TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 1, 2006
The first volume of the Advanced Packaging Update for 2006 features an assessment of the CAPEX expenditures by IC package subcontractors and a special update on laminate substrate capacity. An analysis of the build-up flip chip substrate shortage is provided. An explanation of the qualification time required for a new production line or new substrate supplier is included. Capacity for wire bond PBGAs and laminate CSPs is also reported. A section of the report is devoted to reliability issues, including a survey of issues with Pb-free solder balls. A special section on test sockets contains the latest information on fine pitch CSP sockets. Finally, new package developments are reported, including a leadframe-based package for image sensors.
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Advanced Packaging Update: Market and Technology Trends
Vol. 1, 2006 |
| File size: 45.8 kb |
Published: June 2006. |
| Table of Contents |
| 1 |
IC Package Assembly Capacity |
| 2 |
Laminate Substrate Supply and Demand |
| 2.1 |
Flip Chip Build-up Substrate Supply and Demand |
| 2.2 |
PBGA and CSP Substrates |
| 3 |
Pb-Free Reliablity Issues |
| 3.1 |
Altera |
| 3.2 |
Freescale Semiconductor |
| 3.3 |
Hewlett Packard |
| 3.4 |
IBM |
| 3.5 |
LSI Logic |
| 3.6 |
STMicroelectronics |
| 3.7 |
Xilinx |
| 4 |
CSP Test Socket Developments |
| 4.1 |
Advanced Interconnections Corp. |
| 4.2 |
Altanova |
| 4.3 |
Amphenol InterCon Systems, Inc. |
| 4.4 |
Antares ConTech, Inc. |
| 4.5 |
Ardent Concepts, Inc. |
| 4.6 |
AQL Manufacturing Services |
| 4.7 |
Aries Electronics, Inc. |
| 4.8 |
CONECTL Test Corporation |
| 4.9 |
Contech Solutions, Inc. |
| 4.10 |
Custom Interconnects |
| 4.11 |
Emulation Technology, Inc. |
| 4.12 |
Enplas Tesco, Inc. |
| 4.13 |
E-tec Interconnect Ltd. |
| 4.14 |
Ever Technologies Pte. Ltd. |
| 4.15 |
Everett Charles Technologies |
| 4.16 |
Exatron |
| 4.17 |
Gold Technologies, Inc. |
| 4.18 |
Gryphics Interconnect Product Group |
| 4.19 |
High Connection Density, Inc. |
| 4.20 |
High Performance Test, Inc. |
| 4.21 |
Ironwood Electronics, Inc. |
| 4.22 |
Johnstech International Corporation |
| 4.23 |
Leeno Industrial, Inc. |
| 4.24 |
Loranger International Corporation |
| 4.25 |
M&M Specialities |
| 4.26 |
Multitest Elektronische Systeme GmbH |
| 4.27 |
Phoenix Test Arrays |
| 4.28 |
Plastronics Socket Company |
| 4.29 |
Precision Contacts, Inc. |
| 4.30 |
Protos Electronics |
| 4.31 |
Rika Denshi America |
| 4.32 |
Robson Technologies, Inc. |
| 4.33 |
Sensata Technologies |
| 4.34 |
SER Electronics |
| 4.35 |
Synergetix |
| 4.36 |
UMD Technology, Inc. |
| 4.37 |
Unitechno, Inc. |
| 4.38 |
VN-Tek, Inc. |
| 4.39 |
Yamaichi Electronics |
| 5 |
New Package Developments |
| 5.1 |
New QFN Design for SiP and Image Sensors |
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| A |
Appendix: Fine Pitch CSP Test Socket Suppliers |
| B |
Appendix: Laminate Substrate Suppliers |
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| List of Figures |
| 1.1. |
Capital expenditures for top four SATS companies. |
| 2.1. |
Laminate build-up FC-PBGA substrate supply and demand. |
| 2.2. |
WB PBGA substrate supply and demand. |
| 2.3. |
Laminate CSP substrate supply and demand. |
| 2.4. |
Combined WB PBGA and laminate CSP substrate supply and demand. |
| 4.1. |
CSP minimum pitch trends for mobile phones. |
| 4.2. |
Mated socket. |
| 4.3. |
The Quatrix™ QFN test socket contacts. |
| 4.4. |
The Quatrix™ LGA test socket contacts. |
| 4.5. |
Ardent's spring probe. |
| 4.6. |
Test socket for 0.4mm pitch QFN. |
| 4.7. |
Gemini probe. |
| 4.8. |
SuperSpring™ contact. |
| 4.9. |
SuperButton contact. |
| 4.10. |
Rolling contact design. |
| 4.11. |
QFN test socket. |
| 4.12. |
Mini probe pin. |
| 4.13. |
Ring contacts for Unitechno socket. |
| 5.1. |
Multichip system-in-package QFN. |
| 5.2. |
Thermal simulation result of a stacked chip. |
| 5.3. |
RFMOD's image sensor QFN prior to mold. |
| List of Tables |
| 3.1. |
Pb-free Solders and Surface Finishes at Selected Companies |
| 4.1. |
Fine Pitch CSP Test Sockets |
| 4.2. |
LGA and QFN Test Sockets |
| 4.3. |
Characteristics of Unitechno’s Ring Contact Socket |
| 4.4. |
Yamaichi’s 0.4mm Pitch Sockets |
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