TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE
Market and Technology Trends
Q3, 2004
The third quarterly BGA/CSP update for 2004 features special coverage of lidless packaging trends. A new high-density substrate and flip chip packaging solution, jointly developed by Denso and NEC, is presented. The report also includes a section on packaging trends for camera phones including sensor package types. A special section on the lead-free movement is included. Featured are trends in shipments of solder paste and lead-free solder balls as well as reliability test results with lead-free components. Highlights from the Panasonic FA “Create Show” are also described.
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Q3, 2004: Advanced Packaging Update |
| File size: 87 kb |
Published: December 2004. |
| Table of Contents |
| 1 |
Trends in Lidless Packages |
| 1.1 |
Advanced Micro Devices, Inc. |
| 1.2 |
Apple Computer |
| 1.3 |
ATI Technologies, Inc. |
| 1.4 |
IBM Corporation |
| 1.5 |
Fujitsu Microelectronics |
| 1.6 |
Intel |
| 1.7 |
LSI Logic |
| 1.8 |
NEC |
| 1.9 |
Sun Microsystems |
| 1.10 |
Texas Instruments, Inc. |
| 2 |
Denso and NEC High Density Substrate |
| 2.1 |
Denso’s PALAP Substrate Technology |
| 2.2 |
NEC’s Flip Chip BGA with PALAP Substrate |
| 3 |
Camera Module Packaging Trends |
| 3.1 |
Amkor Technology |
| 3.2 |
ASE |
| 3.3 |
ShellCase |
| 3.4 |
Micron |
| 3.5 |
Sharp |
| 4 |
Lead-Free Solder Trends |
| 5 |
Panasonic FA Show Highlights |
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References |
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| List of Figures |
| 1.1. |
AMD’s lidless flip chip package (0.13µ Athlon™ XP) |
| 1.2. |
PowerPC 970 lidless flip chip package |
| 1.3. |
ATI’s graphics accelerator |
| 1.4. |
Transmeta Efficeon TM8800 processor |
| 2.1. |
PALAP process flow |
| 2.2. |
PALAP substrate and IVH |
| 2.3. |
FCBGA using PALAP |
| 3.1. |
Amkor’s camera module |
| 3.2. |
Projections for ShellCase WLP for imaging applications |
| 3.3. |
Micron’s sensor for automotive applications |
| 3.4. |
Sharp’s megapixel camera modules |
| 5.1. |
Panasonic FA sample board |
| List of Tables |
| 1.1. |
Effect of BGA Underfill on Second-Level Reliability
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| 2.1. |
Results of First-Level Packaging Reliability Test
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| 2.2. |
Results of Second-Level Packaging Reliability Test
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| 3.1. |
Japanese Mobile Phone External Camera Modules
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| 3.2. |
Japanese Mobile Phone Internal Camera Modules
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| 3.3. |
Toshiba’s VGA Camera Module
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