TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
Fourth Quarter, 2002
The fourth quarterly BGA/CSP update for 2002 features the market forecast for BGAs and CSPs. Growth in the market is analyzed in light of the worldwide economic recession. The CSP forecast includes rigid, flex, and lead frame substrates. The BGA forecast includes ceramic, tape, and plastic packages. Major application areas are described, and a special section is devoted to developments in stacked die (or multichip) packaging including information on packages in production, devices stacked in the packages, and applications. An analysis of trends in DRAM memory packaging is also provided.
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Q4, 2002: BGA/CSP Development Update Service |
| File size: 31.0 kb |
Published: February 2003. |
| Table of Contents |
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1 |
BGA/CSP Markets and Applications |
|
1.1 |
BGA Applications and Market Growth |
|
1.1.1 |
Personal Computers |
|
1.1.2 |
Game Machines |
|
1.1.3 |
Workstation/Servers, Network Systems, and Telecommunications |
| 1.1.3.1 |
Fujitsu’s High Performance Server |
|
1.1.4 |
Military and Aerospace Electronics |
|
1.1.5 |
Automotive Electronics |
|
1.2 |
BGA Market Projections |
|
1.3 |
CSP Applications and Market Growth |
|
1.3.1 |
Mobile Phones |
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1.3.2 |
Digital Camcorders and Cameras |
|
1.4 |
CSP Market Projections |
|
1.4.1 |
Wafer Level Packages |
|
2 |
IC Package Trends |
|
2.1 |
DRAM |
|
2.2 |
Stacked Die Packages |
|
2.2.1 |
Amkor Technology |
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2.2.2 |
Advanced Semiconductor Engineering |
|
2.2.3 |
Carsem, Inc. |
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2.2.4 |
ChipPAC, Inc. |
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2.2.5 |
Fujitsu Microelectronics America, Inc. |
|
2.2.6 |
Intel Corporation |
|
2.2.7 |
Mitsubishi Electric Corporation |
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2.2.8 |
NEC Corporation |
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2.2.9 |
Orient Semiconductor Engineering |
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2.2.10 |
SanDisk Corporation |
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2.2.11 |
Sharp Corporation |
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2.2.12 |
Siliconware Precision Industries Co., Ltd. |
|
2.2.13 |
ST Assembly Test Services, Ltd. |
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2.2.14 |
Tessera Technologies, Inc. |
| 2.2.15 |
Walton Advanced Engineering |
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| List of Figures |
| 1.1. |
Gekko processor for Nintendo’s game machine. |
| 1.2. |
Fujitsu’s MCM before heatsink assembly. |
| 1.3. |
Fujitsu’s SCM. |
| 1.4. |
Fujitsu’s flip chip die mounted on laminate. |
| 1.5. |
BGA market projection. |
| 1.6. |
NEC’s Mova N504iS with stacked memory. |
| 1.7. |
Toshiba’s stacked MCP roadmap. |
| 1.8. |
PCB for Haier’s mobile phone. |
| 1.9. |
Casio’s EXILIM EX-S1 card camera. |
| 1.10. |
CSP Market Projection |
| 1.11. |
Wafer level package projections. |
| 2.1. |
DRAM packaging trends. |
| 2.2. |
SCSP stacked die packages from ASE. |
| 2.3. |
ASE’s stacked package roadmap. |
| 2.4. |
4+1 stacked die package from ChipPAC. |
| 2.5. |
Fujitsu’s roadmap for stacked die packaging. |
| 2.6. |
Intel’s Stacked-CSP roadmap. |
| 2.7. |
Mitsubishi Electric’s stacked SRAM package. |
| 2.8. |
Cross section of NEC’s five-die package. |
| 2.9. |
NEC FFCSP process. |
| 2.10. |
OSE’s stacked package roadmap. |
| 2.11. |
Sharp’s four-die stacked package. |
| 2.12. |
Sharp’s stacked die package stacking. |
| 2.13. |
SPIL’s 3-Die stacked laminate. |
| 2.14. |
SPIL’s 3-D package roadmap. |
| 2.15. |
Stacked die and stacked packages from Tessera. |
| 2.16. |
µZ™ Fold-Over package from Tessera.
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| 2.17. |
µZ™ Ball Stack from Tessera.
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| List of Tables |
| 1.1 |
PowerPC Products |
| 1.2 |
Packages Evaluated by General Dynamics |
| 1.3 |
PBGAs Evaluated by DaimlerChrysler |
| 2.1 |
Stacked Die Package Constructions |
| 2.2 |
Summary of Stacked Die Packages |
| 2.3 |
3D Packages from Amkor Technology |
| 2.4 |
ASE Packages with Multiple Die |
| 2.5 |
ChipPAC Packages with Multiple Die |
| 2.6 |
Stacked Die Package Line-up from Fujitsu |
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