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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 4, 2006
Volume 4 of the Advanced Packaging Update for 2006 features special coverage of the market with a forecast for units of BGAs and CSPs by package construction. The BGA market is divided into plastic, tape, and ceramic structures. The CSP market is divided into laminate, flex circuit, and leadframe substrates. Unit growth projections are also provided for stacked CSP and package-on-package (PoP) shipments. Examples of products with stacked die CSPs and PoP are included. A market growth analysis based on input from both captive and merchant assembly operations is provided. Key applications and drivers for unit volume and revenue growth are highlighted. Trends in memory packaging are described and roadmaps from various companies are provided.
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Advanced Packaging Update: Market and Technology Trends
Vol. 4, 2006 |
| File size: 56.2 kb |
Published: March 2007. |
| Table of Contents |
| 1 |
Industry and Economic Trends |
| 1.1 |
Semiconductor Industry Economic Trends |
| 1.2 |
Consumer Products Drive Package Trends |
| 1.3 |
Semiconductor Packaging and Assembly |
| 1.4 |
Semiconductor Packaging Material Prices |
| 2 |
BGA/CSP Markets and Trends |
| 2.1 |
BGA Applications and Market Growth |
| 2.1.1 |
Personal Computers |
| 2.1.2 |
Game Machines and Home Appliances |
| 2.1.3 |
Workstation/Servers, Network Systems, and Telecommunications |
| 2.2 |
BGA Market Projections |
| 2.3 |
CSP Applications and Market Growth |
| 2.3.1 |
Mobile Phones |
| 2.3.2 |
Portable Consumer Products |
| 2.4 |
CSP Market Projections |
| 2.4.1 |
Wafer Level Packages |
| 3 |
Memory Packaging Trends |
| 3.1 |
Flash Memory Trends |
| 3.2 |
DRAM Trends |
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2006 BGA and CSP Bibliography |
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References |
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| List of Figures |
| 1.1. |
Semiconductor packaging and test subcontractor sales. |
| 1.2. |
Semiconductor packaging and test subcontractor CAPEX. |
| 1.3. |
Copper price trends. |
| 1.4. |
Gold price trends. |
| 2.1. |
BGAs and CSPs in Sony's PlayStation 3. |
| 2.2. |
PS3 graphics processor in multichip package. |
| 2.3. |
Flip chip as a percentage of PBGA shipments. |
| 2.4. |
Subcontractor growth in PBGA shipments. |
| 2.5. |
Panasonic's P902i with stacked die packages and PoP. |
| 2.6. |
SiP roadmap. |
| 2.7. |
SPIL's SiP roadmap. |
| 2.8. |
AIT's QFN with multiple rows. |
| 2.9. |
Gold stud bump devices. |
| 2.10. |
Flip chip in SiP. |
| 2.11. |
PoP market projections (millions of units). |
| 2.12. |
Subcontract assembly growth in CSPs. |
| 2.13. |
IC packages in WLPs (millions of units). |
| 3.1. |
Roadmap for memory stacking. |
| 3.2. |
Samsung's die stack history. |
| 3.3. |
Samsung's 16-high die stack. |
| 3.4. |
DRAM packages (millions of units). |
| List of Tables |
| 2.1. |
BGA Market Projections (millions of units) |
| 2.2 |
Panasonic’s P902i CSP Packages |
| 2.3. |
CSPs in Nokia’s 6131 Mobile Phone |
| 2.4. |
Stacked Die Package Thicknesses |
| 2.5 |
CSPs in Panasonic’s P901iTV |
| 2.6 |
CSP Market Projections (millions of units) |
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