TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
Fourth Quarter, 2001
The fourth quarterly BGA/CSP update for 2001 features special coverage of the market forecast for BGAs and CSPs. Breakouts for CSP unit volumes of flex-based, rigid (laminate and ceramic) substrate, and lead frame type packages are included. The update provides a forecast for wafer level packages in number of wafers. BGA unit volumes are provided in PBGAs, TBGAs, and CBGAs/CCGAs with an additional category for Bluetooth“ type modules. Growth in the market is analyzed in light of the worldwide economic recession. Products using CSPs and BGAs are detailed, including numerous color photos, and major application areas. The update also gives an analysis of major device types and package choices. Highlighted are ASICs, programmable logic devices (PLDs), microprocessors, chipsets, graphics chips, and digital signal processors.
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Q4, 2001: BGA/CSP Development Update Service |
| File size: 26.8 kb |
Published: February 2002. |
| Table of Contents |
| 1 |
Recession Impacts 2001 BGA/CSP Market Numbers |
| 1.1 |
CSP Applications and Market Growth |
| 1.1.1 |
Mobile Phones: The Volume Application for CSPs |
| 1.1.2 |
PDAs/Handheld Computers |
| 1.1.3 |
Consumer Products: Digital Camcorders and Cameras Lead |
| 1.1.4 |
Wafer Level Packages |
| 1.2 |
CSP Market Projections |
| 1.3 |
BGA Applications and Market Growth |
| 1.3.1 |
Personal Computers |
| 1.3.2 |
Set Top Boxes/Game Machines |
| 1.3.3 |
Workstation/Servers, Network Systems, and Telecommunications |
| 1.3.4 |
BluetoothÒ Modules |
| 1.3.5 |
Military Electronics |
| 1.4 |
BGA Market Projections |
| 2 |
IC Package Trends |
| 2.1 |
ASICs and PLDs |
| 2.1.1 |
Altera |
| 2.1.2 |
LSI Logic |
| 2.1.3 |
NEC Electronics, Inc. |
| 2.1.4 |
Xilinx |
| 2.2 |
Microprocessors |
| 2.3 |
Chipsets and Graphics Chips |
| 2.4 |
Digital Signal Processors |
| 2.4.1 |
Motorola |
| 2.4.2 |
Texas Instruments |
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2001 BGA and CSP Bibliographies |
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| List of Figures |
| 1.1 |
Sharp’s four-chip stacked package. |
| 1.2 |
NTT DoCoMo i-Mode phone. |
| 1.3 |
NEC’s 3G mobile phone. |
| 1.4 |
NEC’s 3 chip stacked package. |
| 1.5 |
Wafer level package projections. |
| 1.6 |
Intel Pentium IV motherboard with PBGA chipset. |
| 1.7 |
NVIDIA’s GeForce4 Ti4600 graphics accelerator. |
| 1.8 |
Microsoft X-Box. |
| 1.9 |
NEC’s MCM for iPX7800 server. |
| 1.10 |
PowerPC-based MCP with flip chip. |
| 1.11 |
SDRAM multichip PBGA. |
| 2.1 |
Intel’s i850 chipset. |
| List of Tables |
| 1.1 |
CSP Market Projections |
| 1.2 |
PBGAs in Personal Computers |
| 1.3 |
BGA Market Projection |
| 2.1 |
Characteristics of BGA Packages for ASICs and PLDs |
| 2.2 |
CSPs for ASICs and PLDs |
| 2.3 |
BGA and CSP in Production at Altera |
| 2.4 |
BGA and CSPs Offered by LSI Logic |
| 2.5 |
BGA and CSPs Offered by NEC |
| 2.6 |
BGA and CSPs Offered by Xilinx |
| 2.7 |
Power PC Products |
| 2.8 |
AMD’s Chipsets |
| 2.9 |
BGA Packages for TI’s C6000 High-Performance DSP Platform |
| 2.10 |
BGA Packages for TI’s C5000 Low-Power DSP Platform |
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