| List of Tables |
| 1.1. |
Average QFP Assembly Prices (1 million/month) |
| 1.2. |
QFP Assembly Prices |
| 1.3. |
Average Wire Bond PBGA Assembly Prices (1 million/month) |
| 1.4. |
Average Flip Chip PBGA Assembly Prices (including substrate) |
| 1.5. |
Average Laminate CSP Assembly Prices |
| 1.6. |
Average Wire Bond Leadframe CSP Assembly Prices |
| 2.1. |
Properties of Build-up Material in Build-up Substrates |
| 2.2. |
Properties of Core Material for Build-up Substrates |
| 2.3. |
Build-up Substrate Dimensions |
| 2.4. |
Build-up Substrate Conductive Layer Specifications |
| 2.5. |
Via Structure Specifications |
| 2.6. |
Solder Mask Specification for Build-up Substrate |
| 2.7. |
Build-up Substrate Impedance |
| 2.8. |
Coreless Build-up Substrate Specifications |
| 3.1. |
Selected Build-up Flip Chip Substrate Suppliers |
| 3.2. |
Selected Laminate PBGA/CSP Substrate Suppliers |
| 3.3. |
Design Rules for ASE Flip Chip Substrates |
| 3.4. |
Design Rules for ASE PBGA/CSP Substrates |
| 3.5. |
Design Rules for Daisho Denshi PBGA/CSP Substrates |
| 3.6. |
Design Rules for Eastern PBGA/CSP Substrates |
| 3.7. |
Design Rules for Endicott Interconnect CoreEZ!" Substrates |
| 3.8. |
Design Rules for Endicott Interconnect HyperBGA!" Substrate |
| 3.9. |
Design Rules for FICT's Flip Chip Substrates |
| 3.10. |
Design Rules for JCI CSP Substrates |
| 3.11. |
Design Rules for Kinsus Flip Chip Substrates |
| 3.12. |
Design Rules for Kinsus PBGA/CSP Substrates |
| 3.13. |
Design Rules for Kyocera Flip Chip Substrates |
| 3.14. |
Design Rules for Microcircuit PBGA/CSP Substrates |
| 3.15. |
Mitsui Chemicals PBGA/CSP Substrate Properties |
| 3.16. |
Design Rules for Nan Ya PCB Flip Chip Substrates |
| 3.17. |
Design Rules for TNCSi Flip Chip Substrates |
| 3.18. |
Design Rules for NTK Flip Chip Substrates |
| 3.19. |
Design Rules for PPT Flip Chip Substrates |
| 3.20. |
Design Rules for PPT PBGA/CSP Substrates |
| 3.21. |
Design Rules for Samsung's PBGA/CSP Substrates |
| 3.22. |
Design Rules for Samsung Techwin's BOC Substrates |
| 3.23. |
Design Rules for Shinko Flip Chip Substrates |
| 3.24. |
Design Rules for Shinko PBGA/CSP Substrates |
| 3.25. |
Design Rules for Simmtech PBGA/CSP Substrates |
| 3.26. |
SMM-Shinko's Design Rules for CSP Substrates |
| 3.27. |
Design Rules for Toppan Printing Flip Chip Substrates |
| 3.28. |
Design Rules for Tripod's PBGA/CSP Substrates |
| 3.29. |
Design Rules for Unimicron Flip Chip Substrates |
| 3.30. |
Design Rules for Unimicron PBGA/CSP Substrates |
