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TechSearch
International, Inc.
•
4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889

BGA/CSP DEVELOPMENT UPDATE SERVICE
Second Quarter, 2004

The second quarterly BGA/CSP update for 2004 provides analysis of key economic indicators that impact the economy and the semiconductor packaging industry. Included is a discussion on the impact of rising oil prices. The update features special coverage of flip chip substrate developments, including descriptions of substrates offered by companies worldwide. Industry trends for laminate flip chip substrates are discussed, including body size, core thickness, via and pad diameter, minimum bump pitch supported, substrate finish, and substrate price trends. A capacity analysis examines the demand and supply for laminate wire bond, flip chip, and CSP substrates and the impact on prices. The report also includes a special section on IC package assembly price trends.

	Q2, 2004: BGA/CSP Development Update Service
File size: 60.3 kb		Published: August 2004.

Table of Contents
1	Economic Outlook
1.1	Inventory Build
1.2	Oil Prices Impact World Economy in 2005
2	Flip Chip Substrates ASE Group, Compeq Technologies, Daisho Denshi America, Inc., Endicott Interconnect Technologies, Inc., Fujitsu Interconnect Technologies Limited, Ibiden Company, Ltd., Japan Circuits Industrial Company, Ltd., Kinsus Interconnect Technology Corp., Kyocera Corporation, Nan Ya PCB, NEC Toppan Circuit Solutions, Inc., NTK Technologies, Shinko Electric Industries Co., Ltd., 3M Company, UniMicron Technology Corporation
2.16	New Substrate Developments
2.16.1	NEC’s Multi-Layer Thin Substrate
2.16.2	Toppan Printing Company, Ltd.
2.16.3	Polyclad Laminates, Inc.’s Substrate Material
3	IC Package Assembly Price Trends
3.1	QFPs
3.2	Wire Bond PBGAs
3.3	Flip Chip PBGAs
3.4	Laminate CSPs
3.5	Lead Frame CSPs

List of Figures
1.1.	Worldwide gross domestic product (GDP) growth vs. oil price changes (price per barrel).
2.1.	ASE’s copper-filled blind vias and stacked vias.
2.2.	Endicott Interconnect Technologies’ substrates
2.3.	Cross Section of EI’s Hyper BGA substrate.
2.4.	Fujitsu Interconnect’s GigaModule-4 substrate.
2.5.	Process flow of Kyocera’s SuperHDBU.
2.6.	3M’s Node 1 flip chip substrate
2.7.	Fabrication process for NEC’s substrate.
2.8.	Toppan’s Multi-layer Tape Substrate (TMTS).
2.9.	Return loss comparison of TMTS with build-up.
2.10.	Substrate decomposition at reflow temperatures.

List of Tables
2.1.	Selected Laminate Flip Chip Substrate Suppliers
2.2.	Selected Thin Core Flip Chip Substrates
2.3.	Substrate Finish Comparison
2.4.	ASE’s Flip Chip Substrates
2.5.	Compeq’s Flip Chip Substrates
2.6.	Daisho Denshi’s Flip Chip Substrates
2.7.	Endicott Interconnect’s Flip Chip Substrates
2.8.	EI’s High Performance Flip Chip Substrates
2.9.	Fujitsu Microelectronics’ Flip Chip Substrates
2.10.	Fujitsu Interconnect’s Flip Chip Substrates
2.11.	Ibiden’s Flip Chip Substrates
2.12.	JCI’s Flip Chip Substrates
2.13.	Kinsus’ Flip Chip Substrates
2.14.	Kyocera’s Flip Chip Substrates
2.15.	NEC Toppan Circuit Solutions’ Substrates
2.16.	NTK’s Flip Chip Substrates
2.17.	Shinko’s Flip Chip Substrates
2.18.	Material Properties of 3M’s Substrate Dielectrics
2.19.	3M’s Flip Chip Substrates
2.20.	UniMicron’s Flip Chip Substrates
2.21.	Toppan’s Multi-layer Tape Substrate (TMTS)
2.22.	Reliability Test Results for TMTS Bare Substrate
2.23.	Material Properties of Polyclad’s Lead-Free Substrate Dielectrics
3.1.	Average QFP Assembly Prices
3.2.	Average Wire Bond PBGA Assembly Prices
3.3.	Average Flip Chip PBGA Assembly Prices
3.4.	Average Laminate CSP Assembly Prices
3.5.	Wire Bond Lead Frame CSP Assembly Prices