TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
Second Quarter, 2002
The second quarterly BGA/CSP update for 2002 features trends in packaging for mobile phones. Included are mobile phone trends in Japan and a special section on mobile phone packaging developments by domestic Chinese manufacturers. A special section is devoted to IC package assembly price trends, including PQFPs and PBGAs with both wire bonding and flip chip interconnect. Several flip chip and high performance substrate suppliers are profiled, with an emphasis on substrate for flip chip interconnect and substrate price trends. Wafer level packages in production from Micron Technology and Littelfuse are presented and wafer level burn-in test and fabrication from ACE is discussed. New package developments include flip chip on lead frames from AIT, Carsem, and Toshiba, Fairchild’s optocoupler BGA, and Mitsubishi’s high pin count package using flip chip interconnect. Tessera’s new stacked package and a new interposer from Sweden-based Strand Interconnect are also described.
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Q2, 2002: BGA/CSP Development Update Service |
| File size: 26.9 kb |
Published: July 2002. |
| Table of Contents |
| 1 |
Mobile Phone Trends |
| 1.1 |
Japanese Mobile Phone Board Trends |
| 1.2 |
Chinese Domestic Phones |
| 1.2.1 |
TCL 8388 Mobile Phone |
| 1.2.2 |
Haier H3633 Mobile Phone |
| 2 |
IC Package Assembly Price Trends |
| 2.1 |
QFPs |
| 2.2 |
Wire Bond PBGAs |
| 2.3 |
Flip Chip PBGAs |
| 2.3.1 |
Flip Chip Substrate Pricing Trends |
| 3 |
Flip Chip Substrate Developments
AMITEC, ASE Material, Fujitsu Microelectronics, Ibiden, IBM, K&S Substrate Division, Kinsus, Kyocera, Matsushita Electronic Components, Mitsui Chemicals, NanYa PCB, NTK, Samsung Electro-Mechanics, Shinko Electric, Toppan Printing, and 3M |
| 4 |
Wafer Level CSP Production Trends |
| 4.1 |
Micron’s 256Mbit SDRAM |
| 4.2 |
Littelfuse Diodes in Wafer Level Packages |
| 4.3 |
ACE Technology |
| 5 |
New Package Developments |
| 5.1 |
Flip Chip on Lead Frame |
| 5.2 |
Fairchild’s Optocoupler BGA Package |
| 5.3 |
Mitsubishi’s High Pin Count Flip Chip Package |
| 5.4 |
Tessera’s Stacked Package |
| 5.4.1 |
Tessera’s Licenses Toshiba’s mBGA |
| 5.5 |
Strand’s New Interposer for Stacked Packages |
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| List of Figures |
| 1.1. |
ALIVH-VIL board technology. |
| 1.2. |
Daiwa/Motoya Electric board. |
| 1.3. |
TCL 8388 mobile phone. |
| 1.4. |
Haier H3633 mobile phone and board. |
| 1.5. |
Four CSPs used in Haier H3633 mobile phone. |
| 1.6. |
Shielding frame around three CSPs. |
| 2.1. |
Price trends for high performance substrates. |
| 3.1. |
GigaModule-2. |
| 3.2. |
Thin core build-up substrate. |
| 3.3. |
IBM’s 2,577-ball HyperBGA™. |
| 3.4. |
Metal column flip chip substrate from Kinsus. |
| 3.5. |
Simultaneous curing process used by Kyocera. |
| 3.6. |
Simulation results for Kyocera’s Super HDBU. |
| 3.7. |
Toppan’s four-metal layer TBGA. |
| 4.1. |
Micron’s SDRAM in wafer level CSP. |
| 4.2. |
Littelfuse diode arrays for ESD protection. |
| 4.3. |
ACE wafer level CSP process flow. |
| 4.4. |
ACE probe card. |
| 4.5. |
ACE’s memory module. |
| 5.1. |
Toshiba flip chip TQON process. |
| 5.2. |
Optocoupler BGA vs. conventional DIP. |
| 5.3. |
Mitsubishi’s 2,304 I/O Flip Chip BGA. |
| 5.4. |
Tessera’s µZ™-Ball Stacked package. |
| 5.5. |
High density DIMM enabled by µZ™. |
| 5.6. |
Strand’s SP-1200 SiliconMate™. |
| List of Tables |
| 1.1 |
Japanese Mobile Phone Boards |
| 2.1. |
QFP Assembly Price Trends |
| 2.2. |
Wire bond PBGA Assembly Trends |
| 2.3. |
Average Flip Chip PBGA Assembly Prices |
| 3.1 |
Selected Flip Chip Substrate Suppliers |
| 3.2 |
Tape-based Flip Chip Substrate Suppliers |
| 3.3 |
Features of AMITEC’s Flip Chip Substrate |
| 3.4. |
Features of K&S Substrate Division’s UltraVia™ |
| 3.5. |
HyperBGA™ Reliability Test Data |
| 3.6. |
Properties for Kyocera’s LCPC Dielectric |
| 3.7. |
Design Rules for Kyocera’s Super HDBU |
| 3.8. |
Reliability Results for Kyocera’s Super HDBU |
| 3.9. |
BN300 Material Properties |
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