA-SD Packages at STATS ChipPAC |
| 3.13. |
Reliability Tests for PoP at STATS ChipPAC |
| 3.14. |
Trends in Devices and Applications at UTAC |
| 3.15. |
CSP Market Projections (millions of units) |
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