TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE
Market and Technology Trends
Q4, 2004
The fourth quarterly BGA/CSP update for 2004 features special coverage of the market with a forecast for BGAs and CSPs in units. Growth in the market is analyzed based on input from captive and merchant assembly operations. Market projections for BGA unit shipments are provided for PBGAs, TBGAs, and ceramic packages. CSP market projections are broken out into laminate substrates, ceramic substrates, leadframe-based packages, and stacked die packages. Key applications and drivers for unit volume and revenue growth are highlighted. A special section is devoted to high performance device packaging trends and memory packaging developments. Packaging trends for high performance logic and memory are highlighted with a special focus on ASICs, DRAM, and flash memory. High performance packaging trends include maximum body size, pin count, and ball pitch. The use of green materials and specific problems encountered with Pb-free packages are discussed.
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Q4, 2004: Advanced Packaging Update |
| File size: 75 kb |
Published: March 2005. |
| Table of Contents |
| 1 |
Industry and Economic Trends
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| 2 |
BGA/CSP Markets and Trends
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| 2.1 |
BGA Applications and Market Growth
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| 2.1.1 |
Personal Computers
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| 2.1.2 |
Home Appliances
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| 2.1.3 |
Workstation/Servers, Network Systems, and Telecommunications
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| 2.2 |
BGA Market Projections
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| 2.3 |
CSP Applications and Market Growth
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| 2.3.1 |
Mobile Phones
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| 2.3.2 |
Portable Consumer Products
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| 2.4 |
CSP Market Projections
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| 2.4.1 |
Wafer Level Packages
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| 3 |
Package Trends
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| 3.1 |
Trends in High Performance Devices
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| 3.1.1 |
Package Construction
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| 3.1.2 |
Green Materials
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| 3.1.3 |
Assembly and Solder Materials
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| 3.1.4 |
Thermal Performance
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| 3.1.5 |
Integrated Package and Die Design
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| 3.2 |
Trends in DRAM Memory Packaging
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| 3.3 |
Trends in Flash Memory Packaging
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2004 BGA and CSP Bibliography
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References
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| List of Figures |
| 1.1. |
Growth in China’s IC market share |
| 2.1. |
AVR-5805 board with PBGAs |
| 2.2. |
Fujitsu’s BCC camera module |
| 2.3. |
Sony’s PoP for Cyber-Shot camera |
| 2.4. |
SyChip’s QFN module |
| 2.5. |
Samsung’s eight-die memory package |
| 2.6. |
WLP market projections (200mm wafers) |
| 3.1. |
Pb-free solder ball with cold solder joint |
| 3.2. |
Pre-applied underfill between the package and board |
| 3.3. |
Oki’s roadmap for 3D memory modules |
| List of Tables |
| 2.1. |
BGA Market Projections (millions of units) |
| 2.2. |
CSP Examples on Fujitsu’s Main Board |
| 2.3. |
CSP Market Projections (millions of units) |
| 3.1. |
Laminate Packages in Production at Selected Companies |
| 3.2. |
Pb-free Solder Ball Composition in Use at Selected Companies |
| 3.3. |
DRAM Density |
| 3.4. |
DRAM Package Forecast (millions of units) |
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