TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
Fourth Quarter, 2003
The fourth quarter BGA/CSP update for 2003 features the market forecast in units for BGAs and CSPs by package construction. BGA categories include plastic, tape, and ceramic. CSP categories include rigid substrate, tape substrate, lead frame, and stacked die packages. The wafer level package forecast is provided in 200mm equivalents. Growth in the market is analyzed in light of the economic recovery with projections through 2008. An analysis of advanced packaging trends for BGAs and CSPs, including new developments in stacked die CSPs, is provided. Details of two new phones introduced by NEC are included—one with the first 0.4mm pitch part, the other a credit card size phone designed for the China market. A special section is devoted to laminate substrate capacity for CSPs, wire bond PBGAs, and flip chip substrates. New developments such as underfill jetting and Sharp’s reliability data on the new plastic core solder balls are provided.
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Q4, 2003: BGA/CSP Development Update Service |
| File size: 27.4 kb |
Published: February 2004. |
| Table of Contents |
| 1 |
BGA/CSP Markets and Trends |
| 1.1 |
Trends in BGAs |
| 1.1.1 |
Laminate Wire Bond PBGA Substrate Shortage |
| 1.1.2 |
Lead Count and Pitch |
| 1.1.3 |
Substrates and Interconnect |
| 1.1.4 |
Printed Circuit Boards |
| 1.1.5 |
Low-k Dielectric and New Assembly Materials |
| 1.1.6 |
Increased Thermal Dissipation |
| 1.1.7 |
Green Materials |
| 1.1.8 |
Integrated Package and Die Design |
| 1.2 |
Trends in CSPs |
| 1.2.1 |
Lead Count and Pitch |
| 1.2.1.1 |
NEC’s Phone with 0.4mm Pitch CSP |
| 1.2.2 |
Stacked Die CSPs |
| 1.3 |
BGA Applications and Market Growth |
| 1.3.1 |
Personal Computers |
| 1.3.2 |
Game Machines |
| 1.3.3 |
Workstation/Servers, Network Systems, and Telecommunications |
| 1.4 |
BGA Market Projections |
| 1.5 |
CSP Applications and Market Growth |
| 1.5.1 |
Mobile Phones |
| 1.5.1.1 |
NEC’s Card Size Phone |
| 1.5.2 |
Digital Camcorders and Cameras |
| 1.6 |
CSP Market Projections |
| 1.6.1 |
Wafer Level Packages |
| 2 |
New Package Developments |
| 2.1 |
Lead-Free Plastic-Core Solder Bumps |
| 2.2 |
New Underfill Application Method |
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| 2003 BGA and CSP Bibliography |
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| List of Figures |
| 1.1. |
Fujitsu’s CPU package. |
| 1.2. |
Trends in ASIC package lead count. |
| 1.3. |
Trends in ASIC package ball pitch. |
| 1.4. |
Trends in ASIC packages. |
| 1.5. |
NEC 505iS mobile phone with 0.4mm pitch CSP. |
| 1.6. |
Intel’s eight-die stack with 50µm die thickness. |
| 1.7. |
Fujitsu Microelectronics eight-die stack. |
| 1.8. |
STMicroelectronics 8 and 10 die stacked CSPs. |
| 1.9. |
PBGA in Sony’s PlayStation. |
| 1.10. |
BGA market projection |
| 1.11. |
NEC’s card phone. |
| 1.12. |
NEC’s card phone layout. |
| 1.13. |
DVD camcorder with six CSPs and stacked die package. |
| 1.14. |
CSP market projection |
| 1.15. |
WLP breakdown by device type. |
| List of Tables |
| 1.1. |
Stacked Die Package Constructions |
| 1.2 |
NTT DoCoMo 900i Models |
| 1.3 |
WLP Market Projections (200mm wafer equiv.) |
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