TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 1, 2007
Volume 1 of the Advanced Packaging Update for 2007 features an assessment of laminate substrate capacity including an analysis of supply and demand. An analysis of the flip chip substrate over-capacity situation and the impact on prices is provided. Capacity has been calculated based on a survey of major worldwide suppliers of laminate flip chip substrates. Capacity for wire bond PBGAs and laminate CSPs is also reported. Data from 27 companies making laminate substrates was compiled for the report. A section of the report is devoted to new package-on-package (PoP) developments. Included are developments from Amkor, ASE, IBM Japan, NEC, SPIL, STATSChipPac, Staktek, Tessera, and Texas Instruments. Special sections on IC package contact assembly operations in China and manufacturing operations in India are included. Analysis of popular inexpensive mobile phones made in India reveals the use of advanced packaging, including CSPs, SiPs, and wafer level packages.
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Advanced Packaging Update: Market and Technology Trends
Vol. 1, 2007 |
| File size: 61.8 kb |
Published: May 2007. |
| Table of Contents |
| 1 |
Laminate Substrate Supply and Demand |
| 1.1 |
Flip Chip Build-up Substrate Supply and Demand |
| 1.2 |
PBGA and CSP Substrates |
| 2 |
New Developments in PoP |
| 2.1 |
Amkor Technology |
| 2.2 |
Advanced Semiconductor Engineering |
| 2.3 |
IBM Japan |
| 2.4 |
NEC |
| 2.5 |
Samsung |
| 2.6 |
Siliconware Precision Industries |
| 2.7 |
Staktek |
| 2.8 |
STATSChipPAC |
| 2.9 |
Tessera |
| 2.10 |
Texas Instruments |
| 3 |
IC Package Assembly in China |
| 3.1 |
Amkor Technology |
| 3.2 |
ASAT |
| 3.3 |
ASE/GAPT |
| 3.4 |
Carsem |
| 3.5 |
ChipMOS |
| 3.6 |
EEMS |
| 3.7 |
STATSChipPAC |
| 3.8 |
Unisem |
| 3.9 |
UTAC |
| 4 |
India's Electronics Industry |
| 4.1 |
Government Policy to Support Electronics Manufacturing |
| 4.2 |
Manufacturing in India |
| 4.3 |
Contract Manufacturing Assembly |
| 4.3.1 |
Bharat Electronics Limited |
| 4.3.2 |
Continental Device India Limited |
| 4.3.3 |
Elcoteq |
| 4.3.4 |
Flextronics |
| 4.3.5 |
SemIndia |
| 4.3.6 |
SPEL Semiconductors Ltd. |
| 4.3.7 |
Tessolve |
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| List of Figures |
| 1.1. |
Laminate build-up FC-PBGA substrate supply and demand. |
| 1.2. |
WB PBGA substrate supply and demand. |
| 1.3. |
Laminate CSP substrate supply and demand. |
| 1.4. |
Combined WB PBGA and laminate CSP substrate supply and demand. |
| 2.1. |
Typical PoP. |
| 2.2. |
PoP stacking SMT line options. |
| 2.3. |
Spaceprint for single PoP versus silicon integrated processor. |
| 2.4. |
Low profile wire bond. |
| 2.5. |
Impact of die size and material sets on package warpage. |
| 2.6. |
Amkor PoP offerings. |
| 2.7. |
ASE's PoP. |
| 2.8. |
ASE's core PoP technologies. |
| 2.9. |
Process flow for ASE's MAPPoP™. |
| 2.10. |
ASE's PoP roadmap. |
| 2.11. |
NEC coreless substrate with copper posts. |
| 2.12. |
Samsung's PoP. |
| 2.13. |
Failure mode in drop test. |
| 2.14. |
Surface finish/solder effect. |
| 2.15. |
Bending reliability of PoP. |
| 2.16. |
Samsung's PoP roadmap. |
| 2.17. |
SPIL's PoP roadmap. |
| 2.18. |
Tessera's MicroPILR™. |
| 3.1. |
IC package assembly operations in China. |
| 4.1. |
Nokia 2310 mobile phone made in India. |
| List of Tables |
| 2.1 |
SiP versus PoP |
| 2.2 |
PoP Reliability Test Results |
| 2.3 |
Reliability Test Results for MicroPILR™ |
| 2.4. |
Drop Test Results for MicroPILR™ |
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