TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE
Market and Technology Trends
Q1, 2005
The first quarterly Advanced Packaging Update (formerly the BGA/CSP update) for 2005 features special coverage of the laminate substrate shortage caused by the ASE fire. Capacity has been calculated based on a survey of major worldwide suppliers for laminate flip chip substrates, wire bond PBGA substrates, and laminate CSP substrates. The capacity is compared to projected demand for 2005 and 2006 for each substrate type. Trends in microprocessor packaging are also covered, including the packaging for the new Cell processor planned for Sony's PlayStation. The growth in advanced packaging, defined as BGAs, CSPs, and wafer level packages, is projected in unit volumes through 2009. A special section on the expansion of IC package assembly and test in China highlights trends in the region. New package developments in coated wire are presented.
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Q1, 2005: Advanced Packaging Update |
| File size: 82 kb |
Published: May 2005. |
| Table of Contents |
| 1 |
Laminate Substrate Shortages |
| 1.1 |
Laminate Substrate Supply and Demand |
| 2 |
Microprocessor Trends |
| 2.1 |
Cell Processor |
| 2.2 |
Apple Computer Switches to Intel Processors |
| 3 |
China’s IC Assembly Growth |
| 3.1 I |
C Test and Assembly Expansion |
| 3.1.1 |
Shanghai Assembly and Test Facilities |
| 3.1.1.1 |
Activities at the Subcontractors |
| 3.1.2 |
Suzhou Assembly and Test Facilities |
| 3.1.2.1 |
Activities at the Subcontractors |
| 3.1.3 |
Chengdu Assembly and Test Facilities |
| 4 |
New Package Developments |
| 4.1 |
Microbonds X-Wire™ Technology |
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References |
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| List of Figures |
| 1. |
Advanced package growth as a percentage of the total IC market
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| 1.1. |
Laminate IC package substrate supply and demand
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| 1.2. |
Combined PBGA and CSP substrate supply and demand
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| 2.1. |
The Cell processor
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| 3.1. |
China’s major assembly and test facilities
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| 3.2. |
Amkor’s Shanghai facility
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| 3.3. |
GAPT’s advanced BGA packaging roadmap
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| 3.4. |
GAPT’s CSP packaging roadmap
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| 3.5. |
GAPT’s leadframe packaging roadmap
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| 4.1. |
X-Wire™ insulated gold wire
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| 4.2. |
X-Wire™ technology roadmap |
| List of Tables |
| 3.1. |
Selected Assembly and Test Operations in China
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| 4.1. |
X-Wire™ Material Properties
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| 4.2. |
X-Wire™ Reliability Qualification
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