TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
First Quarter, 2002
The first quarterly BGA/CSP update for 2002 features package and board developments in consumer products such as digital camcorders and cameras, including recent products from Sony. A special section provides insight into IC package assembly developments in Shanghai, China, with detailed coverage of the major contract assembly service providers, including their roadmaps for the future. Background information on IC manufacturing trends is also provided. The report covers packaging trends in Taiwan, including Advanced Chip Engineering Technology, a new contract assembly operation in Taiwan specializing in wafer level packaging. New packages are discussed, such as Intel’s stacked and folded packages, Fujitsu’s eight-chip stacked package, Sanyo’s SiP, and Toshiba’s stacked MCP. With the continued close movement in assembly and test, a special section has been devoted to an in-depth review of trends in strip testing.
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Q1, 2002: BGA/CSP Development Update Service |
| File size: 26.7 kb |
Published: April 2002. |
| Table of Contents |
| 1 |
Digital Camcorders and Cameras |
| 1.1 |
Sony’s Newest Digital Camcorders |
| 1.2 |
Sony’s Cyber-shot Digital Still Camera |
| 2 |
Assembly Trends in Shanghai |
| 2.1 |
IC Fab Growth in Shanghai |
| 2.2 |
IC Package Assembly Services |
| 2.2.1 |
Amkor Technology, Inc. |
| 2.2.2 |
ChipPAC |
| 2.2.3 |
Global Advanced Packaging Technology |
| 2.2.4 |
Platane Microelectronics |
| 3 |
Taiwan IC Packaging Update |
| 3.1 |
Flip Chip Emerges |
| 3.1.1 |
ATI Technologies |
| 3.1.2 |
Advanced Chip Engineering Technology |
| 4 |
New Package Developments |
| 4.1 |
Intel Unveils New Stacked Memory Packages |
| 4.2 |
Toshiba Claims Smallest Stacked Package |
| 4.3 |
Fujitsu’s New Eight-chip Stacked Package |
| 4.4 |
Fujitsu’s LTCC Substrate Flip Chip BGA |
| 4.5 |
Sanyo’s Thin SiP |
| 5 |
Strip Testing Trends |
| 5.1 |
Strip Testing Implementation
Amkor, ASE, Carsem, Cypress Semiconductor, Intel, Motorola, National Semiconductor, STMicroelectronics, and Texas Instruments |
| 5.2 |
Strip Testing Equipment Suppliers |
| 5.2.1 |
ASM Pacific |
| 5.2.2 |
Delta Design |
| 5.2.3 |
FICO (Besi) |
| 5.2.4 |
Micro Component Technology, Inc. |
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| List of Figures |
| 1.1 |
Sony’s DCR-TRV-30 digital camcorder. |
| 1.2 |
Sony’s DCR-PC120 digital camcorder. |
| 1.3 |
Sony’s DCR-IP7 digital camcorder. |
| 1.4 |
Cyber-Shot DSC-P1 after FLEX-SIM assembly. |
| 1.5 |
Module on flex process (MOF). |
| 2.1 |
GAPT packaging roadmap. |
| 3.1 |
Taiwan packaging revenue and unit shipments. |
| 3.2 |
TSMC flip chip tape-outs. |
| 4.1 |
Intel’s four-die stacked package. |
| 4.2 |
Intel’s folded stacked CSP. |
| 4.3 |
Intel’s folded stacked CSP. |
| 4.4 |
Fujitsu’s new stacked package. |
| 4.5 |
Fujitsu’s FC-BGA with LTCC. |
| 4.6 |
Sanyo’s new package. |
| 5.1 |
Comparative process flow for strip testing. |
| 5.2 |
Existing manufacturing process for singulating CSPs before test. |
| 5.3 |
Throughput for multi-site testing in strips or individual units. |
| 5.4 |
Effect of strip-testing and test time on throughput. |
| 5.5 |
Strips and cassettes for strip testing. |
| 5.6 |
Panel of BGA parts with 256 devices. |
| 5.7 |
Strip of lead frame parts with 576 parts. |
| 5.8 |
ASM’s strip test handler. |
| 5.9 |
ASM’s pogo contactor. |
| 5.10 |
MCT’s Tapestry panel/strip handler. |
| List of Tables |
| 1.1 |
Digital Still Camera Model Comparison |
| 2.1 |
Shanghai Wafer Fabs |
| 2.2 |
GAPT Production Capacity |
| 5.1 |
Strip Test at Semiconductor Makers |
| 5.2 |
Strip Test at Subcontract Assembly Houses |
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