TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
First Quarter, 2003
The first quarterly BGA/CSP Update for 2003 features special coverage of mobile phone production and market trends in China. Photos and an analysis of the components used in two domestic Chinese mobile phones are included. Major trends in RF packaging are described, including new package developments from Amkor, Carsem, Fujitsu, RF Micro Devices, Skyworks, and Tessera. A detailed analysis of the world's production capacity for tape/flex circuit used in IC packages is provided along with descriptions of the current technology from each tape/flex circuit maker. Worldwide capacity is provided for single-metal and two-metal layer tape. New package developments are described, including an embedded wafer level package developed jointly by CMK and Casio Micronics, and UTAC's stacked package. Integrated passive substrate developments from Mitsubishi Electric and Shinko Electric are also described.
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Q1, 2003: BGA/CSP Development Update Service |
| File size: 32.9 kb |
Published: April 2003. |
| Table of Contents |
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1 |
China’s Growth in Mobile Phone |
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1.1 |
China’s Mobile Phone Market Share |
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1.2 |
Chinese Domestic Phone Trends |
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1.2.1 |
Ningo Bird Corporation, Ltd. |
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1.2.2 |
Shenzhen Konka Telecommunications Technology, Co., Ltd. |
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2 |
RF Packaging Trends |
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2.1 |
Amkor Technology, Inc. |
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2.2 |
Carsem, Inc. |
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2.3 |
Fujitsu Microelectronics America, Inc. |
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2.4 |
RF Micro Devices, Inc. |
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2.5 |
Skyworks Solutions, Inc. |
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2.6 |
Tessera Technologies, Inc. |
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3 |
Tape/Flex Substrate Developments |
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3.1 |
Tape/Flex Substrate Suppliers |
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3.1.1 |
Casio Micronics Company, Ltd. |
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3.1.2 |
Cicorel SA |
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3.1.3 |
CMK Corporation |
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3.1.4 |
Compass Technology Company, Ltd. |
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3.1.5 |
Hitachi Cable Ltd. |
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3.1.6 |
Innovex, Inc. |
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3.1.7 |
LG Micron, Ltd. |
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3.1.8 |
3M Company |
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3.1.9 |
Mitsui Mining & Smelting Co., Ltd. |
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3.1.10 |
North Corporation |
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3.1.11 |
STEMCO, Ltd. |
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3.1.12 |
Shindo Denshi Kogyo, Ltd. |
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3.1.13 |
Shinko Electric Industries Company, Ltd. |
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3.1.14 |
Sumitomo Metal Mining Company, Ltd. |
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3.1.15 |
Toppan Printing Company, Ltd. |
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3.1.16 |
WUS Printed Circuits Co., Ltd. |
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3.2 |
Tape Substrate Production Capacity |
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4 |
New Package Developments |
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4.1 |
Embedded Wafer Level CSP in a Substrate |
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4.2 |
UTAC’s Stacked Packages |
| 4.3 |
Integrated Passives in Organic Substrates
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| List of Figures |
| 1.1. |
Bird SC02 mobile phone. |
| 1.2. |
Konka C699 mobile phone. |
| 1.3. |
Konka C699 with six CSPs. |
| 2.1. |
Motorola’s embedded passive demonstration board. |
| 2.2. |
Lead frame for multichip MLF used for wireless applications. |
| 2.3. |
MLF lead frame designed for 0201 and 0402 discrete passives. |
| 2.4. |
Fujitsu Microelectronics’ BCC and BCC++ packages. |
| 2.5. |
Multichip BCC/BCC++ from Fujitsu Microelectronics. |
| 2.6. |
Single package radio from Skyworks. |
| 2.7. |
Pyxis power amplifier module from Tessera. |
| 2.8. |
Inductors on single metal tape substrate of the Pyxis PA module. |
| 2.9. |
Pyxis power amplifier module from Tessera. |
| 3.1. |
Monthly tape capacity in square meters. |
| 4.1. |
Embedded wafer level package (EWLP). |
| 4.2. |
EWLP cross-section. |
| 4.3. |
UTAC’s multichip and system-in-package roadmap. |
| 4.4. |
Structure of thin layer in integral passive substrate. |
| 4.5. |
Thin capacitor built into package. |
| List of Tables |
| 2.1. |
Amkor’s MicroLead Frame‘ Package Family |
| 2.2. |
Carsem’s Micro Lead Frame Package Family |
| 3.1. |
Selected Tape/Flex Substrate Supplier |
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