TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 2, 2006
The second volume of the Advanced Packaging Update for 2006 features TechSearch International’s annual survey on IC package assembly price trends. Packages include QFPs, PBGAs, flip chip PBGAs, QFNs, and laminate CSPs. Historical data is provided for various pin counts for each package type and factors influencing future price trends are discussed. An analysis of the trends in raw material prices is also provided. Special coverage of substrate design rules from organic flip chip substrate, PBGA, and laminate CSP suppliers worldwide is provided. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.
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Advanced Packaging Update: Market and Technology Trends
Vol. 2, 2006 |
| File size: 84.7 kb |
Published: October 2006. |
| Table of Contents |
| 1 |
IC Package Assembly Capacity |
| 2 |
Laminate Substrate Supply and Demand |
| 2.1 |
Flip Chip Build-up Substrate Supply and Demand |
| 2.2 |
PBGA and CSP Substrates |
| 3 |
Pb-Free Reliablity Issues |
| 3.1 |
Altera |
| 3.2 |
Freescale Semiconductor |
| 3.3 |
Hewlett Packard |
| 3.4 |
IBM |
| 3.5 |
LSI Logic |
| 3.6 |
STMicroelectronics |
| 3.7 |
Xilinx |
| 4 |
CSP Test Socket Developments |
| 4.1 |
Advanced Interconnections Corp. |
| 4.2 |
Altanova |
| 4.3 |
Amphenol InterCon Systems, Inc. |
| 4.4 |
Antares ConTech, Inc. |
| 4.5 |
Ardent Concepts, Inc. |
| 4.6 |
AQL Manufacturing Services |
| 4.7 |
Aries Electronics, Inc. |
| 4.8 |
CONECTL Test Corporation |
| 4.9 |
Contech Solutions, Inc. |
| 4.10 |
Custom Interconnects |
| 4.11 |
Emulation Technology, Inc. |
| 4.12 |
Enplas Tesco, Inc. |
| 4.13 |
E-tec Interconnect Ltd. |
| 4.14 |
Ever Technologies Pte. Ltd. |
| 4.15 |
Everett Charles Technologies |
| 4.16 |
Exatron |
| 4.17 |
Gold Technologies, Inc. |
| 4.18 |
Gryphics Interconnect Product Group |
| 4.19 |
High Connection Density, Inc. |
| 4.20 |
High Performance Test, Inc. |
| 4.21 |
Ironwood Electronics, Inc. |
| 4.22 |
Johnstech International Corporation |
| 4.23 |
Leeno Industrial, Inc. |
| 4.24 |
Loranger International Corporation |
| 4.25 |
M&M Specialities |
| 4.26 |
Multitest Elektronische Systeme GmbH |
| 4.27 |
Phoenix Test Arrays |
| 4.28 |
Plastronics Socket Company |
| 4.29 |
Precision Contacts, Inc. |
| 4.30 |
Protos Electronics |
| 4.31 |
Rika Denshi America |
| 4.32 |
Robson Technologies, Inc. |
| 4.33 |
Sensata Technologies |
| 4.34 |
SER Electronics |
| 4.35 |
Synergetix |
| 4.36 |
UMD Technology, Inc. |
| 4.37 |
Unitechno, Inc. |
| 4.38 |
VN-Tek, Inc. |
| 4.39 |
Yamaichi Electronics |
| 5 |
New Package Developments |
| 5.1 |
New QFN Design for SiP and Image Sensors |
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| A |
Appendix: Fine Pitch CSP Test Socket Suppliers |
| B |
Appendix: Laminate Substrate Suppliers |
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| List of Figures |
| 1.1. |
Capital expenditures for top four SATS companies. |
| 2.1. |
Laminate build-up FC-PBGA substrate supply and demand. |
| 2.2. |
WB PBGA substrate supply and demand. |
| 2.3. |
Laminate CSP substrate supply and demand. |
| 2.4. |
Combined WB PBGA and laminate CSP substrate supply and demand. |
| 4.1. |
CSP minimum pitch trends for mobile phones. |
| 4.2. |
Mated socket. |
| 4.3. |
The Quatrix™ QFN test socket contacts. |
| 4.4. |
The Quatrix™ LGA test socket contacts. |
| 4.5. |
Ardent's spring probe. |
| 4.6. |
Test socket for 0.4mm pitch QFN. |
| 4.7. |
Gemini probe. |
| 4.8. |
SuperSpring™ contact. |
| 4.9. |
SuperButton contact. |
| 4.10. |
Rolling contact design. |
| 4.11. |
QFN test socket. |
| 4.12. |
Mini probe pin. |
| 4.13. |
Ring contacts for Unitechno socket. |
| 5.1. |
Multichip system-in-package QFN. |
| 5.2. |
Thermal simulation result of a stacked chip. |
| 5.3. |
RFMOD's image sensor QFN prior to mold. |
| List of Tables |
| 3.1. |
Pb-free Solders and Surface Finishes at Selected Companies |
| 4.1. |
Fine Pitch CSP Test Sockets |
| 4.2. |
LGA and QFN Test Sockets |
| 4.3. |
Characteristics of Unitechno’s Ring Contact Socket |
| 4.4. |
Yamaichi’s 0.4mm Pitch Sockets |
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