TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE
Market and Technology Trends
Q3, 2005
The third quarterly Advanced Packaging Update (formerly the BGA/CSP update) for 2005 features special coverage of packaging technology for Apple’s new iPods. New developments in stacked die and stacked packages are discussed, including trends in die attach. Amkor’s PoP is detailed. The report also provides information on the latest developments in memory module technology. Included are examples from IBM, Micron, Staktek, VCI, and 3D Plus. The report concludes with an update on a potential solution to the Pb-free solder dewetting problem.
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Q3, 2005: Advanced Packaging Update |
| File size: 72 kb |
Published: December 2005. |
| Table of Contents |
| 1 |
Apple’s iPod |
| 2 |
Stacked Die and PoP Developments |
| 2.1 |
Amkor’s Package on Package |
| 2.2 |
A Roadmap for Die Thickness Reduction |
| 2.3 |
Henkel Technologies: Die-to-die Bonding |
| 3 |
Memory Module Developments |
| 3.1 |
IBM: High Density DRAMs for Servers |
| 3.2 |
Micron: High Performance DIMMs |
| 3.3 |
Staktek |
| 3.4 |
Vertical Circuits: Memory Stacks |
| 3.5 |
3D Plus: Walpack Module |
| 3.6 |
ThermalWorks: Substrate Core |
| 4 |
Pb-Free Package Developments |
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References |
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| List of Figures |
| 1.1. |
iPod nano |
| 1.2. |
Main board for the iPod nano |
| 1.3. |
Video iPod |
| 1.4. |
Video iPod main board |
| 2.1. |
PoP options |
| 2.2. |
PoP family roadmap |
| 2.3. |
Die attach process |
| 2.4. |
Pre-appled die attach adhesive process |
| 2.5. |
Dicing tape die attach adhesive process |
| 3.1. |
FBDIMM with heatspreader |
| 3.2. |
VLP RDIMM and standard height RDIMM |
| 3.3. |
Mini-RDIMM and standard length RDIMM |
| 3.4. |
Staktek’s ArticCore™ module |
| 3.5. |
Staktek’s ArticCore™ module profiles |
| 3.6. |
VCI DRAM stack |
| 3.7. |
Process flow for WLP cube |
| 3.8. |
3D Plus eight-chip SRAM module |
| 4.1. |
Solder ball dewetting |
| List of Tables |
| 2.1. |
Stacked Die versus PoP Tradeoffs |
| 2.2. |
PoP Bottom Package Options |
| 2.3. |
STATSChipPAC’s Roadmap for Package Thickness |
| 2.4. |
STATSChipPAC’s Roadmap for Die Thinning |
| 2.5. |
STATSChipPAC’s Die Attach Materials |
| 2.6. |
Die-to-die Bonding Material Types and Tradeoffs |
| 2.7. |
Die-to-die Bonding Material Process Conditions |
| 3.1. |
Tradeoffs of DDR2 Stacking Solutions |
| 3.2. |
ArticCore™ Reference Designs |
| 3.3. |
Selected Material Properties for Stablcor and other Materials |
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